DE602006002185D1 - Einspannvorrichtungseinheit zum Elektroplattieren - Google Patents

Einspannvorrichtungseinheit zum Elektroplattieren

Info

Publication number
DE602006002185D1
DE602006002185D1 DE602006002185T DE602006002185T DE602006002185D1 DE 602006002185 D1 DE602006002185 D1 DE 602006002185D1 DE 602006002185 T DE602006002185 T DE 602006002185T DE 602006002185 T DE602006002185 T DE 602006002185T DE 602006002185 D1 DE602006002185 D1 DE 602006002185D1
Authority
DE
Germany
Prior art keywords
electroplating
clamping device
device unit
unit
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006002185T
Other languages
English (en)
Inventor
Wataru Yamamoto
Katsunori Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamamoto MS Co Ltd
Original Assignee
Yamamoto MS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamamoto MS Co Ltd filed Critical Yamamoto MS Co Ltd
Publication of DE602006002185D1 publication Critical patent/DE602006002185D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE602006002185T 2005-06-20 2006-05-16 Einspannvorrichtungseinheit zum Elektroplattieren Active DE602006002185D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005179358A JP2006348373A (ja) 2005-06-20 2005-06-20 電気めっき用治具

Publications (1)

Publication Number Publication Date
DE602006002185D1 true DE602006002185D1 (de) 2008-09-25

Family

ID=36754171

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006002185T Active DE602006002185D1 (de) 2005-06-20 2006-05-16 Einspannvorrichtungseinheit zum Elektroplattieren

Country Status (7)

Country Link
US (1) US7780824B2 (de)
EP (1) EP1736569B1 (de)
JP (1) JP2006348373A (de)
KR (1) KR100996986B1 (de)
CN (1) CN1908247B (de)
DE (1) DE602006002185D1 (de)
TW (1) TW200700586A (de)

Families Citing this family (35)

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EP2123415B1 (de) * 2007-03-20 2015-07-08 NGK Insulators, Ltd. Eine Öl beseitigende Spannvorrichtung verwendendes Verfahren zur Herstellung eines Formkörpers
KR100968195B1 (ko) 2008-05-27 2010-07-07 한국기계연구원 도금 장비용 웨이퍼 지그
JP4939484B2 (ja) * 2008-05-30 2012-05-23 株式会社山本鍍金試験器 電気めっき用陰極カートリッジ
DE102008056093B3 (de) * 2008-11-06 2010-06-10 Solarworld Innovations Gmbh Verfahren und Vorrichtung zum lichtinduzierten Galvanisieren von Halbleiter-Bauelementen und Halbleiter-Bauelement
JP2011021249A (ja) * 2009-07-16 2011-02-03 National Institute For Materials Science 陽極酸化用治具とナノ加工方法
JP5630000B2 (ja) * 2009-10-22 2014-11-26 大森ハンガー工業株式会社 メッキ用基板保持具
CN101913003A (zh) * 2010-07-14 2010-12-15 哈尔滨工业大学 微细阵列孔在线卧式电火花加工的专用夹具
CN101890547B (zh) * 2010-08-06 2012-05-30 上海交通大学 集束成形电极夹持装置
US8317987B2 (en) * 2010-09-23 2012-11-27 Sunpower Corporation Non-permeable substrate carrier for electroplating
US9464362B2 (en) * 2012-07-18 2016-10-11 Deca Technologies Inc. Magnetically sealed wafer plating jig system and method
CN103132123B (zh) * 2011-11-29 2015-08-26 北京有色金属研究总院 一种软质材料镀件基体的固定夹具
US20130228460A1 (en) * 2012-03-01 2013-09-05 Han-Yun Tsai Holder for workpieces to be electroplated
TWI496958B (zh) * 2012-03-09 2015-08-21 Wistron Neweb Corp 對特定位置進行電鍍之電鍍治具、配合此電鍍治具之電鍍方法及由此電鍍方法所製出之不具防鍍層之被電鍍物產品
JP6226229B2 (ja) * 2013-08-19 2017-11-08 株式会社山本鍍金試験器 めっき装置及びこれを用いたセンサ装置
KR101581276B1 (ko) 2014-09-26 2016-01-04 주식회사 티케이씨 박형화 웨이퍼의 도금시 에지 부분의 손상 방지를 위한 웨이퍼 취급장치
CN104357885A (zh) * 2014-10-15 2015-02-18 中航飞机股份有限公司西安飞机分公司 一种轴类零件局部电镀铬的保护方法
KR102250050B1 (ko) * 2015-02-06 2021-05-11 삼성디스플레이 주식회사 전기도금용 지그 및 이를 이용한 도금물 제조 방법
US10174437B2 (en) 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
WO2017092029A1 (en) * 2015-12-04 2017-06-08 Acm Research (Shanghai) Inc. Apparatus for holding substrate
EP3437123A1 (de) * 2016-03-30 2019-02-06 Corning Incorporated Verfahren zur metallisierung von durchkontaktierungen in einem substrat
KR102047093B1 (ko) * 2017-11-16 2019-11-21 주식회사 티케이씨 인쇄회로기판의 도금편차 개선을 위한 지그장치
CN107817150A (zh) * 2017-12-06 2018-03-20 岭南师范学院 一种曲率法残余应力测试试样制备的装置及其方法
CN108048887A (zh) * 2018-01-16 2018-05-18 昆山成功环保科技有限公司 一种晶圆电镀治具
US11598018B2 (en) 2018-03-30 2023-03-07 Sunpower Corporation Dual wafer plating fixture for a continuous plating line
CN110359079A (zh) * 2018-04-10 2019-10-22 中国科学院半导体研究所 电镀夹具
TWI641079B (zh) * 2018-04-11 2018-11-11 姜力 Wafer fixture for electroplating equipment
US11187602B2 (en) 2018-07-15 2021-11-30 Taiwan Semiconductor Manufacturing Co., Ltd. Device and method for pressure force inspection
CN109457284B (zh) * 2018-12-27 2019-12-10 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 半导体晶圆电镀夹具
CN109763166A (zh) * 2019-03-07 2019-05-17 苏州热工研究院有限公司 适用于金属样品电解抛光的装置
KR102292120B1 (ko) 2019-10-21 2021-08-20 주식회사 원테크 길이 및 각도 조절이 용이한 도금용 지그
CN110886003B (zh) * 2019-12-06 2021-03-23 隆鑫通用动力股份有限公司 用于缸体槽外电镀的屏蔽构造
TWI764446B (zh) * 2020-12-17 2022-05-11 善統工業股份有限公司 可精進金屬物件陽極處理設備的治具
CN113235151A (zh) * 2021-05-13 2021-08-10 苏州施密科微电子设备有限公司 一种8寸快拆式电镀夹具
CN113882004B (zh) * 2021-10-28 2023-04-21 京东方科技集团股份有限公司 基板载具和电化学沉积设备
CN115896881B (zh) * 2022-11-17 2023-06-13 安徽建筑大学 可防止偏移的半导体晶圆片电镀系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0283681B1 (de) * 1987-02-23 1992-05-06 Siemens Aktiengesellschaft Galvanisiereinrichtung zur Erzeugung von Höckern auf Chip-Bauelementen
JPH03109711U (de) 1991-01-08 1991-11-11
JPH05271990A (ja) 1992-03-23 1993-10-19 Ngk Insulators Ltd 半導体素子収納用パッケージのメッキ用治具およびそれを用いるメッキ方法
JPH0766321A (ja) 1993-08-24 1995-03-10 Shinko Electric Ind Co Ltd 半導体装置用パッケージの電解めっき方法とそれに用いるめっき治具
JPH10233400A (ja) 1997-02-18 1998-09-02 Casio Comput Co Ltd 被メッキ部品固定治具およびそれを用いたメッキ方法
JPH11200096A (ja) 1997-11-06 1999-07-27 Ebara Corp ウエハのメッキ用治具
CN2311694Y (zh) * 1997-11-25 1999-03-24 江阴经伟电子有限公司 夹式固定座
US7022211B2 (en) * 2000-01-31 2006-04-04 Ebara Corporation Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
US6627052B2 (en) * 2000-12-12 2003-09-30 International Business Machines Corporation Electroplating apparatus with vertical electrical contact
JP3588777B2 (ja) 2002-04-12 2004-11-17 株式会社山本鍍金試験器 電気めっき試験器の陰極カートリッジ
JP3827627B2 (ja) * 2002-08-13 2006-09-27 株式会社荏原製作所 めっき装置及びめっき方法
JP2004140129A (ja) 2002-10-17 2004-05-13 Renesas Technology Corp 絶縁膜の欠陥検出方法及びその装置
JP4104465B2 (ja) 2003-01-15 2008-06-18 株式会社荏原製作所 電解めっき装置

Also Published As

Publication number Publication date
CN1908247B (zh) 2011-03-16
JP2006348373A (ja) 2006-12-28
CN1908247A (zh) 2007-02-07
KR20060133481A (ko) 2006-12-26
TW200700586A (en) 2007-01-01
KR100996986B1 (ko) 2010-11-26
US20060283704A1 (en) 2006-12-21
EP1736569B1 (de) 2008-08-13
EP1736569A1 (de) 2006-12-27
US7780824B2 (en) 2010-08-24

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Legal Events

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