JP2006080409A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 80
- 239000010703 silicon Substances 0.000 claims abstract description 80
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 46
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 46
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 34
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 79
- 239000000758 substrate Substances 0.000 claims description 63
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 12
- 230000001590 oxidative effect Effects 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 229910052726 zirconium Inorganic materials 0.000 claims description 9
- 229910052735 hafnium Inorganic materials 0.000 claims description 8
- 229910052715 tantalum Inorganic materials 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 229920005591 polysilicon Polymers 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 abstract description 33
- 238000009792 diffusion process Methods 0.000 abstract description 19
- 230000015572 biosynthetic process Effects 0.000 abstract description 12
- 238000006243 chemical reaction Methods 0.000 abstract description 11
- 229910021332 silicide Inorganic materials 0.000 abstract description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000470 constituent Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 223
- 238000005755 formation reaction Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 238000004151 rapid thermal annealing Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 238000001451 molecular beam epitaxy Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 238000000608 laser ablation Methods 0.000 description 5
- 238000000026 X-ray photoelectron spectrum Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 229910004129 HfSiO Inorganic materials 0.000 description 3
- 238000003917 TEM image Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910003855 HfAlO Inorganic materials 0.000 description 1
- 229910003839 Hf—Si Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910020684 PbZr Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910006501 ZrSiO Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical group [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/2807—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being Si or Ge or C and their alloys except Si
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
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- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
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- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
- H01L29/4975—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2 being a silicide layer, e.g. TiSi2
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Abstract
【課題】 高誘電率ゲート絶縁層とシリコン基板、ゲート電極界面において、低誘電率界面層が生成し、絶縁層全体の誘電率を低下させる。また、基板のシリコンが絶縁層表面まで拡散し、ゲート電極界面における低誘電率層生成を助長する。さらにシリサイド反応により、しきい値がシフトするという問題を解決する。
【解決手段】
高誘電率ゲート絶縁層103の上または下の界面において、シリコンの拡散、シリコンとのシリサイド生成反応および低誘電率界面層の生成を起こすことのない、かつSiO2と比して十分高い誘電率をもつLaとAlを含む金属酸化物層である絶縁層1011,1012をバリア層として具備した構造を提供する。
【選択図】 図6
Description
IEDM Tech. Dig. (2003) 107.
シリコン基板と、
前記シリコン基板上に形成され少なくともHf,Zr,Ti,Taから選択される少なくとも一種の元素の酸化物の絶縁層と、
前記絶縁層上に形成された電極と、
前記シリコン基板と前記絶縁層との界面及び前記絶縁層と前記電極との界面のうち少なくとも一方の界面に、La及びAlを含む金属酸化物層とを備えることを特徴とする半導体装置である。
前記絶縁層上に電極を形成する電極形成工程と、
下記(イ)及び(ロ)で示される工程のうちの少なくとも一方の金属酸化物形成工程とを行うことを特徴とする半導体装置の製造方法である。
(イ)前記絶縁層形成工程前に、前記シリコン基板表面に、La及びAlを含む金属酸化物層を形成する金属酸化物形成工程。
(ロ)前記絶縁層形成工程後で前記電極形成工程前に、前記絶縁層表面に、La及びAlを含む金属酸化物層を形成する金属酸化物形成工程。
前記絶縁層上に電極を形成する電極形成工程と、
下記(ハ)及び(ニ)で示される工程のうちの少なくとも一方の金属酸化物形成工程とを行うことを特徴とする半導体装置の製造方法である。
(ハ)前記絶縁層形成工程前に、前記シリコン基板表面に、メタルLa及びメタルAlを1原子層以下の厚さで堆積したメタル層を形成後、前記メタル層上に酸化性雰囲気でLa及びAlを含む金属酸化物層を堆積とすると共に前記メタル層を酸化する金属酸化物形成工程。
(ニ)前記絶縁層形成工程後で前記電極形成工程前に、前記絶縁層表面に、メタルLa及びメタルAlを1原子層以下の厚さで堆積したメタル層を形成後、前記メタル層上に酸化性雰囲気でLa及びAlを含む金属酸化物層を堆積とすると共に前記メタル層を酸化する金属酸化物形成工程。
これらの結果は、多結晶シリコン電極上にLaAlO層を積層した場合、LaAlO層と電極との界面においても同様に得られる。
1011・・・基板−ゲート絶縁層界面バリア層
1012・・・ゲート絶縁層−ゲート電極界面バリア層
102・・・素子分離層
103・・・ゲート絶縁層
104・・・ゲート電極
105・・・ソース/ドレイン拡散層
106・・・ゲート電極
107・・・ゲート側壁
108・・・層間絶縁層
109・・・アルミニウム配線
Claims (10)
- シリコン基板と、
前記シリコン基板上に形成され少なくともHf,Zr,Ti,Taから選択される少なくとも一種の元素の酸化物の絶縁層と、
前記絶縁層上に形成された電極と、
前記シリコン基板と前記絶縁層との界面及び前記絶縁層と前記電極との界面のうち少なくとも一方の界面に、La及びAlを含む金属酸化物層とを備えることを特徴とする半導体装置。 - 前記La及びAlを含む金属酸化物層は、アモルファス層であることを特徴とする請求項1記載の半導体装置。
- 前記La及びAlを含む金属酸化物層は、LaAlO3層であることを特徴とする請求項1記載の半導体装置。
- 前記La及びAlを含む金属酸化物層は、膜厚が0.5nm以上2nm以下であることを特徴とする請求項1記載の半導体装置。
- 前記La及びAlを含む金属酸化物層は、前記シリコン基板と前記絶縁層との界面に、前記シリコン基板及び前記絶縁層と接して設けられていることを特徴とする請求項1記載の半導体装置。
- 前記La及びAlを含む金属酸化物層は、前記絶縁層と前記電極との界面に、前記絶縁層及び前記電極に接して設けられていることを特徴とする請求項1記載の半導体装置。
- 前記絶縁層がゲート絶縁層であり、前記電極がゲート電極であるMISFETを備えることを特徴とする請求項1記載の半導体装置。
- 前記電極はポリシリコン電極であることを特徴とする請求項1記載の半導体装置。
- シリコン基板上にHf,Zr,Ti,Taから選択される少なくとも一種の元素の酸化物の絶縁層を形成する絶縁層形成工程と、
前記絶縁層上に電極を形成する電極形成工程と、
下記(イ)及び(ロ)で示される工程のうちの少なくとも一方の金属酸化物形成工程とを行うことを特徴とする半導体装置の製造方法。
(イ)前記絶縁層形成工程前に、前記シリコン基板表面に、La及びAlを含む金属酸化物層を形成する金属酸化物形成工程。
(ロ)前記絶縁層形成工程後で前記電極形成工程前に、前記絶縁層表面に、La及びAlを含む金属酸化物層を形成する金属酸化物形成工程。 - シリコン基板上にHf,Zr,Ti,Taから選択される少なくとも一種の元素の酸化物の絶縁層を形成する絶縁層形成工程と、
前記絶縁層上に電極を形成する電極形成工程と、
下記(ハ)及び(ニ)で示される工程のうちの少なくとも一方の金属酸化物形成工程とを行うことを特徴とする半導体装置の製造方法。
(ハ)前記絶縁層形成工程前に、前記シリコン基板表面に、メタルLa及びメタルAlを1原子層以下の厚さで堆積したメタル層を形成後、前記メタル層上に酸化性雰囲気でLa及びAlを含む金属酸化物層を堆積とすると共に前記メタル層を酸化する金属酸化物形成工程。
(ニ)前記絶縁層形成工程後で前記電極形成工程前に、前記絶縁層表面に、メタルLa及びメタルAlを1原子層以下の厚さで堆積したメタル層を形成後、前記メタル層上に酸化性雰囲気でLa及びAlを含む金属酸化物層を堆積とすると共に前記メタル層を酸化する金属酸化物形成工程。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004264828A JP4309320B2 (ja) | 2004-09-13 | 2004-09-13 | 半導体装置及びその製造方法 |
US11/176,271 US20060054961A1 (en) | 2004-09-13 | 2005-07-08 | Semiconductor device and method for manufacturing the same |
KR1020050084743A KR100721469B1 (ko) | 2004-09-13 | 2005-09-12 | 반도체 장치 및 그 제조 방법 |
US12/149,572 US7833865B2 (en) | 2004-09-13 | 2008-05-05 | Method of manufacturing a semiconductor device including a LaAIO3 layer |
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Cited By (8)
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JP2007273531A (ja) * | 2006-03-30 | 2007-10-18 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2008141178A (ja) * | 2006-10-23 | 2008-06-19 | Interuniv Micro Electronica Centrum Vzw | 半導体装置の製造方法およびそれにより得られた半導体装置 |
US7737503B2 (en) | 2006-06-08 | 2010-06-15 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
JP2010182964A (ja) * | 2009-02-06 | 2010-08-19 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2010186853A (ja) * | 2009-02-12 | 2010-08-26 | Toshiba Corp | 半導体装置の製造方法 |
US7863695B2 (en) | 2007-11-05 | 2011-01-04 | Kabushiki Kaisha Toshiba | Complementary MISFET semiconductor device having an atomic density ratio aluminum/lanthanum (Al/La) in the gate insulating layer of PMIS is larger than that of the NMIS |
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Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2816192B2 (ja) | 1989-08-16 | 1998-10-27 | 株式会社日立製作所 | 半導体装置の製造方法 |
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US6828200B2 (en) * | 2003-01-03 | 2004-12-07 | Texas Instruments Incorporated | Multistage deposition that incorporates nitrogen via an intermediate step |
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-
2004
- 2004-09-13 JP JP2004264828A patent/JP4309320B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-08 US US11/176,271 patent/US20060054961A1/en not_active Abandoned
- 2005-09-12 KR KR1020050084743A patent/KR100721469B1/ko not_active IP Right Cessation
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2008
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JP2016013600A (ja) * | 2014-07-02 | 2016-01-28 | Dmg森精機株式会社 | 工作機械 |
Also Published As
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US7833865B2 (en) | 2010-11-16 |
JP4309320B2 (ja) | 2009-08-05 |
KR20060051213A (ko) | 2006-05-19 |
US20060054961A1 (en) | 2006-03-16 |
US20080318404A1 (en) | 2008-12-25 |
KR100721469B1 (ko) | 2007-05-23 |
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