DE60328447D1 - Behälter für dünne Platten - Google Patents

Behälter für dünne Platten

Info

Publication number
DE60328447D1
DE60328447D1 DE60328447T DE60328447T DE60328447D1 DE 60328447 D1 DE60328447 D1 DE 60328447D1 DE 60328447 T DE60328447 T DE 60328447T DE 60328447 T DE60328447 T DE 60328447T DE 60328447 D1 DE60328447 D1 DE 60328447D1
Authority
DE
Germany
Prior art keywords
container
thin plates
plates
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60328447T
Other languages
English (en)
Inventor
Chiaki Matsutori
Takaharu Oyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002349457A external-priority patent/JP4150578B2/ja
Priority claimed from JP2003035062A external-priority patent/JP4133407B2/ja
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Application granted granted Critical
Publication of DE60328447D1 publication Critical patent/DE60328447D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
DE60328447T 2002-12-02 2003-11-27 Behälter für dünne Platten Expired - Lifetime DE60328447D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002349457A JP4150578B2 (ja) 2002-12-02 2002-12-02 薄板収納容器
JP2003035062A JP4133407B2 (ja) 2003-02-13 2003-02-13 薄板収納容器

Publications (1)

Publication Number Publication Date
DE60328447D1 true DE60328447D1 (de) 2009-09-03

Family

ID=32314108

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60328447T Expired - Lifetime DE60328447D1 (de) 2002-12-02 2003-11-27 Behälter für dünne Platten
DE60335969T Expired - Lifetime DE60335969D1 (de) 2002-12-02 2003-11-27 Lagerbehälter für dünne Platten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60335969T Expired - Lifetime DE60335969D1 (de) 2002-12-02 2003-11-27 Lagerbehälter für dünne Platten

Country Status (5)

Country Link
US (2) US7017750B2 (de)
EP (2) EP2048694B1 (de)
KR (3) KR100995446B1 (de)
DE (2) DE60328447D1 (de)
TW (2) TWI283038B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239931B (en) * 2003-05-19 2005-09-21 Miraial Co Ltd Lid unit for thin plate supporting container and thin plate supporting container
US7347329B2 (en) * 2003-10-24 2008-03-25 Entegris, Inc. Substrate carrier
JP4681221B2 (ja) 2003-12-02 2011-05-11 ミライアル株式会社 薄板支持容器
US7523830B2 (en) * 2004-11-23 2009-04-28 Entegris, Inc. Wafer container with secondary wafer restraint system
US8365919B2 (en) * 2005-12-29 2013-02-05 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US7967147B2 (en) * 2006-11-07 2011-06-28 Shin-Etsu Polymer Co., Ltd. Substrate storage container
TWI308550B (en) * 2006-12-29 2009-04-11 Ind Tech Res Inst A clean container with elastic fixing structure
US20080157455A1 (en) * 2006-12-29 2008-07-03 Applied Materials, Inc. Compliant substrate holding assembly
JP4842879B2 (ja) * 2007-04-16 2011-12-21 信越ポリマー株式会社 基板収納容器及びそのハンドル
US20110005967A1 (en) * 2008-01-13 2011-01-13 Entegris, Inc. Methods and apparatuses for large diameter wafer handling
TWI337162B (en) * 2008-07-31 2011-02-11 Gudeng Prec Industral Co Ltd A wafer container with constraints
US7971722B2 (en) * 2008-08-08 2011-07-05 Gudeng Precision Industral Co, Ltd Wafer container with restrainer
TWI400766B (zh) * 2008-08-27 2013-07-01 Gudeng Prec Industral Co Ltd 具一體成形晶圓限制件模組之前開式晶圓盒
TW201010916A (en) * 2008-09-12 2010-03-16 Gudeng Prec Industral Co Ltd Wafer container with roller
TWI343353B (en) * 2008-11-04 2011-06-11 Gudeng Prec Industral Co Ltd A wafer container having the snap-fitting constraint module
JP2011018771A (ja) * 2009-07-09 2011-01-27 Shin Etsu Polymer Co Ltd 基板収納容器
JP5980787B2 (ja) * 2010-10-19 2016-08-31 インテグリス・インコーポレーテッド ロボットフランジを有する前面開口ウェーハ容器
US9673075B2 (en) 2010-10-20 2017-06-06 Entegris, Inc. Wafer container with door guide and seal
US9312157B2 (en) * 2011-08-12 2016-04-12 Entegris, Inc. Wafer carrier
TW201422501A (zh) * 2012-12-04 2014-06-16 Tian-Sing Huang 晶圓承載裝置及其應用
KR102223033B1 (ko) 2014-04-29 2021-03-04 삼성전자주식회사 웨이퍼 수납장치
KR101637498B1 (ko) 2015-03-24 2016-07-07 피코앤테라(주) 웨이퍼 수납용기
US20190090691A1 (en) * 2017-08-25 2019-03-28 Franke Foodservice Systems, Inc. Product dispenser and lift unit
JP7445741B2 (ja) * 2019-07-19 2024-03-07 インテグリス・インコーポレーテッド ウェハクッション、ウェハキャリアおよびウェハを支持する方法
TWI728858B (zh) * 2020-07-07 2021-05-21 頎邦科技股份有限公司 電子元件儲存盒

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520934A (en) * 1984-03-19 1985-06-04 Seiichiro Aigo Cradle for semiconductor element carrier
US5207324A (en) * 1991-03-08 1993-05-04 Fluoroware, Inc. Wafer cushion for shippers
US5253755A (en) 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container
US5248033A (en) * 1991-05-14 1993-09-28 Fluoroware, Inc. Hinged tilt box with inclined portion
US5609376A (en) * 1995-09-08 1997-03-11 Micron Technology, Inc. Wafer carrier handle assembly
WO1997013710A1 (en) 1995-10-13 1997-04-17 Empak, Inc. 300mm MICROENVIRONMENT POD WITH DOOR ON SIDE
US5873468A (en) 1995-11-16 1999-02-23 Sumitomo Sitix Corporation Thin-plate supporting container with filter means
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
US6776289B1 (en) * 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
US5823593A (en) * 1997-06-09 1998-10-20 Advanced Micro Devices, Inc. Device for lifting wafer cassettes from a spraying tool
US6736268B2 (en) * 1997-07-11 2004-05-18 Entegris, Inc. Transport module
JP3838786B2 (ja) 1997-09-30 2006-10-25 信越ポリマー株式会社 精密基板収納容器及びその位置決め構造並びに精密基板収納容器の位置決め方法
US6474474B2 (en) * 1998-02-06 2002-11-05 Sumitomo Metal Industries, Ltd. Sheet support container
EP0987750B1 (de) * 1998-04-06 2006-11-15 Dainichi Shoji K.K. Behälter
JP3556480B2 (ja) * 1998-08-17 2004-08-18 信越ポリマー株式会社 精密基板収納容器
JP4208303B2 (ja) 1998-09-08 2009-01-14 信越ポリマー株式会社 精密基板収納容器及びその組立方法
JP3998354B2 (ja) 1998-11-24 2007-10-24 信越ポリマー株式会社 輸送容器及びその蓋体の開閉方法並びにその蓋体の開閉装置
US6464081B2 (en) 1999-01-06 2002-10-15 Entegris, Inc. Door guide for a wafer container
US6206196B1 (en) 1999-01-06 2001-03-27 Fluoroware, Inc. Door guide for a wafer container
JP3916342B2 (ja) * 1999-04-20 2007-05-16 信越ポリマー株式会社 基板収納容器
JP4372313B2 (ja) 2000-06-20 2009-11-25 信越ポリマー株式会社 基板収納容器
JP3974344B2 (ja) 2001-03-29 2007-09-12 信越ポリマー株式会社 精密基板収納容器及びその製造方法
JP3942379B2 (ja) 2001-05-22 2007-07-11 信越ポリマー株式会社 精密基板収納容器の位置決め部材
JP4596681B2 (ja) 2001-05-23 2010-12-08 信越ポリマー株式会社 収納容器とその製造方法
JP3938293B2 (ja) 2001-05-30 2007-06-27 信越ポリマー株式会社 精密基板収納容器及びその押さえ部材
JP4049551B2 (ja) 2001-06-07 2008-02-20 信越ポリマー株式会社 収納容器の蓋体
US6923325B2 (en) * 2001-07-12 2005-08-02 Entegris, Inc. Horizontal cassette
TWI233912B (en) * 2001-08-27 2005-06-11 Entegris Inc Modular carrier system for housing semiconductor wafer disks and similar inventory, and method of manufacturing the same
WO2003042059A1 (en) * 2001-11-14 2003-05-22 Entegris, Inc. Wafer enclosure sealing arrangement for wafer containers
KR100443771B1 (ko) * 2002-01-28 2004-08-09 삼성전자주식회사 작업물 수납 용기 및 작업물 수납 용기의 개폐 장치

Also Published As

Publication number Publication date
TW200410797A (en) 2004-07-01
US20040099569A1 (en) 2004-05-27
EP2048694A1 (de) 2009-04-15
KR100995446B1 (ko) 2010-11-18
KR20100089046A (ko) 2010-08-11
KR20040048354A (ko) 2004-06-09
TWI283038B (en) 2007-06-21
KR101052647B1 (ko) 2011-07-28
EP1426999A1 (de) 2004-06-09
KR20100089047A (ko) 2010-08-11
DE60335969D1 (de) 2011-03-17
US20060027477A1 (en) 2006-02-09
EP1426999B1 (de) 2009-07-22
TWI283621B (en) 2007-07-11
KR100989718B1 (ko) 2010-10-26
US7216766B2 (en) 2007-05-15
US7017750B2 (en) 2006-03-28
EP2048694B1 (de) 2011-02-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition