JP2005517884A - 圧力強化ダイヤフラム弁 - Google Patents

圧力強化ダイヤフラム弁 Download PDF

Info

Publication number
JP2005517884A
JP2005517884A JP2003570046A JP2003570046A JP2005517884A JP 2005517884 A JP2005517884 A JP 2005517884A JP 2003570046 A JP2003570046 A JP 2003570046A JP 2003570046 A JP2003570046 A JP 2003570046A JP 2005517884 A JP2005517884 A JP 2005517884A
Authority
JP
Japan
Prior art keywords
pressure
diaphragm
chamber
valve
enhancement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003570046A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005517884A5 (enExample
Inventor
シェイデイ,アレクセイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JP2005517884A publication Critical patent/JP2005517884A/ja
Publication of JP2005517884A5 publication Critical patent/JP2005517884A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • F16K7/17Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Fluid Pressure (AREA)
  • Fluid-Driven Valves (AREA)
JP2003570046A 2002-02-15 2003-02-12 圧力強化ダイヤフラム弁 Pending JP2005517884A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35766402P 2002-02-15 2002-02-15
PCT/US2003/004555 WO2003071173A1 (en) 2002-02-15 2003-02-12 Pressure enchanced diaphragm valve

Publications (2)

Publication Number Publication Date
JP2005517884A true JP2005517884A (ja) 2005-06-16
JP2005517884A5 JP2005517884A5 (enExample) 2006-03-30

Family

ID=27757656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003570046A Pending JP2005517884A (ja) 2002-02-15 2003-02-12 圧力強化ダイヤフラム弁

Country Status (5)

Country Link
US (1) US20030155541A1 (enExample)
JP (1) JP2005517884A (enExample)
AU (1) AU2003215238A1 (enExample)
TW (1) TWI276753B (enExample)
WO (1) WO2003071173A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014114888A (ja) * 2012-12-10 2014-06-26 Advance Denki Kogyo Kk ダイヤフラム式弁装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2008011599A (es) * 2006-03-15 2009-02-10 Norgren Gmbh Valvula de diafragma de una pieza de membrana doble.
GB2456563B (en) * 2008-01-18 2009-12-02 Renium Ltd Flow control device using a diaphragm
JP6094679B2 (ja) * 2013-09-02 2017-03-15 株式会社島津製作所 圧力制御バルブ及び超臨界流体クロマトグラフ
US9909682B2 (en) * 2014-01-07 2018-03-06 Sundew Technologies Llc Fluid-actuated flow control valves
DE102014014740A1 (de) * 2014-10-09 2016-04-14 A.RAYMOND et Cie. SCS Absperrkörper für ein Ventil und Ventil mit einem derartigen Absperrkörper
US10533669B2 (en) * 2016-12-01 2020-01-14 Baker Hughes, A Ge Company, Llc Bi-directional flow control valve
CN110131585A (zh) * 2019-05-31 2019-08-16 江苏仅一联合智造有限公司 一种奶粉灌装生产设备用大流量多分支负压控制装置
US11236846B1 (en) * 2019-07-11 2022-02-01 Facebook Technologies, Llc Fluidic control: using exhaust as a control mechanism
US11867318B2 (en) * 2019-10-02 2024-01-09 Smc Corporation High-pressure fluid discharge device
CN113287942A (zh) * 2021-07-09 2021-08-24 浙江创建厨具有限公司 一种摩卡壶用增压阀
WO2025052281A1 (en) * 2023-09-08 2025-03-13 Lake Products Limited A diaphragm seal

Family Cites Families (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744660A (en) * 1970-12-30 1973-07-10 Combustion Eng Shield for nuclear reactor vessel
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
US4341592A (en) * 1975-08-04 1982-07-27 Texas Instruments Incorporated Method for removing photoresist layer from substrate by ozone treatment
US4029517A (en) * 1976-03-01 1977-06-14 Autosonics Inc. Vapor degreasing system having a divider wall between upper and lower vapor zone portions
US4091643A (en) * 1976-05-14 1978-05-30 Ama Universal S.P.A. Circuit for the recovery of solvent vapor evolved in the course of a cleaning cycle in dry-cleaning machines or plants, and for the de-pressurizing of such machines
US4367140A (en) * 1979-11-05 1983-01-04 Sykes Ocean Water Ltd. Reverse osmosis liquid purification apparatus
US4682937A (en) * 1981-11-12 1987-07-28 The Coca-Cola Company Double-acting diaphragm pump and reversing mechanism therefor
US4522788A (en) * 1982-03-05 1985-06-11 Leco Corporation Proximate analyzer
FR2536433A1 (fr) * 1982-11-19 1984-05-25 Privat Michel Procede et installation de nettoyage et decontamination particulaire de vetements, notamment de vetements contamines par des particules radioactives
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
US4749440A (en) * 1985-08-28 1988-06-07 Fsi Corporation Gaseous process and apparatus for removing films from substrates
US4827867A (en) * 1985-11-28 1989-05-09 Daikin Industries, Ltd. Resist developing apparatus
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPS63157870A (ja) * 1986-12-19 1988-06-30 Anelva Corp 基板処理装置
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US4924892A (en) * 1987-07-28 1990-05-15 Mazda Motor Corporation Painting truck washing system
DE3725565A1 (de) * 1987-08-01 1989-02-16 Peter Weil Verfahren und anlage zum entlacken von gegenstaenden mit einem tauchbehaelter mit loesungsmittel
US5105556A (en) * 1987-08-12 1992-04-21 Hitachi, Ltd. Vapor washing process and apparatus
US4838476A (en) * 1987-11-12 1989-06-13 Fluocon Technologies Inc. Vapour phase treatment process and apparatus
US4823976A (en) * 1988-05-04 1989-04-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Quick actuating closure
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US5185296A (en) * 1988-07-26 1993-02-09 Matsushita Electric Industrial Co., Ltd. Method for forming a dielectric thin film or its pattern of high accuracy on a substrate
US5051135A (en) * 1989-01-30 1991-09-24 Kabushiki Kaisha Tiyoda Seisakusho Cleaning method using a solvent while preventing discharge of solvent vapors to the environment
US5213485A (en) * 1989-03-10 1993-05-25 Wilden James K Air driven double diaphragm pump
US5288333A (en) * 1989-05-06 1994-02-22 Dainippon Screen Mfg. Co., Ltd. Wafer cleaning method and apparatus therefore
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US4983223A (en) * 1989-10-24 1991-01-08 Chenpatents Apparatus and method for reducing solvent vapor losses
US5226441A (en) * 1989-11-13 1993-07-13 Cmb Industries Backflow preventor with adjustable outflow direction
US5217043A (en) * 1990-04-19 1993-06-08 Milic Novakovic Control valve
DE4018464A1 (de) * 1990-06-08 1991-12-12 Ott Kg Lewa Membran fuer eine hydraulisch angetriebene membranpumpe
DE4106180A1 (de) * 1990-10-08 1992-04-09 Dirk Dipl Ing Budde Doppel-membranpumpe
CH684402A5 (de) * 1991-03-04 1994-09-15 Xorella Ag Wettingen Vorrichtung zum Verschieben und Schwenken eines Behälter-Verschlusses.
US5195878A (en) * 1991-05-20 1993-03-23 Hytec Flow Systems Air-operated high-temperature corrosive liquid pump
DE9112761U1 (de) * 1991-10-14 1992-04-09 Krones Ag Hermann Kronseder Maschinenfabrik, 8402 Neutraubling Gefäßverschließmaschine
US5221019A (en) * 1991-11-07 1993-06-22 Hahn & Clay Remotely operable vessel cover positioner
US5190373A (en) * 1991-12-24 1993-03-02 Union Carbide Chemicals & Plastics Technology Corporation Method, apparatus, and article for forming a heated, pressurized mixture of fluids
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
US5313965A (en) * 1992-06-01 1994-05-24 Hughes Aircraft Company Continuous operation supercritical fluid treatment process and system
JPH0613361A (ja) * 1992-06-26 1994-01-21 Tokyo Electron Ltd 処理装置
US5401322A (en) * 1992-06-30 1995-03-28 Southwest Research Institute Apparatus and method for cleaning articles utilizing supercritical and near supercritical fluids
US5267455A (en) * 1992-07-13 1993-12-07 The Clorox Company Liquid/supercritical carbon dioxide dry cleaning system
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
US5746008A (en) * 1992-07-29 1998-05-05 Shinko Electric Co., Ltd. Electronic substrate processing system using portable closed containers
KR100304127B1 (ko) * 1992-07-29 2001-11-30 이노마다 시게오 가반식 밀폐 컨테이너를 사용한 전자기판 처리시스템과 그의 장치
US5355901A (en) * 1992-10-27 1994-10-18 Autoclave Engineers, Ltd. Apparatus for supercritical cleaning
US5328722A (en) * 1992-11-06 1994-07-12 Applied Materials, Inc. Metal chemical vapor deposition process using a shadow ring
US5433334A (en) * 1993-09-08 1995-07-18 Reneau; Raymond P. Closure member for pressure vessel
US5377705A (en) * 1993-09-16 1995-01-03 Autoclave Engineers, Inc. Precision cleaning system
US5417768A (en) * 1993-12-14 1995-05-23 Autoclave Engineers, Inc. Method of cleaning workpiece with solvent and then with liquid carbon dioxide
US5509431A (en) * 1993-12-14 1996-04-23 Snap-Tite, Inc. Precision cleaning vessel
DE69520687T2 (de) * 1994-11-09 2001-08-23 R.R. Street & Co., Inc. Verfahren und system zur aufbereitung von unter druck stehenden flüssigen lösungsmitteln zur reinigung von substraten
US5505219A (en) * 1994-11-23 1996-04-09 Litton Systems, Inc. Supercritical fluid recirculating system for a precision inertial instrument parts cleaner
DE4443778A1 (de) * 1994-12-08 1996-06-20 Abel Gmbh & Co Doppelmembranpumpe
US5556497A (en) * 1995-01-09 1996-09-17 Essef Corporation Fitting installation process
US5629918A (en) * 1995-01-20 1997-05-13 The Regents Of The University Of California Electromagnetically actuated micromachined flap
US5644855A (en) * 1995-04-06 1997-07-08 Air Products And Chemicals, Inc. Cryogenically purged mini environment
US6239038B1 (en) * 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
US6037277A (en) * 1995-11-16 2000-03-14 Texas Instruments Incorporated Limited-volume apparatus and method for forming thin film aerogels on semiconductor substrates
JP3955340B2 (ja) * 1996-04-26 2007-08-08 株式会社神戸製鋼所 高温高圧ガス処理装置
DK9600149U3 (da) * 1996-05-01 1997-09-12 Moerch & Soenner A S Dækselaggregat
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US5706319A (en) * 1996-08-12 1998-01-06 Joseph Oat Corporation Reactor vessel seal and method for temporarily sealing a reactor pressure vessel from the refueling canal
US5881577A (en) * 1996-09-09 1999-03-16 Air Liquide America Corporation Pressure-swing absorption based cleaning methods and systems
US5928389A (en) * 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
US5888050A (en) * 1996-10-30 1999-03-30 Supercritical Fluid Technologies, Inc. Precision high pressure control assembly
JPH10144757A (ja) * 1996-11-08 1998-05-29 Dainippon Screen Mfg Co Ltd 基板処理システム
JP3437734B2 (ja) * 1997-02-26 2003-08-18 富士通株式会社 製造装置
JPH10261687A (ja) * 1997-03-18 1998-09-29 Furontetsuku:Kk 半導体等製造装置
JPH10288158A (ja) * 1997-04-10 1998-10-27 Kobe Steel Ltd ピストン式ガス圧縮機及びガス圧縮設備
JP3194036B2 (ja) * 1997-09-17 2001-07-30 東京エレクトロン株式会社 乾燥処理装置及び乾燥処理方法
US6056008A (en) * 1997-09-22 2000-05-02 Fisher Controls International, Inc. Intelligent pressure regulator
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US5904737A (en) * 1997-11-26 1999-05-18 Mve, Inc. Carbon dioxide dry cleaning system
US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6453924B1 (en) * 2000-07-24 2002-09-24 Advanced Technology Materials, Inc. Fluid distribution system and process, and semiconductor fabrication facility utilizing same
KR100452542B1 (ko) * 1998-04-14 2004-10-12 가부시끼가이샤가이죠 세정물 건조장치 및 건조방법
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
US6085935A (en) * 1998-08-10 2000-07-11 Alliance Laundry Systems Llc Pressure vessel door operating apparatus
US6344174B1 (en) * 1999-01-25 2002-02-05 Mine Safety Appliances Company Gas sensor
EP1024524A2 (en) * 1999-01-27 2000-08-02 Matsushita Electric Industrial Co., Ltd. Deposition of dielectric layers using supercritical CO2
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
US6241825B1 (en) * 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6334266B1 (en) * 1999-09-20 2002-01-01 S.C. Fluids, Inc. Supercritical fluid drying system and method of use
US6508259B1 (en) * 1999-08-05 2003-01-21 S.C. Fluids, Inc. Inverted pressure vessel with horizontal through loading
US6251250B1 (en) * 1999-09-03 2001-06-26 Arthur Keigler Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well
US6228563B1 (en) * 1999-09-17 2001-05-08 Gasonics International Corporation Method and apparatus for removing post-etch residues and other adherent matrices
US6558475B1 (en) * 2000-04-10 2003-05-06 International Business Machines Corporation Process for cleaning a workpiece using supercritical carbon dioxide
CA2421536A1 (en) * 2000-09-07 2002-03-14 Cmb Industries, Inc. Short-length reduced-pressure backflow preventor
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
US6418956B1 (en) * 2000-11-15 2002-07-16 Plast-O-Matic Valves, Inc. Pressure controller
US6561220B2 (en) * 2001-04-23 2003-05-13 International Business Machines, Corp. Apparatus and method for increasing throughput in fluid processing
US6564826B2 (en) * 2001-07-24 2003-05-20 Der-Fan Shen Flow regulator for water pump
US6561767B2 (en) * 2001-08-01 2003-05-13 Berger Instruments, Inc. Converting a pump for use in supercritical fluid chromatography
US6561481B1 (en) * 2001-08-13 2003-05-13 Filonczuk Michael A Fluid flow control apparatus for controlling and delivering fluid at a continuously variable flow rate
US6550484B1 (en) * 2001-12-07 2003-04-22 Novellus Systems, Inc. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
US6521466B1 (en) * 2002-04-17 2003-02-18 Paul Castrucci Apparatus and method for semiconductor wafer test yield enhancement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014114888A (ja) * 2012-12-10 2014-06-26 Advance Denki Kogyo Kk ダイヤフラム式弁装置

Also Published As

Publication number Publication date
WO2003071173A1 (en) 2003-08-28
US20030155541A1 (en) 2003-08-21
AU2003215238A1 (en) 2003-09-09
TW200304993A (en) 2003-10-16
TWI276753B (en) 2007-03-21

Similar Documents

Publication Publication Date Title
JP5762744B2 (ja) 複動形流体流れ方向制御弁
KR102092807B1 (ko) 용접된 다이어프램 시트 캐리어를 갖는 다이어프램 밸브
JP2005517884A (ja) 圧力強化ダイヤフラム弁
RU2461740C2 (ru) Мембранный исполнительный механизм
US6659247B2 (en) Pneumatic volume booster for valve positioner
US8807168B2 (en) Volume booster with seat load bias
JPH0434275A (ja) 常閉型流体制御バルブ
US20050139796A1 (en) Pneumatically actuated valve
JP2002530611A (ja) ピボットバルブ装置、特に増幅器
US4516604A (en) Pilot operated supply and waste control valve
US20100138051A1 (en) Method and arrangement for actuation
JP4102329B2 (ja) 正圧及び負圧を送り出す能力を備えた比例型圧力調整器
US5758862A (en) Solenoid pump operated valve
JP3027108B2 (ja) 流体送給装置のためのマイクロバルブ
JP5914489B2 (ja) 変動する非対称性を有するボリュームブースタ
JP2003247658A (ja) 弁装置および粉体連続供給装置
US9535428B2 (en) Spring controlled valve
CN110214244B (zh) 阀用致动器和具备它的隔膜阀
JP2002229650A (ja) スペーサ型減圧弁
JP2003049962A (ja) 分岐弁
JP5006619B2 (ja) 電磁弁及び空気圧式マッサージ装置
DK1174649T3 (da) Ventil til en trykbeholder
KR20180009437A (ko) 글로브 밸브용 액츄에이터
CN101263329A (zh) 用于促动的方法和设备
US20100148100A1 (en) Media isolated piezo valve

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060213

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090421

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20091201