TWI279645B - Heat stable photocurable resin composition for dry film resist - Google Patents
Heat stable photocurable resin composition for dry film resist Download PDFInfo
- Publication number
- TWI279645B TWI279645B TW092118721A TW92118721A TWI279645B TW I279645 B TWI279645 B TW I279645B TW 092118721 A TW092118721 A TW 092118721A TW 92118721 A TW92118721 A TW 92118721A TW I279645 B TWI279645 B TW I279645B
- Authority
- TW
- Taiwan
- Prior art keywords
- alkyl
- dry film
- methyl
- bis
- phenyl
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02405581 | 2002-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200415442A TW200415442A (en) | 2004-08-16 |
| TWI279645B true TWI279645B (en) | 2007-04-21 |
Family
ID=30011298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092118721A TWI279645B (en) | 2002-07-10 | 2003-07-09 | Heat stable photocurable resin composition for dry film resist |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7198884B2 (https=) |
| EP (1) | EP1520209A1 (https=) |
| JP (1) | JP2005532595A (https=) |
| KR (1) | KR20050025324A (https=) |
| CN (1) | CN1666149A (https=) |
| AU (1) | AU2003250865A1 (https=) |
| BR (1) | BR0312652A (https=) |
| CA (1) | CA2491678A1 (https=) |
| MX (1) | MXPA05000439A (https=) |
| TW (1) | TWI279645B (https=) |
| WO (1) | WO2004008251A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060144270A1 (en) * | 2005-01-04 | 2006-07-06 | Prakash Seth | Photothermally sensitive compositions and system for CTP imaging processes |
| US8796583B2 (en) * | 2004-09-17 | 2014-08-05 | Eastman Kodak Company | Method of forming a structured surface using ablatable radiation sensitive material |
| JP4761923B2 (ja) * | 2005-10-20 | 2011-08-31 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び積層体 |
| JP4668111B2 (ja) * | 2005-12-26 | 2011-04-13 | 富士フイルム株式会社 | 重合性組成物及びそれを用いた平版印刷版原版 |
| US7772355B2 (en) * | 2008-01-28 | 2010-08-10 | The United States Of America As Represented By The Secretary Of The Navy | Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds |
| US20090191491A1 (en) * | 2008-01-28 | 2009-07-30 | John Ganjei | Method of Creating an Image in a Photoresist Laminate |
| KR100913058B1 (ko) * | 2008-08-25 | 2009-08-20 | 금호석유화학 주식회사 | 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 반도체소자 |
| KR101811116B1 (ko) * | 2013-05-09 | 2017-12-20 | 캐논 가부시끼가이샤 | 화합물, 광경화성 조성물, 및 광경화성 조성물을 사용하여 패턴 형상을 갖는 막, 광학 부품, 회로 기판, 전자 부품을 제조하는 방법, 및 경화물 |
| US9085692B1 (en) | 2014-02-25 | 2015-07-21 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Synthesis of oligomeric divinyldialkylsilane containing compositions |
| WO2017057584A1 (ja) * | 2015-09-30 | 2017-04-06 | 富士フイルム株式会社 | 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。 |
| US9944816B2 (en) * | 2016-06-02 | 2018-04-17 | Ppg Coatings Europe B.V. | Crosslinkable binders for solvent based intumescent coatings |
| CN108255014B (zh) * | 2017-12-11 | 2019-07-02 | 珠海市能动科技光学产业有限公司 | 一种含有改性聚氨酯和光固化单体的干膜光阻剂 |
| CN112099312A (zh) * | 2020-10-19 | 2020-12-18 | 河源诚展科技有限公司 | 一种光致抗蚀干膜及其制备方法 |
| KR102646265B1 (ko) * | 2021-01-13 | 2024-03-08 | 코오롱인더스트리 주식회사 | 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 레지스터 패턴, 회로기판, 및 디스플레이 장치 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LU76074A1 (https=) * | 1976-10-26 | 1978-05-16 | ||
| JPS6057340A (ja) * | 1983-09-08 | 1985-04-03 | Fuji Photo Film Co Ltd | 焼出し性組成物 |
| DE3447357A1 (de) * | 1984-12-24 | 1986-07-03 | Basf Ag, 6700 Ludwigshafen | Trockenfilmresist und verfahren zur herstellung von resistmustern |
-
2003
- 2003-07-01 JP JP2004520441A patent/JP2005532595A/ja active Pending
- 2003-07-01 CA CA002491678A patent/CA2491678A1/en not_active Abandoned
- 2003-07-01 MX MXPA05000439A patent/MXPA05000439A/es active IP Right Grant
- 2003-07-01 CN CN038160617A patent/CN1666149A/zh active Pending
- 2003-07-01 US US10/520,701 patent/US7198884B2/en not_active Expired - Fee Related
- 2003-07-01 WO PCT/EP2003/006954 patent/WO2004008251A1/en not_active Ceased
- 2003-07-01 KR KR1020057000324A patent/KR20050025324A/ko not_active Ceased
- 2003-07-01 BR BR0312652-8A patent/BR0312652A/pt not_active Application Discontinuation
- 2003-07-01 AU AU2003250865A patent/AU2003250865A1/en not_active Abandoned
- 2003-07-01 EP EP03763670A patent/EP1520209A1/en not_active Withdrawn
- 2003-07-09 TW TW092118721A patent/TWI279645B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004008251A1 (en) | 2004-01-22 |
| EP1520209A1 (en) | 2005-04-06 |
| US7198884B2 (en) | 2007-04-03 |
| AU2003250865A1 (en) | 2004-02-02 |
| BR0312652A (pt) | 2005-04-26 |
| US20050260520A1 (en) | 2005-11-24 |
| MXPA05000439A (es) | 2005-03-23 |
| CA2491678A1 (en) | 2004-01-22 |
| TW200415442A (en) | 2004-08-16 |
| JP2005532595A (ja) | 2005-10-27 |
| KR20050025324A (ko) | 2005-03-14 |
| CN1666149A (zh) | 2005-09-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |