DE602005018307D1 - Klemmvorrichtung für einen Tragebehälter für dünne Platten - Google Patents

Klemmvorrichtung für einen Tragebehälter für dünne Platten

Info

Publication number
DE602005018307D1
DE602005018307D1 DE602005018307T DE602005018307T DE602005018307D1 DE 602005018307 D1 DE602005018307 D1 DE 602005018307D1 DE 602005018307 T DE602005018307 T DE 602005018307T DE 602005018307 T DE602005018307 T DE 602005018307T DE 602005018307 D1 DE602005018307 D1 DE 602005018307D1
Authority
DE
Germany
Prior art keywords
carrier
clamping device
thin plates
plates
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005018307T
Other languages
English (en)
Inventor
Tadahiro Obayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of DE602005018307D1 publication Critical patent/DE602005018307D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE602005018307T 2004-10-14 2005-10-12 Klemmvorrichtung für einen Tragebehälter für dünne Platten Active DE602005018307D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004300578A JP4373316B2 (ja) 2004-10-14 2004-10-14 薄板支持容器用クランプ装置

Publications (1)

Publication Number Publication Date
DE602005018307D1 true DE602005018307D1 (de) 2010-01-28

Family

ID=35708617

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005018307T Active DE602005018307D1 (de) 2004-10-14 2005-10-12 Klemmvorrichtung für einen Tragebehälter für dünne Platten

Country Status (7)

Country Link
US (1) US7665787B2 (de)
EP (1) EP1648026B1 (de)
JP (1) JP4373316B2 (de)
KR (1) KR101145063B1 (de)
CN (1) CN100472745C (de)
DE (1) DE602005018307D1 (de)
TW (1) TWI384580B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4842879B2 (ja) * 2007-04-16 2011-12-21 信越ポリマー株式会社 基板収納容器及びそのハンドル
JP2011203309A (ja) * 2010-03-24 2011-10-13 Shin-Etsu Chemical Co Ltd ペリクルの収納容器およびペリクル収納容器の搬送用台車
JP5676168B2 (ja) * 2010-07-14 2015-02-25 株式会社ディスコ 研削装置
JP5565389B2 (ja) 2011-07-29 2014-08-06 Ｔｄｋ株式会社 ロードポート装置及び当該装置に用いられるクランプ装置
US8915368B2 (en) * 2012-09-20 2014-12-23 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD glass substrate storage tray
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6502878B2 (ja) * 2016-03-01 2019-04-17 株式会社スギノマシン ハンドストッカおよびハンド
KR101924185B1 (ko) 2018-06-15 2018-11-30 주식회사 싸이맥스 클램프가 장착된 로드포트모듈
KR102126466B1 (ko) * 2018-09-27 2020-06-24 크린팩토메이션 주식회사 이에프이엠
JP7127731B2 (ja) * 2019-02-22 2022-08-30 村田機械株式会社 蓋開閉装置
KR102418353B1 (ko) * 2020-03-31 2022-07-06 미라이얼 가부시키가이샤 기판수납용기
TWI772886B (zh) * 2020-09-11 2022-08-01 樂華科技股份有限公司 智慧堆疊機構之解鎖裝置及其方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995430A (en) * 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5469963A (en) * 1992-04-08 1995-11-28 Asyst Technologies, Inc. Sealable transportable container having improved liner
US5451131A (en) * 1992-06-19 1995-09-19 International Business Machines Corporation Dockable interface airlock between process enclosure and interprocess transfer container
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system
EP1248288A1 (de) * 1999-12-16 2002-10-09 Nikon Corporation Belichtungsmethode und belichtungsapparat
US6676356B2 (en) * 2000-09-18 2004-01-13 Tokyo Electron Limited Device for attaching target substrate transfer container to semiconductor processing apparatus
JP4555918B2 (ja) 2000-09-18 2010-10-06 東京エレクトロン株式会社 ウェハ搬送容器装着装置
US20030029479A1 (en) * 2001-08-08 2003-02-13 Dainippon Screen Mfg. Co, Ltd. Substrate cleaning apparatus and method
JP2003059885A (ja) 2001-08-08 2003-02-28 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6927505B2 (en) * 2001-12-19 2005-08-09 Nikon Corporation Following stage planar motor
US20030169412A1 (en) * 2002-03-08 2003-09-11 Hazelton Andrew J. Reaction frame for a wafer scanning stage with electromagnetic connections to ground
JP4105883B2 (ja) 2002-04-01 2008-06-25 日本電産サンキョー株式会社 Ｆｏｕｐクランプ機構
US6595075B1 (en) * 2002-05-06 2003-07-22 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for testing cassette pod door
US7621714B2 (en) * 2003-10-23 2009-11-24 Tdk Corporation Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit
US7433050B2 (en) * 2005-10-05 2008-10-07 Nikon Corporation Exposure apparatus and exposure method

Also Published As

Publication number Publication date
EP1648026B1 (de) 2009-12-16
US7665787B2 (en) 2010-02-23
US20060081498A1 (en) 2006-04-20
KR20060052190A (ko) 2006-05-19
EP1648026A2 (de) 2006-04-19
CN1761045A (zh) 2006-04-19
TW200618160A (en) 2006-06-01
KR101145063B1 (ko) 2012-05-11
TWI384580B (zh) 2013-02-01
EP1648026A3 (de) 2006-08-02
JP2006114699A (ja) 2006-04-27
CN100472745C (zh) 2009-03-25
JP4373316B2 (ja) 2009-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition