JP2006052441A5 - - Google Patents
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- Publication number
- JP2006052441A5 JP2006052441A5 JP2004234792A JP2004234792A JP2006052441A5 JP 2006052441 A5 JP2006052441 A5 JP 2006052441A5 JP 2004234792 A JP2004234792 A JP 2004234792A JP 2004234792 A JP2004234792 A JP 2004234792A JP 2006052441 A5 JP2006052441 A5 JP 2006052441A5
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- producing
- untreated
- less
- ion concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 9
- 239000011889 copper foil Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000002441 X-ray diffraction Methods 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910000365 copper sulfate Inorganic materials 0.000 claims 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims 1
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- 239000008151 electrolyte solution Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 102000004169 proteins and genes Human genes 0.000 claims 1
- 108090000623 proteins and genes Proteins 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004234792A JP4549774B2 (ja) | 2004-08-11 | 2004-08-11 | 電解銅箔の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004234792A JP4549774B2 (ja) | 2004-08-11 | 2004-08-11 | 電解銅箔の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006052441A JP2006052441A (ja) | 2006-02-23 |
| JP2006052441A5 true JP2006052441A5 (enExample) | 2007-09-20 |
| JP4549774B2 JP4549774B2 (ja) | 2010-09-22 |
Family
ID=36030101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004234792A Expired - Fee Related JP4549774B2 (ja) | 2004-08-11 | 2004-08-11 | 電解銅箔の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4549774B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5024930B2 (ja) * | 2006-10-31 | 2012-09-12 | 三井金属鉱業株式会社 | 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法 |
| KR100958976B1 (ko) | 2008-02-01 | 2010-05-20 | 엘에스엠트론 주식회사 | 고굴곡성을 갖는 전해 동박 및 그 제조 방법 |
| JP5352542B2 (ja) | 2010-07-15 | 2013-11-27 | エル エス エムトロン リミテッド | リチウム二次電池の集電体用銅箔 |
| CN104651836B (zh) * | 2010-11-22 | 2018-11-02 | 三井金属矿业株式会社 | 表面处理铜箔 |
| TWI542739B (zh) * | 2014-03-21 | 2016-07-21 | 長春石油化學股份有限公司 | 電解銅箔 |
| JP2016023347A (ja) * | 2014-07-23 | 2016-02-08 | イビデン株式会社 | プリント配線板 |
| CN107153084B (zh) * | 2017-05-27 | 2020-05-22 | 佛山市承安铜业有限公司 | 一种研究铜阳极Cl-浓度对镀铜质量影响的方法 |
| WO2021153256A1 (ja) | 2020-01-30 | 2021-08-05 | 三井金属鉱業株式会社 | 電解銅箔 |
| PL245191B1 (pl) | 2020-01-30 | 2024-05-27 | Mitsui Mining & Smelting Co Ltd | Elektrolityczna folia miedziana |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1036992A (ja) * | 1996-07-19 | 1998-02-10 | Japan Energy Corp | 電解銅箔及びその製造方法 |
| JP3046301B1 (ja) * | 1999-06-08 | 2000-05-29 | 三井金属鉱業株式会社 | 電解銅箔の製造方法、電解銅箔、銅張り積層板およびプリント配線板 |
| JP3794613B2 (ja) * | 2000-05-18 | 2006-07-05 | 三井金属鉱業株式会社 | 電解銅箔の電解装置 |
| JP3756852B2 (ja) * | 2002-07-01 | 2006-03-15 | 日本電解株式会社 | 電解銅箔の製造方法 |
-
2004
- 2004-08-11 JP JP2004234792A patent/JP4549774B2/ja not_active Expired - Fee Related
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