SG170619A1 - Decal transfer microfabrication - Google Patents

Decal transfer microfabrication

Info

Publication number
SG170619A1
SG170619A1 SG200802867-2A SG2008028672A SG170619A1 SG 170619 A1 SG170619 A1 SG 170619A1 SG 2008028672 A SG2008028672 A SG 2008028672A SG 170619 A1 SG170619 A1 SG 170619A1
Authority
SG
Singapore
Prior art keywords
microfabrication
substrate
decal transfer
top layer
layer
Prior art date
Application number
SG200802867-2A
Other languages
English (en)
Inventor
Ralph G Nuzzo
William Robert Childs
Original Assignee
Univ Illinois
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Illinois filed Critical Univ Illinois
Publication of SG170619A1 publication Critical patent/SG170619A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/034—Moulding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24562—Interlaminar spaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Micromachines (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
SG200802867-2A 2002-08-28 2003-08-28 Decal transfer microfabrication SG170619A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/230,882 US6805809B2 (en) 2002-08-28 2002-08-28 Decal transfer microfabrication

Publications (1)

Publication Number Publication Date
SG170619A1 true SG170619A1 (en) 2011-05-30

Family

ID=31976614

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200802867-2A SG170619A1 (en) 2002-08-28 2003-08-28 Decal transfer microfabrication

Country Status (9)

Country Link
US (2) US6805809B2 (https=)
EP (1) EP1539638A2 (https=)
JP (1) JP2005537141A (https=)
KR (1) KR20050052480A (https=)
CN (2) CN100413778C (https=)
AU (1) AU2003260094A1 (https=)
CA (1) CA2495978A1 (https=)
SG (1) SG170619A1 (https=)
WO (1) WO2004021084A2 (https=)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7951392B2 (en) * 2002-08-16 2011-05-31 Boston Scientific Scimed, Inc. Microarray drug delivery coatings
US6805809B2 (en) * 2002-08-28 2004-10-19 Board Of Trustees Of University Of Illinois Decal transfer microfabrication
US8222072B2 (en) * 2002-12-20 2012-07-17 The Trustees Of Princeton University Methods of fabricating devices by low pressure cold welding
US6808646B1 (en) * 2003-04-29 2004-10-26 Hewlett-Packard Development Company, L.P. Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
US7435256B2 (en) * 2003-11-06 2008-10-14 Boston Scientific Scimed, Inc. Method and apparatus for controlled delivery of active substance
US20050136500A1 (en) * 2003-12-19 2005-06-23 Kimberly-Clark Worldwide; Inc. Flow-through assay devices
DE602004029088D1 (de) * 2003-12-22 2010-10-21 Dow Corning Siliconzusammensetzungen und deren verwendung bei der gezielten ablösung oder übertragung von gedruckten oder geformten strukturen und übertragungsverfahren dafür
EP1733449B1 (en) * 2004-03-08 2010-12-01 The Board Of Trustees Of The University Of Illinois Microfluidic electrochemical reactors
US7741003B2 (en) * 2004-03-30 2010-06-22 Hitachi Global Storage Technologies Netherlands B.V. Photoresist transfer pads
US7662545B2 (en) * 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography
FR2877142B1 (fr) * 2004-10-21 2007-05-11 Commissariat Energie Atomique Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere.
WO2006121906A1 (en) 2005-05-10 2006-11-16 Dow Corning Corporation Sub-micron decal transfer lithography
EP2937896B1 (en) * 2005-06-02 2022-05-04 The Board of Trustees of the University of Illinois Method of transfering a printable semiconductor element
GB2437328A (en) * 2006-04-10 2007-10-24 Cambridge Display Tech Ltd Electric devices and methods of manufacture
CN101126898B (zh) * 2007-08-31 2011-03-16 中国科学院光电技术研究所 一种利用金属层缩小π位相偏移光刻特征尺寸的方法
TW200934635A (en) * 2008-02-06 2009-08-16 Nano Terra Inc Stencils with removable backings for forming micron-sized features on surfaces and methods of making and using the same
US8764993B2 (en) * 2008-04-03 2014-07-01 General Electric Company SiOC membranes and methods of making the same
US20100072490A1 (en) * 2008-09-24 2010-03-25 Kerr Roger S Low cost flexible display sheet
US7772042B2 (en) * 2008-09-24 2010-08-10 Eastman Kodak Company Solvent softening to allow die placement
WO2010036807A1 (en) * 2008-09-24 2010-04-01 The Board Of Trustees Of The University Of Illinois Arrays of ultrathin silicon solar microcells
US7879691B2 (en) * 2008-09-24 2011-02-01 Eastman Kodak Company Low cost die placement
US8034663B2 (en) * 2008-09-24 2011-10-11 Eastman Kodak Company Low cost die release wafer
US8361840B2 (en) * 2008-09-24 2013-01-29 Eastman Kodak Company Thermal barrier layer for integrated circuit manufacture
US8062507B2 (en) * 2008-09-25 2011-11-22 Uop Llc Stripping process with multi-sloped baffles
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9289132B2 (en) 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8948562B2 (en) 2008-11-25 2015-02-03 Regents Of The University Of Minnesota Replication of patterned thin-film structures for use in plasmonics and metamaterials
US7927904B2 (en) * 2009-01-05 2011-04-19 Dalsa Semiconductor Inc. Method of making BIOMEMS devices
US8398868B2 (en) * 2009-05-19 2013-03-19 International Business Machines Corporation Directed self-assembly of block copolymers using segmented prepatterns
KR101077789B1 (ko) 2009-08-07 2011-10-28 한국과학기술원 Ｌｅｄ 디스플레이 제조 방법 및 이에 의하여 제조된 ｌｅｄ 디스플레이
KR101113692B1 (ko) * 2009-09-17 2012-02-27 한국과학기술원 태양전지 제조방법 및 이에 의하여 제조된 태양전지
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
KR20150031324A (ko) 2012-07-05 2015-03-23 엠씨10, 인크 유동 감지를 포함하는 카테터 장치
BR112015003455A2 (pt) 2012-08-17 2017-07-04 Visual Physics Llc processo para transferir microestruturas para um substrato final
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
JP6170378B2 (ja) * 2013-08-29 2017-07-26 東京エレクトロン株式会社 エッチング方法
CN104555904A (zh) * 2013-10-14 2015-04-29 北京大学 基于bcb转印工艺实现mems器件圆片级封装的方法
FR3029433B1 (fr) * 2014-12-04 2017-01-13 Commissariat Energie Atomique Procede de transfert d'au moins une partie d'un film composite sur une membrane souple en polymere
CN105241635B (zh) * 2015-09-01 2018-06-26 中国科学院苏州生物医学工程技术研究所 用于测试分辨率的荧光纳米标准板的制备方法
CN105731365B (zh) * 2016-02-29 2017-05-24 天津大学 基于交联控制转移印刷的pdms弹性体微纳加工方法
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
JP7588078B2 (ja) 2019-01-29 2024-11-21 ラム リサーチ コーポレーション 基板の環境に敏感な表面のための犠牲保護層
KR102230702B1 (ko) * 2019-08-26 2021-03-23 한국기계연구원 나노 임프린팅 패턴 제작 방법
US12322588B2 (en) 2019-09-04 2025-06-03 Lam Research Corporation Stimulus responsive polymer films and formulations
US12048965B2 (en) 2019-11-21 2024-07-30 Norsk Titanium As Distortion mitigation in directed energy deposition
JP2023502741A (ja) * 2019-11-21 2023-01-25 ノルスク・チタニウム・アーエス 指向性エネルギー堆積における歪み軽減
CN111086971B (zh) * 2019-12-25 2022-06-21 大连理工大学 一种用于柔性mems器件的转印工艺方法
JP7395773B2 (ja) 2020-05-12 2023-12-11 ラム リサーチ コーポレーション 刺激応答性ポリマー膜の制御された分解
CN113811094B (zh) * 2021-08-25 2023-07-25 Tcl华星光电技术有限公司 转印基板、转印装置以及转印方法
US12600159B2 (en) * 2022-02-25 2026-04-14 Intel Corporation Reusable composite stencil for spray processes
CN114589963B (zh) * 2022-04-07 2024-03-22 深圳市艺鼎鹏包装设计有限公司 一种包装盒烫金工艺
CN115417371B (zh) * 2022-09-14 2025-01-14 哈尔滨工业大学 一种空气油下都能实现表面粘附力调控的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001018857A1 (en) * 1999-09-03 2001-03-15 University Of Maryland, College Park Process for fabrication of 3-dimensional micromechanisms
US6363183B1 (en) * 2000-01-04 2002-03-26 Seungug Koh Reconfigurable and scalable intergrated optic waveguide add/drop multiplexing element using micro-opto-electro-mechanical systems and methods of fabricating thereof

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3682633A (en) * 1967-01-06 1972-08-08 Minnesota Mining & Mfg Color proofing method
US3764248A (en) 1971-09-03 1973-10-09 Stewart Rubber Co Transfer mold for reducing ram flash
JPS535255A (en) 1976-07-05 1978-01-18 Hitachi Ltd Mold for molding resin
US4764244A (en) * 1985-06-11 1988-08-16 The Foxboro Company Resonant sensor and method of making same
US5071597A (en) 1989-06-02 1991-12-10 American Bank Note Holographics, Inc. Plastic molding of articles including a hologram or other microstructure
US5260123A (en) 1991-06-28 1993-11-09 Bridgestone Corporation Block copolymers of polysiloxanes and copolymers of conjugated dienes and aromatic vinyl compounds, and multilayer structures containing same
EP0522751B1 (en) 1991-07-01 1998-04-01 General Electric Company Polycarbonate-polysiloxane block copolymers
DE4219667C2 (de) 1992-06-16 1994-12-01 Kernforschungsz Karlsruhe Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht
US5932677A (en) 1993-05-27 1999-08-03 General Electric Company Terpolymer having aromatic polyester, polysiloxane and polycarbonate segments
US5538674A (en) 1993-11-19 1996-07-23 Donnelly Corporation Method for reproducing holograms, kinoforms, diffractive optical elements and microstructures
US5502144A (en) 1994-07-15 1996-03-26 University Of Cincinnati Composition and method for preparing silicone elastomers
US6403710B1 (en) 1994-08-29 2002-06-11 The Dow Chemical Company Block copolymer compositions containing substantially inert thermoelastic extenders
US5534609A (en) 1995-02-03 1996-07-09 Osi Specialties, Inc. Polysiloxane compositions
US5670598A (en) 1995-03-24 1997-09-23 Minnesota Mining And Manufacturing Company Diblock and triblock polydiorganosiloxane-polyurea block copolymers
ATE250641T1 (de) 1995-06-06 2003-10-15 Kanegafuchi Chemical Ind Ungeordnete siloxan-copolymer, verfahren zur herstellung und diesen copolymer enthaltende zusammensetzung
US5618903A (en) 1995-06-06 1997-04-08 Shell Oil Company Anionically polymerized block copolymers of ethylene and cyclic siloxane monomers
US5661092A (en) * 1995-09-01 1997-08-26 The University Of Connecticut Ultra thin silicon oxide and metal oxide films and a method for the preparation thereof
US5637668A (en) 1996-04-01 1997-06-10 Dow Corning Corporation Preparation of polyorganosiloxanes by interfacial polymerization
ES2144810T3 (es) 1996-04-15 2000-06-16 Dow Corning Asia Ltd Copolimero de polipropileno y organo-polisiloxano y metodo para su preparacion.
US5789487A (en) 1996-07-10 1998-08-04 Carnegie-Mellon University Preparation of novel homo- and copolymers using atom transfer radical polymerization
EP0821018A3 (de) 1996-07-22 1998-09-30 PCD-Polymere Gesellschaft m.b.H. Vernetzbare olefinische Polymere und Verfahren zu ihrer Herstellung
WO1998007773A1 (fr) 1996-08-21 1998-02-26 Kaneka Corporation Procede pour preparer des copolymeres de siloxane et compositions de resine contenant les copolymeres de siloxane prepares selon ledit procede
JPH10135528A (ja) * 1996-10-31 1998-05-22 Matsushita Electric Ind Co Ltd 電子部品用誘電体膜シート、その製造方法および誘電体素子
US5741859A (en) 1997-02-03 1998-04-21 Dow Corning Corporation Block copolymers of polyisobutylene and polydimethylsiloxane
US6013715A (en) 1997-04-22 2000-01-11 Dow Corning Corporation Thermoplastic silicone elastomers
US6013711A (en) 1997-06-18 2000-01-11 Ck Witco Corporation Hydrophilic polysiloxane compositions
US6007914A (en) 1997-12-01 1999-12-28 3M Innovative Properties Company Fibers of polydiorganosiloxane polyurea copolymers
US6033202A (en) 1998-03-27 2000-03-07 Lucent Technologies Inc. Mold for non - photolithographic fabrication of microstructures
US6344521B1 (en) 1998-05-20 2002-02-05 Fmc Corporation Protected functionalized diene and alkenyl substituted aromatic silicone triblock copolymers and processes for making the same
US6387597B1 (en) * 1998-06-05 2002-05-14 Creo Srl Method for exposing features on non-planar resists
US6252253B1 (en) 1998-06-10 2001-06-26 Agere Systems Optoelectronics Guardian Corp. Patterned light emitting diode devices
JP2000025224A (ja) * 1998-07-08 2000-01-25 Brother Ind Ltd 液体吐出装置及び液体吐出装置製造方法
US6153691A (en) 1998-10-07 2000-11-28 Dow Corning Corporation Thermoplastic silicone vulcanizates prepared by condensation cure
US6235863B1 (en) 1998-12-03 2001-05-22 Shell Oil Company Production of saturated siloxane polymers from aromatic monomers
US6090902A (en) 1998-12-21 2000-07-18 Dow Corning Corporation Organopolysiloxane-modified graft copolymers
US7144616B1 (en) * 1999-06-28 2006-12-05 California Institute Of Technology Microfabricated elastomeric valve and pump systems
US6339131B1 (en) 1999-12-06 2002-01-15 General Electric Company Synthesis of poly (arylene ether)-poly(organosiloxane) copolymers
US6645432B1 (en) * 2000-05-25 2003-11-11 President & Fellows Of Harvard College Microfluidic systems including three-dimensionally arrayed channel networks
US6686184B1 (en) * 2000-05-25 2004-02-03 President And Fellows Of Harvard College Patterning of surfaces utilizing microfluidic stamps including three-dimensionally arrayed channel networks
US6362288B1 (en) 2000-07-26 2002-03-26 Dow Corning Corporation Thermoplastic silicone elastomers from compatibilized polyamide resins
FR2814064B1 (fr) 2000-09-20 2005-06-17 Oreal Composition de lavage comprenant des particules d'oxyde d'aluminium, au moins un agent conditionneur et au moins un tensioactif detergent
EP1331997B1 (en) * 2000-11-06 2004-06-16 Nanostream, Inc. Microfluidic flow control devices
US6663820B2 (en) * 2001-03-14 2003-12-16 The Procter & Gamble Company Method of manufacturing microneedle structures using soft lithography and photolithography
KR100442413B1 (ko) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 표면에 금속 미세 패턴을 가진 플라스틱 기판의 제조방법
US6805809B2 (en) * 2002-08-28 2004-10-19 Board Of Trustees Of University Of Illinois Decal transfer microfabrication
US7662545B2 (en) * 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001018857A1 (en) * 1999-09-03 2001-03-15 University Of Maryland, College Park Process for fabrication of 3-dimensional micromechanisms
US6363183B1 (en) * 2000-01-04 2002-03-26 Seungug Koh Reconfigurable and scalable intergrated optic waveguide add/drop multiplexing element using micro-opto-electro-mechanical systems and methods of fabricating thereof

Also Published As

Publication number Publication date
CA2495978A1 (en) 2004-03-11
JP2005537141A (ja) 2005-12-08
CN101327904A (zh) 2008-12-24
WO2004021084A3 (en) 2004-06-17
AU2003260094A8 (en) 2004-03-19
US6805809B2 (en) 2004-10-19
EP1539638A2 (en) 2005-06-15
US20050199584A1 (en) 2005-09-15
WO2004021084A2 (en) 2004-03-11
CN1684902A (zh) 2005-10-19
AU2003260094A1 (en) 2004-03-19
US20040040653A1 (en) 2004-03-04
CN100413778C (zh) 2008-08-27
KR20050052480A (ko) 2005-06-02

Similar Documents

Publication Publication Date Title
SG170619A1 (en) Decal transfer microfabrication
USD485286S1 (en) Extruder plate for diamond shaped extruder insert
USD469116S1 (en) Extruder plate for diamond shaped extruder insert
USD540464S1 (en) Finger grip portion for mask elbow
WO2004041918A3 (en) Microstructures and methods of fabrication thereof
WO2003021635A3 (en) Passivated nanoparticles, method of fabrication thereof, and devices incorporating nanoparticles
WO2004061994A3 (en) Methods of fabricating devices by low pressure cold welding
TW200603261A (en) Method of forming a recessed structure employing a reverse tone process
WO2003095358A3 (en) Method of forming manofluidic channels
TW200501199A (en) Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices
ATE414673T1 (de) Schichtstruktur und herstellungsverfahren dafür
CA2478499A1 (en) Elements for embossing and adhesive application
WO2003090985A8 (en) Device and method for transferring a pattern to a substrate
WO2006007107A3 (en) Abrasive article
WO2003016240A3 (en) Components with bearing or wear-resistant surfaces
DE60235906D1 (de) Erfahren
AU2003255147A1 (en) Functional film for transfer having functional layer, object furnished with functional layer and process for producing the same
WO2006137860A3 (en) Reduction of a feature dimension in a nano-scale device
AU4951399A (en) Mechanical patterning of a device layer
USD481202S1 (en) Key ring
TW200629374A (en) Patterning substrates employing multi-film layers defining etch-differential interfaces
EP1211572A3 (en) Transfix component having fluorosilicone outer layer
AU2002241810A1 (en) Method of patterning a mask on the surface of a substrate and product manufactured thereby
EP1179614A3 (en) Mandrel for electroforming orifice plates
ATE512564T1 (de) Befestigungsglied, elektrolumineszente vorrichtung damit und substrat für die vorrichtung