JP2006113538A - プラズマディスプレイ装置 - Google Patents
プラズマディスプレイ装置 Download PDFInfo
- Publication number
- JP2006113538A JP2006113538A JP2005172634A JP2005172634A JP2006113538A JP 2006113538 A JP2006113538 A JP 2006113538A JP 2005172634 A JP2005172634 A JP 2005172634A JP 2005172634 A JP2005172634 A JP 2005172634A JP 2006113538 A JP2006113538 A JP 2006113538A
- Authority
- JP
- Japan
- Prior art keywords
- plasma display
- circuit module
- chassis base
- integrated circuit
- reinforcing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/16—Vessels; Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
【解決手段】 本発明によるプラズマディスプレイ装置は、プラズマディスプレイパネルと、前記プラズマディスプレイパネルがその一端に付着され、プラズマディスプレイパネルを支持するシャーシベースと、前記シャーシベースに装着される駆動回路基板に形成されて、プラズマディスプレイパネルを制御する集積回路モジュールと、を含み、前記集積回路モジュールの一側面が前記シャーシベースに形成される補強部材に接触する。
【選択図】 図2
Description
13 放熱シート
15 駆動回路基板
17 シャーシベース
18 ボス
19 セットスクリュー
21 ハイブリッドサーキットモジュール
23 補強部材
25 熱伝導物質層
Claims (11)
- プラズマディスプレイパネルと、
前記プラズマディスプレイパネルがその一端に付着され、前記プラズマディスプレイパネルを支持するシャーシベースと、
前記シャーシベースに装着される駆動回路基板に形成されて、プラズマディスプレイパネルを制御する集積回路モジュールと、を含み、
前記集積回路モジュールの一側面が前記シャーシベースに形成される補強部材と接触するように形成される、プラズマディスプレイ装置。 - 前記集積回路モジュールはハイブリッド集積回路モジュールである、請求項1に記載のプラズマディスプレイ装置。
- 前記集積回路モジュールは知能型パワーモジュールである、請求項1に記載のプラズマディスプレイ装置。
- 前記駆動回路基板は、前記集積回路モジュールに対向する部分に形成される貫通ホールを含む、請求項1に記載のプラズマディスプレイ装置。
- 前記集積回路モジュールは、前記駆動回路基板のうち、シャーシベースの反対側に装着されて、前記貫通ホールを通じて前記補強部材と接触する、請求項4に記載のプラズマディスプレイ装置。
- 前記集積回路モジュール及び補強部材の間には熱伝導物質層が介在する、請求項5に記載のプラズマディスプレイ装置。
- 前記熱伝導物質層はグリースまたはシリコンシートで形成される、請求項6に記載のプラズマディスプレイ装置。
- 前記補強部材は、前記シャーシベースに対向する部分に形成された複数の放熱部を含む、請求項5に記載のプラズマディスプレイ装置。
- 前記集積回路モジュールは、前記駆動回路基板のうち、シャーシベースに対向する部分に装着される、請求項1に記載のプラズマディスプレイ装置。
- 前記集積回路モジュール及び補強部材の間には熱伝導物質層が介在する、請求項9に記載のプラズマディスプレイ装置。
- 前記補強部材は、前記シャーシベースに対向する部分に形成された複数の放熱部を含む、請求項9に記載のプラズマディスプレイ装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040080872A KR100669327B1 (ko) | 2004-10-11 | 2004-10-11 | 플라즈마 디스플레이 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006113538A true JP2006113538A (ja) | 2006-04-27 |
JP4206402B2 JP4206402B2 (ja) | 2009-01-14 |
Family
ID=36145001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005172634A Expired - Fee Related JP4206402B2 (ja) | 2004-10-11 | 2005-06-13 | プラズマディスプレイ装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7391616B2 (ja) |
JP (1) | JP4206402B2 (ja) |
KR (1) | KR100669327B1 (ja) |
CN (1) | CN100489921C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010007827A1 (ja) * | 2008-07-15 | 2010-01-21 | シャープ株式会社 | 補強フレーム、部品ユニット、および表示装置 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100669327B1 (ko) * | 2004-10-11 | 2007-01-15 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100670273B1 (ko) * | 2005-01-18 | 2007-01-16 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치용 방열 조립체 및 이를구비하는 플라즈마 디스플레이 장치 |
KR100751327B1 (ko) * | 2005-03-09 | 2007-08-22 | 삼성에스디아이 주식회사 | 샤시 베이스 조립체와, 이를 적용한 평판 표시 장치 |
KR100709181B1 (ko) * | 2005-04-26 | 2007-04-18 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP2006339223A (ja) * | 2005-05-31 | 2006-12-14 | Toshiba Tec Corp | Cpuの放熱構造 |
KR20060126317A (ko) * | 2005-06-04 | 2006-12-07 | 삼성에스디아이 주식회사 | 플라즈마 표시 장치 |
KR100649216B1 (ko) * | 2005-07-21 | 2006-11-24 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100709197B1 (ko) * | 2005-10-18 | 2007-04-18 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 및 보강 부재 |
KR100807027B1 (ko) * | 2006-10-13 | 2008-02-25 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR20090036853A (ko) * | 2007-10-10 | 2009-04-15 | 삼성에스디아이 주식회사 | 회로기판 조립체 및 이를 구비하는 플라즈마 디스플레이장치 |
KR20090123221A (ko) * | 2008-05-27 | 2009-12-02 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
US20100103622A1 (en) * | 2008-10-24 | 2010-04-29 | Keihin Corporation | Electronic control device |
CN102375514A (zh) * | 2010-08-19 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 电子装置 |
KR101450950B1 (ko) * | 2011-10-04 | 2014-10-16 | 엘지디스플레이 주식회사 | 드라이버 패키지 |
US9357677B2 (en) * | 2012-09-26 | 2016-05-31 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device with efficient heat radiation structure for electronic components |
US10303227B2 (en) * | 2013-02-27 | 2019-05-28 | Dell Products L.P. | Information handling system housing heat spreader |
JP6315919B2 (ja) * | 2013-08-08 | 2018-04-25 | コイト電工株式会社 | 電子部品ユニット |
DE102015001148B4 (de) * | 2015-01-30 | 2019-04-11 | e.solutions GmbH | Anordnung und Verfahren zur elektromagnetischen Abschirmung |
US10206310B2 (en) * | 2017-04-07 | 2019-02-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronics assemblies incorporating three-dimensional heat flow structures |
US10470321B1 (en) * | 2017-12-22 | 2019-11-05 | Rockwell Collins, Inc. | Reinforced emissive display assembly |
KR20220045479A (ko) * | 2020-10-05 | 2022-04-12 | 삼성전자주식회사 | 디스플레이 장치 |
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-
2004
- 2004-10-11 KR KR1020040080872A patent/KR100669327B1/ko not_active IP Right Cessation
-
2005
- 2005-06-13 JP JP2005172634A patent/JP4206402B2/ja not_active Expired - Fee Related
- 2005-07-06 US US11/174,734 patent/US7391616B2/en not_active Expired - Fee Related
- 2005-08-02 CN CNB2005100891191A patent/CN100489921C/zh not_active Expired - Fee Related
-
2008
- 2008-04-17 US US12/081,593 patent/US20080232052A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010007827A1 (ja) * | 2008-07-15 | 2010-01-21 | シャープ株式会社 | 補強フレーム、部品ユニット、および表示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN100489921C (zh) | 2009-05-20 |
US20060077619A1 (en) | 2006-04-13 |
KR100669327B1 (ko) | 2007-01-15 |
US20080232052A1 (en) | 2008-09-25 |
CN1760938A (zh) | 2006-04-19 |
KR20060031906A (ko) | 2006-04-14 |
US7391616B2 (en) | 2008-06-24 |
JP4206402B2 (ja) | 2009-01-14 |
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