JP2005537141A5 - - Google Patents
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- Publication number
- JP2005537141A5 JP2005537141A5 JP2004531513A JP2004531513A JP2005537141A5 JP 2005537141 A5 JP2005537141 A5 JP 2005537141A5 JP 2004531513 A JP2004531513 A JP 2004531513A JP 2004531513 A JP2004531513 A JP 2004531513A JP 2005537141 A5 JP2005537141 A5 JP 2005537141A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- containing elastomer
- pattern
- substrate
- elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001971 elastomer Polymers 0.000 claims 31
- 239000000806 elastomer Substances 0.000 claims 31
- 238000000034 method Methods 0.000 claims 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 27
- 229910052710 silicon Inorganic materials 0.000 claims 27
- 239000010703 silicon Substances 0.000 claims 27
- 239000000758 substrate Substances 0.000 claims 17
- 239000010410 layer Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 5
- 239000002243 precursor Substances 0.000 claims 5
- 230000001590 oxidative effect Effects 0.000 claims 4
- -1 polysiloxane Polymers 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 229920001296 polysiloxane Polymers 0.000 claims 3
- 125000001424 substituent group Chemical group 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 230000003796 beauty Effects 0.000 claims 2
- 239000003607 modifier Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000004587 chromatography analysis Methods 0.000 claims 1
- 230000005684 electric field Effects 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 239000002563 ionic surfactant Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 239000002736 nonionic surfactant Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 230000007261 regionalization Effects 0.000 claims 1
- 150000004756 silanes Chemical class 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims 1
- 239000005052 trichlorosilane Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/230,882 US6805809B2 (en) | 2002-08-28 | 2002-08-28 | Decal transfer microfabrication |
| PCT/US2003/026751 WO2004021084A2 (en) | 2002-08-28 | 2003-08-28 | Decal transfer microfabrication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005537141A JP2005537141A (ja) | 2005-12-08 |
| JP2005537141A5 true JP2005537141A5 (https=) | 2006-10-19 |
Family
ID=31976614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004531513A Pending JP2005537141A (ja) | 2002-08-28 | 2003-08-28 | 転写微細加工 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6805809B2 (https=) |
| EP (1) | EP1539638A2 (https=) |
| JP (1) | JP2005537141A (https=) |
| KR (1) | KR20050052480A (https=) |
| CN (2) | CN100413778C (https=) |
| AU (1) | AU2003260094A1 (https=) |
| CA (1) | CA2495978A1 (https=) |
| SG (1) | SG170619A1 (https=) |
| WO (1) | WO2004021084A2 (https=) |
Families Citing this family (57)
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| US7951392B2 (en) * | 2002-08-16 | 2011-05-31 | Boston Scientific Scimed, Inc. | Microarray drug delivery coatings |
| US6805809B2 (en) * | 2002-08-28 | 2004-10-19 | Board Of Trustees Of University Of Illinois | Decal transfer microfabrication |
| US8222072B2 (en) * | 2002-12-20 | 2012-07-17 | The Trustees Of Princeton University | Methods of fabricating devices by low pressure cold welding |
| US6808646B1 (en) * | 2003-04-29 | 2004-10-26 | Hewlett-Packard Development Company, L.P. | Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size |
| US7435256B2 (en) * | 2003-11-06 | 2008-10-14 | Boston Scientific Scimed, Inc. | Method and apparatus for controlled delivery of active substance |
| US20050136500A1 (en) * | 2003-12-19 | 2005-06-23 | Kimberly-Clark Worldwide; Inc. | Flow-through assay devices |
| DE602004029088D1 (de) * | 2003-12-22 | 2010-10-21 | Dow Corning | Siliconzusammensetzungen und deren verwendung bei der gezielten ablösung oder übertragung von gedruckten oder geformten strukturen und übertragungsverfahren dafür |
| EP1733449B1 (en) * | 2004-03-08 | 2010-12-01 | The Board Of Trustees Of The University Of Illinois | Microfluidic electrochemical reactors |
| US7741003B2 (en) * | 2004-03-30 | 2010-06-22 | Hitachi Global Storage Technologies Netherlands B.V. | Photoresist transfer pads |
| US7662545B2 (en) * | 2004-10-14 | 2010-02-16 | The Board Of Trustees Of The University Of Illinois | Decal transfer lithography |
| FR2877142B1 (fr) * | 2004-10-21 | 2007-05-11 | Commissariat Energie Atomique | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. |
| WO2006121906A1 (en) | 2005-05-10 | 2006-11-16 | Dow Corning Corporation | Sub-micron decal transfer lithography |
| EP2937896B1 (en) * | 2005-06-02 | 2022-05-04 | The Board of Trustees of the University of Illinois | Method of transfering a printable semiconductor element |
| GB2437328A (en) * | 2006-04-10 | 2007-10-24 | Cambridge Display Tech Ltd | Electric devices and methods of manufacture |
| CN101126898B (zh) * | 2007-08-31 | 2011-03-16 | 中国科学院光电技术研究所 | 一种利用金属层缩小π位相偏移光刻特征尺寸的方法 |
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| US20100072490A1 (en) * | 2008-09-24 | 2010-03-25 | Kerr Roger S | Low cost flexible display sheet |
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| WO2010036807A1 (en) * | 2008-09-24 | 2010-04-01 | The Board Of Trustees Of The University Of Illinois | Arrays of ultrathin silicon solar microcells |
| US7879691B2 (en) * | 2008-09-24 | 2011-02-01 | Eastman Kodak Company | Low cost die placement |
| US8034663B2 (en) * | 2008-09-24 | 2011-10-11 | Eastman Kodak Company | Low cost die release wafer |
| US8361840B2 (en) * | 2008-09-24 | 2013-01-29 | Eastman Kodak Company | Thermal barrier layer for integrated circuit manufacture |
| US8062507B2 (en) * | 2008-09-25 | 2011-11-22 | Uop Llc | Stripping process with multi-sloped baffles |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8948562B2 (en) | 2008-11-25 | 2015-02-03 | Regents Of The University Of Minnesota | Replication of patterned thin-film structures for use in plasmonics and metamaterials |
| US7927904B2 (en) * | 2009-01-05 | 2011-04-19 | Dalsa Semiconductor Inc. | Method of making BIOMEMS devices |
| US8398868B2 (en) * | 2009-05-19 | 2013-03-19 | International Business Machines Corporation | Directed self-assembly of block copolymers using segmented prepatterns |
| KR101077789B1 (ko) | 2009-08-07 | 2011-10-28 | 한국과학기술원 | Led 디스플레이 제조 방법 및 이에 의하여 제조된 led 디스플레이 |
| KR101113692B1 (ko) * | 2009-09-17 | 2012-02-27 | 한국과학기술원 | 태양전지 제조방법 및 이에 의하여 제조된 태양전지 |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| US9757050B2 (en) | 2011-08-05 | 2017-09-12 | Mc10, Inc. | Catheter balloon employing force sensing elements |
| US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
| KR20150031324A (ko) | 2012-07-05 | 2015-03-23 | 엠씨10, 인크 | 유동 감지를 포함하는 카테터 장치 |
| BR112015003455A2 (pt) | 2012-08-17 | 2017-07-04 | Visual Physics Llc | processo para transferir microestruturas para um substrato final |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| US9711744B2 (en) | 2012-12-21 | 2017-07-18 | 3M Innovative Properties Company | Patterned structured transfer tape |
| JP6170378B2 (ja) * | 2013-08-29 | 2017-07-26 | 東京エレクトロン株式会社 | エッチング方法 |
| CN104555904A (zh) * | 2013-10-14 | 2015-04-29 | 北京大学 | 基于bcb转印工艺实现mems器件圆片级封装的方法 |
| FR3029433B1 (fr) * | 2014-12-04 | 2017-01-13 | Commissariat Energie Atomique | Procede de transfert d'au moins une partie d'un film composite sur une membrane souple en polymere |
| CN105241635B (zh) * | 2015-09-01 | 2018-06-26 | 中国科学院苏州生物医学工程技术研究所 | 用于测试分辨率的荧光纳米标准板的制备方法 |
| CN105731365B (zh) * | 2016-02-29 | 2017-05-24 | 天津大学 | 基于交联控制转移印刷的pdms弹性体微纳加工方法 |
| GB201613051D0 (en) | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
| JP7588078B2 (ja) | 2019-01-29 | 2024-11-21 | ラム リサーチ コーポレーション | 基板の環境に敏感な表面のための犠牲保護層 |
| KR102230702B1 (ko) * | 2019-08-26 | 2021-03-23 | 한국기계연구원 | 나노 임프린팅 패턴 제작 방법 |
| US12322588B2 (en) | 2019-09-04 | 2025-06-03 | Lam Research Corporation | Stimulus responsive polymer films and formulations |
| US12048965B2 (en) | 2019-11-21 | 2024-07-30 | Norsk Titanium As | Distortion mitigation in directed energy deposition |
| JP2023502741A (ja) * | 2019-11-21 | 2023-01-25 | ノルスク・チタニウム・アーエス | 指向性エネルギー堆積における歪み軽減 |
| CN111086971B (zh) * | 2019-12-25 | 2022-06-21 | 大连理工大学 | 一种用于柔性mems器件的转印工艺方法 |
| JP7395773B2 (ja) | 2020-05-12 | 2023-12-11 | ラム リサーチ コーポレーション | 刺激応答性ポリマー膜の制御された分解 |
| CN113811094B (zh) * | 2021-08-25 | 2023-07-25 | Tcl华星光电技术有限公司 | 转印基板、转印装置以及转印方法 |
| US12600159B2 (en) * | 2022-02-25 | 2026-04-14 | Intel Corporation | Reusable composite stencil for spray processes |
| CN114589963B (zh) * | 2022-04-07 | 2024-03-22 | 深圳市艺鼎鹏包装设计有限公司 | 一种包装盒烫金工艺 |
| CN115417371B (zh) * | 2022-09-14 | 2025-01-14 | 哈尔滨工业大学 | 一种空气油下都能实现表面粘附力调控的方法 |
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| US6805809B2 (en) * | 2002-08-28 | 2004-10-19 | Board Of Trustees Of University Of Illinois | Decal transfer microfabrication |
| US7662545B2 (en) * | 2004-10-14 | 2010-02-16 | The Board Of Trustees Of The University Of Illinois | Decal transfer lithography |
-
2002
- 2002-08-28 US US10/230,882 patent/US6805809B2/en not_active Expired - Lifetime
-
2003
- 2003-08-28 EP EP03791812A patent/EP1539638A2/en not_active Withdrawn
- 2003-08-28 CN CNB038234440A patent/CN100413778C/zh not_active Expired - Fee Related
- 2003-08-28 CA CA002495978A patent/CA2495978A1/en not_active Abandoned
- 2003-08-28 AU AU2003260094A patent/AU2003260094A1/en not_active Abandoned
- 2003-08-28 KR KR1020057003410A patent/KR20050052480A/ko not_active Abandoned
- 2003-08-28 WO PCT/US2003/026751 patent/WO2004021084A2/en not_active Ceased
- 2003-08-28 JP JP2004531513A patent/JP2005537141A/ja active Pending
- 2003-08-28 SG SG200802867-2A patent/SG170619A1/en unknown
- 2003-08-28 CN CNA2008101356893A patent/CN101327904A/zh active Pending
-
2004
- 2004-08-04 US US10/911,049 patent/US20050199584A1/en not_active Abandoned
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