JP2005532595A - ドライフィルムレジストのための熱安定性光硬化性樹脂組成物 - Google Patents

ドライフィルムレジストのための熱安定性光硬化性樹脂組成物 Download PDF

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Publication number
JP2005532595A
JP2005532595A JP2004520441A JP2004520441A JP2005532595A JP 2005532595 A JP2005532595 A JP 2005532595A JP 2004520441 A JP2004520441 A JP 2004520441A JP 2004520441 A JP2004520441 A JP 2004520441A JP 2005532595 A JP2005532595 A JP 2005532595A
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JP
Japan
Prior art keywords
alkyl
weight
dry film
film resist
bis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004520441A
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English (en)
Japanese (ja)
Other versions
JP2005532595A5 (https=
Inventor
英隆 岡
テイラー，ジェームス・フィリップ
大和　真樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Schweiz AG
Original Assignee
Ciba Spezialitaetenchemie Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Spezialitaetenchemie Holding AG filed Critical Ciba Spezialitaetenchemie Holding AG
Publication of JP2005532595A publication Critical patent/JP2005532595A/ja
Publication of JP2005532595A5 publication Critical patent/JP2005532595A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2004520441A 2002-07-10 2003-07-01 ドライフィルムレジストのための熱安定性光硬化性樹脂組成物 Pending JP2005532595A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02405581 2002-07-10
PCT/EP2003/006954 WO2004008251A1 (en) 2002-07-10 2003-07-01 Heat stable photocurable resin composition for dry film resist

Publications (2)

Publication Number Publication Date
JP2005532595A true JP2005532595A (ja) 2005-10-27
JP2005532595A5 JP2005532595A5 (https=) 2006-08-17

Family

ID=30011298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004520441A Pending JP2005532595A (ja) 2002-07-10 2003-07-01 ドライフィルムレジストのための熱安定性光硬化性樹脂組成物

Country Status (11)

Country Link
US (1) US7198884B2 (https=)
EP (1) EP1520209A1 (https=)
JP (1) JP2005532595A (https=)
KR (1) KR20050025324A (https=)
CN (1) CN1666149A (https=)
AU (1) AU2003250865A1 (https=)
BR (1) BR0312652A (https=)
CA (1) CA2491678A1 (https=)
MX (1) MXPA05000439A (https=)
TW (1) TWI279645B (https=)
WO (1) WO2004008251A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007114452A (ja) * 2005-10-20 2007-05-10 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
JP2008516418A (ja) * 2004-09-17 2008-05-15 イーストマン コダック カンパニー 除去可能な放射線感光材料を用いた構造化表面
KR20220102429A (ko) * 2021-01-13 2022-07-20 코오롱인더스트리 주식회사 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 레지스터 패턴, 회로기판, 및 디스플레이 장치

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060144270A1 (en) * 2005-01-04 2006-07-06 Prakash Seth Photothermally sensitive compositions and system for CTP imaging processes
JP4668111B2 (ja) * 2005-12-26 2011-04-13 富士フイルム株式会社 重合性組成物及びそれを用いた平版印刷版原版
US7772355B2 (en) * 2008-01-28 2010-08-10 The United States Of America As Represented By The Secretary Of The Navy Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds
US20090191491A1 (en) * 2008-01-28 2009-07-30 John Ganjei Method of Creating an Image in a Photoresist Laminate
KR100913058B1 (ko) * 2008-08-25 2009-08-20 금호석유화학 주식회사 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 반도체소자
KR101811116B1 (ko) * 2013-05-09 2017-12-20 캐논 가부시끼가이샤 화합물, 광경화성 조성물, 및 광경화성 조성물을 사용하여 패턴 형상을 갖는 막, 광학 부품, 회로 기판, 전자 부품을 제조하는 방법, 및 경화물
US9085692B1 (en) 2014-02-25 2015-07-21 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Synthesis of oligomeric divinyldialkylsilane containing compositions
WO2017057584A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。
US9944816B2 (en) * 2016-06-02 2018-04-17 Ppg Coatings Europe B.V. Crosslinkable binders for solvent based intumescent coatings
CN108255014B (zh) * 2017-12-11 2019-07-02 珠海市能动科技光学产业有限公司 一种含有改性聚氨酯和光固化单体的干膜光阻剂
CN112099312A (zh) * 2020-10-19 2020-12-18 河源诚展科技有限公司 一种光致抗蚀干膜及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU76074A1 (https=) * 1976-10-26 1978-05-16
JPS6057340A (ja) * 1983-09-08 1985-04-03 Fuji Photo Film Co Ltd 焼出し性組成物
DE3447357A1 (de) * 1984-12-24 1986-07-03 Basf Ag, 6700 Ludwigshafen Trockenfilmresist und verfahren zur herstellung von resistmustern

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008516418A (ja) * 2004-09-17 2008-05-15 イーストマン コダック カンパニー 除去可能な放射線感光材料を用いた構造化表面
JP2007114452A (ja) * 2005-10-20 2007-05-10 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
KR20220102429A (ko) * 2021-01-13 2022-07-20 코오롱인더스트리 주식회사 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 레지스터 패턴, 회로기판, 및 디스플레이 장치
KR102646265B1 (ko) 2021-01-13 2024-03-08 코오롱인더스트리 주식회사 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 레지스터 패턴, 회로기판, 및 디스플레이 장치

Also Published As

Publication number Publication date
WO2004008251A1 (en) 2004-01-22
EP1520209A1 (en) 2005-04-06
US7198884B2 (en) 2007-04-03
AU2003250865A1 (en) 2004-02-02
BR0312652A (pt) 2005-04-26
US20050260520A1 (en) 2005-11-24
MXPA05000439A (es) 2005-03-23
CA2491678A1 (en) 2004-01-22
TW200415442A (en) 2004-08-16
KR20050025324A (ko) 2005-03-14
CN1666149A (zh) 2005-09-07
TWI279645B (en) 2007-04-21

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