JP2006049759A5 - - Google Patents
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- Publication number
- JP2006049759A5 JP2006049759A5 JP2004232098A JP2004232098A JP2006049759A5 JP 2006049759 A5 JP2006049759 A5 JP 2006049759A5 JP 2004232098 A JP2004232098 A JP 2004232098A JP 2004232098 A JP2004232098 A JP 2004232098A JP 2006049759 A5 JP2006049759 A5 JP 2006049759A5
- Authority
- JP
- Japan
- Prior art keywords
- plug
- interlayer insulating
- insulating film
- wiring
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011229 interlayer Substances 0.000 claims 24
- 239000004065 semiconductor Substances 0.000 claims 21
- 239000010410 layer Substances 0.000 claims 13
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- 229910052710 silicon Inorganic materials 0.000 claims 6
- 239000010703 silicon Substances 0.000 claims 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 4
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 4
- 230000004888 barrier function Effects 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 229910052760 oxygen Inorganic materials 0.000 claims 4
- 239000001301 oxygen Substances 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004232098A JP2006049759A (ja) | 2004-08-09 | 2004-08-09 | 半導体装置及び半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004232098A JP2006049759A (ja) | 2004-08-09 | 2004-08-09 | 半導体装置及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006049759A JP2006049759A (ja) | 2006-02-16 |
| JP2006049759A5 true JP2006049759A5 (enrdf_load_stackoverflow) | 2007-09-20 |
Family
ID=36027934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004232098A Pending JP2006049759A (ja) | 2004-08-09 | 2004-08-09 | 半導体装置及び半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006049759A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159651A (ja) * | 2006-12-21 | 2008-07-10 | Elpida Memory Inc | 多層配線、積層アルミニウム配線、半導体装置、及びそれらの製造方法 |
| KR101676810B1 (ko) | 2014-10-30 | 2016-11-16 | 삼성전자주식회사 | 반도체 소자, 이를 포함하는 디스플레이 드라이버 집적 회로 및 디스플레이 장치 |
| CN119208291A (zh) * | 2023-06-15 | 2024-12-27 | 长鑫存储技术有限公司 | 半导体结构及其制作方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120447A (ja) * | 1992-10-05 | 1994-04-28 | Mitsubishi Electric Corp | 半導体装置の導電層接続構造およびその構造を備えたｄｒａｍ |
| JPH11176932A (ja) * | 1997-12-09 | 1999-07-02 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
| JP3670552B2 (ja) * | 2000-03-27 | 2005-07-13 | 株式会社東芝 | 半導体装置及びその製造方法 |
-
2004
- 2004-08-09 JP JP2004232098A patent/JP2006049759A/ja active Pending
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