WO2004021084A2 - Decal transfer microfabrication - Google Patents

Decal transfer microfabrication Download PDF

Info

Publication number
WO2004021084A2
WO2004021084A2 PCT/US2003/026751 US0326751W WO2004021084A2 WO 2004021084 A2 WO2004021084 A2 WO 2004021084A2 US 0326751 W US0326751 W US 0326751W WO 2004021084 A2 WO2004021084 A2 WO 2004021084A2
Authority
WO
WIPO (PCT)
Prior art keywords
silicon
substrate
pattern
elastomer
containing elastomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/026751
Other languages
English (en)
French (fr)
Other versions
WO2004021084A3 (en
Inventor
Ralph G. Nuzzo
William Robert Childs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Illinois at Urbana Champaign
University of Illinois System
Original Assignee
University of Illinois at Urbana Champaign
University of Illinois System
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Illinois at Urbana Champaign, University of Illinois System filed Critical University of Illinois at Urbana Champaign
Priority to AU2003260094A priority Critical patent/AU2003260094A1/en
Priority to EP03791812A priority patent/EP1539638A2/en
Priority to CA002495978A priority patent/CA2495978A1/en
Priority to JP2004531513A priority patent/JP2005537141A/ja
Publication of WO2004021084A2 publication Critical patent/WO2004021084A2/en
Publication of WO2004021084A3 publication Critical patent/WO2004021084A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/034—Moulding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24562—Interlaminar spaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material

Definitions

  • the adhesive is subjected to appropriate conditions to sufficiently reduce the strength of attachment between the transfer pad (80 or 82) and the film (60 or 90) before removing 78 the transfer pad from the substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Micromachines (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
PCT/US2003/026751 2002-08-28 2003-08-28 Decal transfer microfabrication Ceased WO2004021084A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2003260094A AU2003260094A1 (en) 2002-08-28 2003-08-28 Decal transfer microfabrication
EP03791812A EP1539638A2 (en) 2002-08-28 2003-08-28 Decal transfer microfabrication
CA002495978A CA2495978A1 (en) 2002-08-28 2003-08-28 Decal transfer microfabrication
JP2004531513A JP2005537141A (ja) 2002-08-28 2003-08-28 転写微細加工

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/230,882 2002-08-28
US10/230,882 US6805809B2 (en) 2002-08-28 2002-08-28 Decal transfer microfabrication

Publications (2)

Publication Number Publication Date
WO2004021084A2 true WO2004021084A2 (en) 2004-03-11
WO2004021084A3 WO2004021084A3 (en) 2004-06-17

Family

ID=31976614

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/026751 Ceased WO2004021084A2 (en) 2002-08-28 2003-08-28 Decal transfer microfabrication

Country Status (9)

Country Link
US (2) US6805809B2 (https=)
EP (1) EP1539638A2 (https=)
JP (1) JP2005537141A (https=)
KR (1) KR20050052480A (https=)
CN (2) CN100413778C (https=)
AU (1) AU2003260094A1 (https=)
CA (1) CA2495978A1 (https=)
SG (1) SG170619A1 (https=)
WO (1) WO2004021084A2 (https=)

Cited By (7)

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WO2006121906A1 (en) * 2005-05-10 2006-11-16 Dow Corning Corporation Sub-micron decal transfer lithography
JP2008517474A (ja) * 2004-10-21 2008-05-22 コミツサリア タ レネルジー アトミーク ポリマーハンドルを用いてマイクロメートル級またはミリメートル級のサイズの少なくとも１つの対象物を運搬するための方法
US7662545B2 (en) 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography
WO2010065071A3 (en) * 2008-11-25 2010-10-28 Regents Of The University Of Minnesota Replication of patterned thin-film structures for use in plasmonics and metamaterials
US7909971B2 (en) 2004-03-08 2011-03-22 The Board Of Trustees Of The University Of Illinois Microfluidic electrochemical reactors
JP2013183163A (ja) * 2005-06-02 2013-09-12 Board Of Trustees Of The Univ Of Illinois エラストマースタンプへの接着の動的コントロールによるパターン転送印刷
EP2885138B1 (en) 2012-08-17 2023-05-24 Visual Physics, LLC A process for transferring microstructures to a final substrate

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US7909971B2 (en) 2004-03-08 2011-03-22 The Board Of Trustees Of The University Of Illinois Microfluidic electrochemical reactors
US7662545B2 (en) 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography
JP2008517474A (ja) * 2004-10-21 2008-05-22 コミツサリア タ レネルジー アトミーク ポリマーハンドルを用いてマイクロメートル級またはミリメートル級のサイズの少なくとも１つの対象物を運搬するための方法
WO2006121906A1 (en) * 2005-05-10 2006-11-16 Dow Corning Corporation Sub-micron decal transfer lithography
JP2008545252A (ja) * 2005-05-10 2008-12-11 ダウ コーニング コーポレイシヨン サブミクロンのデカール転写リソグラフィ
US8252191B2 (en) 2005-05-10 2012-08-28 Dow Corning Corporation Sub-micron decal transfer lithography
JP2013183163A (ja) * 2005-06-02 2013-09-12 Board Of Trustees Of The Univ Of Illinois エラストマースタンプへの接着の動的コントロールによるパターン転送印刷
WO2010065071A3 (en) * 2008-11-25 2010-10-28 Regents Of The University Of Minnesota Replication of patterned thin-film structures for use in plasmonics and metamaterials
EP2885138B1 (en) 2012-08-17 2023-05-24 Visual Physics, LLC A process for transferring microstructures to a final substrate

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JP2005537141A (ja) 2005-12-08
CN101327904A (zh) 2008-12-24
WO2004021084A3 (en) 2004-06-17
AU2003260094A8 (en) 2004-03-19
US6805809B2 (en) 2004-10-19
EP1539638A2 (en) 2005-06-15
US20050199584A1 (en) 2005-09-15
CN1684902A (zh) 2005-10-19
AU2003260094A1 (en) 2004-03-19
SG170619A1 (en) 2011-05-30
US20040040653A1 (en) 2004-03-04
CN100413778C (zh) 2008-08-27
KR20050052480A (ko) 2005-06-02

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