CN1666149A - 用于干膜抗蚀剂的热稳定的光固化树脂组合物 - Google Patents

用于干膜抗蚀剂的热稳定的光固化树脂组合物 Download PDF

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Publication number
CN1666149A
CN1666149A CN038160617A CN03816061A CN1666149A CN 1666149 A CN1666149 A CN 1666149A CN 038160617 A CN038160617 A CN 038160617A CN 03816061 A CN03816061 A CN 03816061A CN 1666149 A CN1666149 A CN 1666149A
Authority
CN
China
Prior art keywords
alkyl
dry film
bis
phenyl
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN038160617A
Other languages
English (en)
Chinese (zh)
Inventor
H·奥卡
J·P·泰勒
M·奥瓦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Schweiz AG
Original Assignee
Ciba Spezialitaetenchemie Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Spezialitaetenchemie Holding AG filed Critical Ciba Spezialitaetenchemie Holding AG
Publication of CN1666149A publication Critical patent/CN1666149A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN038160617A 2002-07-10 2003-07-01 用于干膜抗蚀剂的热稳定的光固化树脂组合物 Pending CN1666149A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02405581.6 2002-07-10
EP02405581 2002-07-10

Publications (1)

Publication Number Publication Date
CN1666149A true CN1666149A (zh) 2005-09-07

Family

ID=30011298

Family Applications (1)

Application Number Title Priority Date Filing Date
CN038160617A Pending CN1666149A (zh) 2002-07-10 2003-07-01 用于干膜抗蚀剂的热稳定的光固化树脂组合物

Country Status (11)

Country Link
US (1) US7198884B2 (https=)
EP (1) EP1520209A1 (https=)
JP (1) JP2005532595A (https=)
KR (1) KR20050025324A (https=)
CN (1) CN1666149A (https=)
AU (1) AU2003250865A1 (https=)
BR (1) BR0312652A (https=)
CA (1) CA2491678A1 (https=)
MX (1) MXPA05000439A (https=)
TW (1) TWI279645B (https=)
WO (1) WO2004008251A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105189448A (zh) * 2013-05-09 2015-12-23 佳能株式会社 化合物，光固化性组合物，和通过使用所述光固化性组合物的图案化膜、光学组件、电路板、电子组件的制造方法，和固化物
CN108255014A (zh) * 2017-12-11 2018-07-06 珠海市能动科技光学产业有限公司 一种含有改性聚氨酯和光固化单体的干膜光阻剂
CN112099312A (zh) * 2020-10-19 2020-12-18 河源诚展科技有限公司 一种光致抗蚀干膜及其制备方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060144270A1 (en) * 2005-01-04 2006-07-06 Prakash Seth Photothermally sensitive compositions and system for CTP imaging processes
US8796583B2 (en) * 2004-09-17 2014-08-05 Eastman Kodak Company Method of forming a structured surface using ablatable radiation sensitive material
JP4761923B2 (ja) * 2005-10-20 2011-08-31 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体
JP4668111B2 (ja) * 2005-12-26 2011-04-13 富士フイルム株式会社 重合性組成物及びそれを用いた平版印刷版原版
US7772355B2 (en) * 2008-01-28 2010-08-10 The United States Of America As Represented By The Secretary Of The Navy Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds
US20090191491A1 (en) * 2008-01-28 2009-07-30 John Ganjei Method of Creating an Image in a Photoresist Laminate
KR100913058B1 (ko) * 2008-08-25 2009-08-20 금호석유화학 주식회사 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 반도체소자
US9085692B1 (en) 2014-02-25 2015-07-21 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Synthesis of oligomeric divinyldialkylsilane containing compositions
WO2017057584A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。
US9944816B2 (en) * 2016-06-02 2018-04-17 Ppg Coatings Europe B.V. Crosslinkable binders for solvent based intumescent coatings
KR102646265B1 (ko) * 2021-01-13 2024-03-08 코오롱인더스트리 주식회사 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 레지스터 패턴, 회로기판, 및 디스플레이 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU76074A1 (https=) * 1976-10-26 1978-05-16
JPS6057340A (ja) * 1983-09-08 1985-04-03 Fuji Photo Film Co Ltd 焼出し性組成物
DE3447357A1 (de) * 1984-12-24 1986-07-03 Basf Ag, 6700 Ludwigshafen Trockenfilmresist und verfahren zur herstellung von resistmustern

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105189448A (zh) * 2013-05-09 2015-12-23 佳能株式会社 化合物，光固化性组合物，和通过使用所述光固化性组合物的图案化膜、光学组件、电路板、电子组件的制造方法，和固化物
US9593170B2 (en) 2013-05-09 2017-03-14 Canon Kabushiki Kaisha Compound, photocurable composition, and methods for producing patterned film, optical component, circuit board, electronic component by using the photocurable composition, and cured product
CN108255014A (zh) * 2017-12-11 2018-07-06 珠海市能动科技光学产业有限公司 一种含有改性聚氨酯和光固化单体的干膜光阻剂
CN112099312A (zh) * 2020-10-19 2020-12-18 河源诚展科技有限公司 一种光致抗蚀干膜及其制备方法

Also Published As

Publication number Publication date
WO2004008251A1 (en) 2004-01-22
EP1520209A1 (en) 2005-04-06
US7198884B2 (en) 2007-04-03
AU2003250865A1 (en) 2004-02-02
BR0312652A (pt) 2005-04-26
US20050260520A1 (en) 2005-11-24
MXPA05000439A (es) 2005-03-23
CA2491678A1 (en) 2004-01-22
TW200415442A (en) 2004-08-16
JP2005532595A (ja) 2005-10-27
KR20050025324A (ko) 2005-03-14
TWI279645B (en) 2007-04-21

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