JP2006019456A - 半導体レーザ素子 - Google Patents
半導体レーザ素子 Download PDFInfo
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- JP2006019456A JP2006019456A JP2004194970A JP2004194970A JP2006019456A JP 2006019456 A JP2006019456 A JP 2006019456A JP 2004194970 A JP2004194970 A JP 2004194970A JP 2004194970 A JP2004194970 A JP 2004194970A JP 2006019456 A JP2006019456 A JP 2006019456A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 174
- 230000010355 oscillation Effects 0.000 claims abstract description 73
- 150000004767 nitrides Chemical class 0.000 claims abstract description 12
- 238000010521 absorption reaction Methods 0.000 claims description 19
- 238000005452 bending Methods 0.000 abstract description 10
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000005253 cladding Methods 0.000 description 134
- 238000004519 manufacturing process Methods 0.000 description 63
- 229910004298 SiO 2 Inorganic materials 0.000 description 55
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 36
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 29
- 238000000034 method Methods 0.000 description 28
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 26
- 239000000758 substrate Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 13
- 238000005530 etching Methods 0.000 description 12
- 238000001771 vacuum deposition Methods 0.000 description 11
- 239000000470 constituent Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004194970A JP2006019456A (ja) | 2004-06-30 | 2004-06-30 | 半導体レーザ素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004194970A JP2006019456A (ja) | 2004-06-30 | 2004-06-30 | 半導体レーザ素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006019456A true JP2006019456A (ja) | 2006-01-19 |
| JP2006019456A5 JP2006019456A5 (enExample) | 2007-07-19 |
Family
ID=35793442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004194970A Pending JP2006019456A (ja) | 2004-06-30 | 2004-06-30 | 半導体レーザ素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006019456A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266574A (ja) * | 2006-02-28 | 2007-10-11 | Sanyo Electric Co Ltd | 半導体レーザ素子及び半導体レーザ素子の製造方法 |
| JP2011049364A (ja) * | 2009-08-27 | 2011-03-10 | Sanyo Electric Co Ltd | 半導体レーザ素子およびその製造方法 |
| JP2012142448A (ja) * | 2010-12-29 | 2012-07-26 | Mitsubishi Electric Corp | 半導体発光素子の製造方法 |
| CN108512034A (zh) * | 2017-02-28 | 2018-09-07 | 山东华光光电子股份有限公司 | 一种横向非对称光波导半导体激光器芯片及其制备方法 |
| WO2024230822A1 (zh) * | 2023-05-09 | 2024-11-14 | 泉州三安半导体科技有限公司 | 一种半导体激光元件 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628588A (ja) * | 1985-07-04 | 1987-01-16 | Nec Corp | 半導体レ−ザ |
| JPH01165189A (ja) * | 1987-12-22 | 1989-06-29 | Canon Inc | 半導体レーザー |
| JP2000133879A (ja) * | 1998-08-19 | 2000-05-12 | Hitachi Ltd | 半導体レ―ザ装置及びそれを用いた光情報処理装置 |
| JP2002151790A (ja) * | 2000-11-16 | 2002-05-24 | Sony Corp | 半導体レーザおよびその製造方法 |
| JP2004119512A (ja) * | 2002-09-24 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置及びその製造方法 |
-
2004
- 2004-06-30 JP JP2004194970A patent/JP2006019456A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628588A (ja) * | 1985-07-04 | 1987-01-16 | Nec Corp | 半導体レ−ザ |
| JPH01165189A (ja) * | 1987-12-22 | 1989-06-29 | Canon Inc | 半導体レーザー |
| JP2000133879A (ja) * | 1998-08-19 | 2000-05-12 | Hitachi Ltd | 半導体レ―ザ装置及びそれを用いた光情報処理装置 |
| JP2002151790A (ja) * | 2000-11-16 | 2002-05-24 | Sony Corp | 半導体レーザおよびその製造方法 |
| JP2004119512A (ja) * | 2002-09-24 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置及びその製造方法 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266574A (ja) * | 2006-02-28 | 2007-10-11 | Sanyo Electric Co Ltd | 半導体レーザ素子及び半導体レーザ素子の製造方法 |
| JP2011049364A (ja) * | 2009-08-27 | 2011-03-10 | Sanyo Electric Co Ltd | 半導体レーザ素子およびその製造方法 |
| JP2012142448A (ja) * | 2010-12-29 | 2012-07-26 | Mitsubishi Electric Corp | 半導体発光素子の製造方法 |
| CN108512034A (zh) * | 2017-02-28 | 2018-09-07 | 山东华光光电子股份有限公司 | 一种横向非对称光波导半导体激光器芯片及其制备方法 |
| CN108512034B (zh) * | 2017-02-28 | 2020-04-03 | 山东华光光电子股份有限公司 | 一种横向非对称光波导半导体激光器芯片及其制备方法 |
| WO2024230822A1 (zh) * | 2023-05-09 | 2024-11-14 | 泉州三安半导体科技有限公司 | 一种半导体激光元件 |
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