JP2006080470A5 - - Google Patents

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Publication number
JP2006080470A5
JP2006080470A5 JP2004266125A JP2004266125A JP2006080470A5 JP 2006080470 A5 JP2006080470 A5 JP 2006080470A5 JP 2004266125 A JP2004266125 A JP 2004266125A JP 2004266125 A JP2004266125 A JP 2004266125A JP 2006080470 A5 JP2006080470 A5 JP 2006080470A5
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JP
Japan
Prior art keywords
electrode
bump
bumps
substrate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004266125A
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English (en)
Japanese (ja)
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JP4154379B2 (ja
JP2006080470A (ja
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Publication date
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Priority to JP2004266125A priority Critical patent/JP4154379B2/ja
Priority claimed from JP2004266125A external-priority patent/JP4154379B2/ja
Publication of JP2006080470A publication Critical patent/JP2006080470A/ja
Publication of JP2006080470A5 publication Critical patent/JP2006080470A5/ja
Application granted granted Critical
Publication of JP4154379B2 publication Critical patent/JP4154379B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004266125A 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体 Expired - Fee Related JP4154379B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004266125A JP4154379B2 (ja) 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004266125A JP4154379B2 (ja) 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体

Publications (3)

Publication Number Publication Date
JP2006080470A JP2006080470A (ja) 2006-03-23
JP2006080470A5 true JP2006080470A5 (https=) 2007-03-08
JP4154379B2 JP4154379B2 (ja) 2008-09-24

Family

ID=36159644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004266125A Expired - Fee Related JP4154379B2 (ja) 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体

Country Status (1)

Country Link
JP (1) JP4154379B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100846569B1 (ko) * 2006-06-14 2008-07-15 매그나칩 반도체 유한회사 Ｍｅｍｓ 소자의 패키지 및 그 제조방법
DE102009046687A1 (de) * 2009-11-13 2011-05-19 Robert Bosch Gmbh Mikromechanisches Verfahren und entsprechende Anordnung zum Bonden von Halbleitersubstraten sowie entsprechender gebondeter Halbleitechip
DE112018007290T5 (de) * 2018-03-16 2020-12-10 Mitsubishi Electric Corporation Substrat-Bondingstruktur und Substrat-Bondingverfahren
EP3708532B1 (en) * 2019-03-15 2024-09-25 Infineon Technologies AG Mems device and method for producing the same

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