JP2005533254A - 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体 - Google Patents

被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体 Download PDF

Info

Publication number
JP2005533254A
JP2005533254A JP2004521866A JP2004521866A JP2005533254A JP 2005533254 A JP2005533254 A JP 2005533254A JP 2004521866 A JP2004521866 A JP 2004521866A JP 2004521866 A JP2004521866 A JP 2004521866A JP 2005533254 A JP2005533254 A JP 2005533254A
Authority
JP
Japan
Prior art keywords
contactor
electrical
interposer
assembly
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004521866A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005533254A5 (zh
Inventor
ドナルド ピー ザ セカンド リッチモンド
ジョヴァーン ジョヴァノヴィック
フランク オー ウーア
Original Assignee
エイアー テスト システムズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/197,133 external-priority patent/US6853209B1/en
Priority claimed from US10/197,104 external-priority patent/US6867608B2/en
Application filed by エイアー テスト システムズ filed Critical エイアー テスト システムズ
Publication of JP2005533254A publication Critical patent/JP2005533254A/ja
Publication of JP2005533254A5 publication Critical patent/JP2005533254A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2004521866A 2002-07-16 2003-07-15 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体 Pending JP2005533254A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/197,133 US6853209B1 (en) 2002-07-16 2002-07-16 Contactor assembly for testing electrical circuits
US10/197,104 US6867608B2 (en) 2002-07-16 2002-07-16 Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
PCT/US2003/022125 WO2004008163A2 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested

Publications (2)

Publication Number Publication Date
JP2005533254A true JP2005533254A (ja) 2005-11-04
JP2005533254A5 JP2005533254A5 (zh) 2006-08-17

Family

ID=30117843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004521866A Pending JP2005533254A (ja) 2002-07-16 2003-07-15 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体

Country Status (6)

Country Link
EP (1) EP1523685A2 (zh)
JP (1) JP2005533254A (zh)
KR (1) KR20050029215A (zh)
CN (1) CN100523826C (zh)
AU (1) AU2003249276A1 (zh)
WO (1) WO2004008163A2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020505584A (ja) * 2017-01-09 2020-02-20 デルタ・デザイン・インコーポレイテッドＤｅｌｔａ Ｄｅｓｉｇｎ， Ｉｎｃ． ソケット側表面熱システム
US11774486B2 (en) 2021-06-30 2023-10-03 Delta Design Inc. Temperature control system including contactor assembly

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI339737B (en) 2005-04-27 2011-04-01 Aehr Test Systems Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device
CN101051067B (zh) * 2006-04-03 2010-08-11 航天科工防御技术研究试验中心 电连接器综合检测控制装置设计方法
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (en) * 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
US7557594B2 (en) * 2007-08-14 2009-07-07 Electro Scientific Industries, Inc. Automated contact alignment tool
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
CN101545926B (zh) * 2008-03-25 2011-05-11 旺矽科技股份有限公司 探针测试装置
DE102009012021B4 (de) * 2009-03-10 2011-02-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Messvorrichtung zur elektrischen Vermessung einer einseitig an einer Messseite elektrisch kontaktierbaren Messstruktur
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
TWI440412B (zh) * 2011-12-28 2014-06-01 Princo Corp 超薄多層基板之封裝方法
CN103808979A (zh) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 用于承载待测试电子装置的治具
CN103808969A (zh) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 用于承载待测试电子装置的治具
CN105548859A (zh) * 2015-12-09 2016-05-04 上海精密计量测试研究所 用于环境测试的测试设备及方法
CN106200239B (zh) * 2016-09-14 2019-03-15 海信集团有限公司 光机照明系统
WO2018160557A1 (en) 2017-03-03 2018-09-07 Aehr Test Systems Electronics tester
EP4226165A1 (en) 2020-10-07 2023-08-16 AEHR Test Systems Electronics tester

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
JPH0763788A (ja) * 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法
US6028437A (en) * 1997-05-19 2000-02-22 Si Diamond Technology, Inc. Probe head assembly
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
JP2001013208A (ja) * 1999-06-30 2001-01-19 Mitsubishi Electric Corp 半導体テスト治工具

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020505584A (ja) * 2017-01-09 2020-02-20 デルタ・デザイン・インコーポレイテッドＤｅｌｔａ Ｄｅｓｉｇｎ， Ｉｎｃ． ソケット側表面熱システム
JP2022188088A (ja) * 2017-01-09 2022-12-20 デルタ・デザイン・インコーポレイテッド ソケット側表面熱システム
US11879910B2 (en) 2017-01-09 2024-01-23 Delta Design, Inc. Socket side thermal system
US11774486B2 (en) 2021-06-30 2023-10-03 Delta Design Inc. Temperature control system including contactor assembly

Also Published As

Publication number Publication date
AU2003249276A8 (en) 2004-02-02
CN1668929A (zh) 2005-09-14
WO2004008163A2 (en) 2004-01-22
CN100523826C (zh) 2009-08-05
AU2003249276A1 (en) 2004-02-02
EP1523685A2 (en) 2005-04-20
WO2004008163A3 (en) 2004-06-10
KR20050029215A (ko) 2005-03-24

Similar Documents

Publication Publication Date Title
US7511521B2 (en) Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
JP2005533254A (ja) 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体
JP4704426B2 (ja) 電気的接続装置、その製造方法および電気的接続装置
US5739050A (en) Method and apparatus for assembling a semiconductor package for testing
KR101258101B1 (ko) 프로브 카드
US7872482B2 (en) High density interconnect system having rapid fabrication cycle
EP1364221B1 (en) Planarizing interposer
US7471096B2 (en) Contactor for electronic parts and a contact method
US7301358B2 (en) Contactor assembly for testing electrical circuits
KR20080076992A (ko) 프로브의 배향을 조정하는 장치 및 방법
WO2005069019A1 (ja) プローブカード
WO2008015962A1 (fr) Mécanisme de réglage du parallélisme d&#39;une carte sonde
US20080030211A1 (en) Active probe contact array management
US7282934B2 (en) Flexible microcircuit space transformer assembly
JPWO2008114464A1 (ja) 電気的接続装置
KR101181639B1 (ko) 프로브 카드를 평탄화하는 장치 및 상기 장치를 사용하는방법
WO2008114973A1 (en) Probe card having planarization means
JPH08227769A (ja) Ｉｃソケット
KR100906345B1 (ko) 반도체 검사 장치의 프로브 카드 및 그 프로브 카드에서의프로브 블록 위치 보정 방법
JP3500834B2 (ja) 半導体試験装置
KR100920790B1 (ko) 프로브 조립체, 그 제조방법 및 전기적 접속장치
KR100906344B1 (ko) 프로브 카드
JPH06331695A (ja) 半導体チップテスト用ソケット

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060703

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060703

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090302

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090803