JP4154379B2 - 基板間の電極間接合方法及び構造体 - Google Patents

基板間の電極間接合方法及び構造体 Download PDF

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Publication number
JP4154379B2
JP4154379B2 JP2004266125A JP2004266125A JP4154379B2 JP 4154379 B2 JP4154379 B2 JP 4154379B2 JP 2004266125 A JP2004266125 A JP 2004266125A JP 2004266125 A JP2004266125 A JP 2004266125A JP 4154379 B2 JP4154379 B2 JP 4154379B2
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bump
stopper
electrode
reinforcing
substrate
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Expired - Fee Related
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Japanese (ja)
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JP2006080470A (ja
JP2006080470A5 (https=
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正剛 赤池
治人 小野
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Canon Inc
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Canon Inc
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  • Wire Bonding (AREA)
JP2004266125A 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体 Expired - Fee Related JP4154379B2 (ja)

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JP2004266125A JP4154379B2 (ja) 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体

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JP2004266125A JP4154379B2 (ja) 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体

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JP2006080470A JP2006080470A (ja) 2006-03-23
JP2006080470A5 JP2006080470A5 (https=) 2007-03-08
JP4154379B2 true JP4154379B2 (ja) 2008-09-24

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JP2004266125A Expired - Fee Related JP4154379B2 (ja) 2004-09-13 2004-09-13 基板間の電極間接合方法及び構造体

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102666368A (zh) * 2009-11-13 2012-09-12 罗伯特·博世有限公司 用于半导体衬底接合的微机械方法和相应的装置以及相应的接合的半导体芯片

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100846569B1 (ko) * 2006-06-14 2008-07-15 매그나칩 반도체 유한회사 Ｍｅｍｓ 소자의 패키지 및 그 제조방법
DE112018007290T5 (de) * 2018-03-16 2020-12-10 Mitsubishi Electric Corporation Substrat-Bondingstruktur und Substrat-Bondingverfahren
EP3708532B1 (en) * 2019-03-15 2024-09-25 Infineon Technologies AG Mems device and method for producing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102666368A (zh) * 2009-11-13 2012-09-12 罗伯特·博世有限公司 用于半导体衬底接合的微机械方法和相应的装置以及相应的接合的半导体芯片

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JP2006080470A (ja) 2006-03-23

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