JP4549774B2 - 電解銅箔の製造方法 - Google Patents

電解銅箔の製造方法 Download PDF

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Publication number
JP4549774B2
JP4549774B2 JP2004234792A JP2004234792A JP4549774B2 JP 4549774 B2 JP4549774 B2 JP 4549774B2 JP 2004234792 A JP2004234792 A JP 2004234792A JP 2004234792 A JP2004234792 A JP 2004234792A JP 4549774 B2 JP4549774 B2 JP 4549774B2
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Japan
Prior art keywords
copper foil
electrolytic copper
electrolytic
layer
treatment
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Expired - Fee Related
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JP2004234792A
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English (en)
Japanese (ja)
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JP2006052441A5 (enExample
JP2006052441A (ja
Inventor
晶子 杉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
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Mitsui Mining and Smelting Co Ltd
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Priority to JP2004234792A priority Critical patent/JP4549774B2/ja
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Publication of JP2006052441A5 publication Critical patent/JP2006052441A5/ja
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Publication of JP4549774B2 publication Critical patent/JP4549774B2/ja
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  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2004234792A 2004-08-11 2004-08-11 電解銅箔の製造方法 Expired - Fee Related JP4549774B2 (ja)

Priority Applications (1)

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JP2004234792A JP4549774B2 (ja) 2004-08-11 2004-08-11 電解銅箔の製造方法

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JP2004234792A JP4549774B2 (ja) 2004-08-11 2004-08-11 電解銅箔の製造方法

Publications (3)

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JP2006052441A JP2006052441A (ja) 2006-02-23
JP2006052441A5 JP2006052441A5 (enExample) 2007-09-20
JP4549774B2 true JP4549774B2 (ja) 2010-09-22

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JP2004234792A Expired - Fee Related JP4549774B2 (ja) 2004-08-11 2004-08-11 電解銅箔の製造方法

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5024930B2 (ja) * 2006-10-31 2012-09-12 三井金属鉱業株式会社 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法
KR100958976B1 (ko) 2008-02-01 2010-05-20 엘에스엠트론 주식회사 고굴곡성을 갖는 전해 동박 및 그 제조 방법
JP5352542B2 (ja) 2010-07-15 2013-11-27 エル エス エムトロン リミテッド リチウム二次電池の集電体用銅箔
JP5400960B2 (ja) * 2010-11-22 2014-01-29 三井金属鉱業株式会社 表面処理銅箔
TWI542739B (zh) * 2014-03-21 2016-07-21 長春石油化學股份有限公司 電解銅箔
JP2016023347A (ja) * 2014-07-23 2016-02-08 イビデン株式会社 プリント配線板
CN107153084B (zh) * 2017-05-27 2020-05-22 佛山市承安铜业有限公司 一种研究铜阳极Cl-浓度对镀铜质量影响的方法
WO2021153256A1 (ja) 2020-01-30 2021-08-05 三井金属鉱業株式会社 電解銅箔
WO2021153257A1 (ja) 2020-01-30 2021-08-05 三井金属鉱業株式会社 電解銅箔

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1036992A (ja) * 1996-07-19 1998-02-10 Japan Energy Corp 電解銅箔及びその製造方法
JP3046301B1 (ja) * 1999-06-08 2000-05-29 三井金属鉱業株式会社 電解銅箔の製造方法、電解銅箔、銅張り積層板およびプリント配線板
JP3794613B2 (ja) * 2000-05-18 2006-07-05 三井金属鉱業株式会社 電解銅箔の電解装置
JP3756852B2 (ja) * 2002-07-01 2006-03-15 日本電解株式会社 電解銅箔の製造方法

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JP2006052441A (ja) 2006-02-23

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