JP2005508403A5 - - Google Patents

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Publication number
JP2005508403A5
JP2005508403A5 JP2003527018A JP2003527018A JP2005508403A5 JP 2005508403 A5 JP2005508403 A5 JP 2005508403A5 JP 2003527018 A JP2003527018 A JP 2003527018A JP 2003527018 A JP2003527018 A JP 2003527018A JP 2005508403 A5 JP2005508403 A5 JP 2005508403A5
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JP
Japan
Prior art keywords
substrate
space
joint
groove portion
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003527018A
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English (en)
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JP2005508403A (ja
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Publication date
Priority claimed from US10/234,902 external-priority patent/US6887914B2/en
Application filed filed Critical
Publication of JP2005508403A publication Critical patent/JP2005508403A/ja
Publication of JP2005508403A5 publication Critical patent/JP2005508403A5/ja
Pending legal-status Critical Current

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Description

【特許請求の範囲】
【請求項1】 ジョイントの製造方法であって、
a)溝部を有するように形成された第1の基板を用意するステップと、
b)前記溝部内に第2の基板の端部を配することで、前記第1の基板と前記溝部との間に空間が形成されるようにするステップと、
c)前記空間を、
1)エチレンコポリマー
2)エポキシ樹脂、及び
3)硬化剤
を含有する材料で充填するステップと、
d)前記材料を加熱して、前記材料が前記空間に流入し、カバー及び充填するようにしてジョイントを形成するステップと、
を有する方法。
【請求項2】 前記ジョイントは、自動車のヘムフランジジョイントであり、前記第1の基板は溝部を有するように形成され、前記第2の基板の端部を前記溝部内に配され、前記材料は、前記第1の基板と第2の基板との間の前記空間に配される、請求項1記載の方法。
【請求項3】 前記材料は、再加熱されても、従来のホットメルト接着剤とは異なり、再溶解して流動することがない、請求項1又は2記載の方法。
【請求項4】 溶接作業時に加熱がなされる、請求項1〜3のいずれかに記載の方法。
【請求項5】 自動車のペインティング作業時に前記加熱がなされる、請求項1〜3のいずれかに記載の方法。
【請求項6】 前記エチレンコポリマーは、エチレンメタクリレートコポリマーである、請求項1〜5のいずれかに記載の方法。
【請求項7】 前記エポキシ樹脂は、ビスフェノールA樹脂である、請求項1〜6のいずれかに記載の方法。
【請求項8】 前記材料は発泡剤を有し、当該発泡剤は、アゾジカルボンアミドである、請求項1〜7のいずれかに記載の方法。
【請求項】 更に硬化促進剤を含む、請求項1〜のいずれかに記載の方法。
【請求項1】 更に充填材を含む、請求項1〜のいずれかに記載の方法。
【請求項1】 前記材料は、ロッド形状で提供される、請求項1〜のいずれかに記載の方法。

Claims (12)

  1. ジョイントの製造方法であって、
    a)溝部を有するように形成された第1の基板を用意するステップと、
    b)前記溝部内に第2の基板の端部を配することで、前記第1の基板と前記溝部との間に空間が形成されるようにするステップと、
    c)前記空間を、
    1)エチレンコポリマー
    2)エポキシ樹脂、及び
    3)発泡剤
    を含有する材料で充填するステップと、
    d)前記材料を加熱して、前記材料が前記空間に流入し、カバー及び充填するようにしてジョイントを形成するステップと、
    を有する方法。
  2. 前記ジョイントは、自動車のヘムフランジジョイントであり、前記第1の基板は溝部を有するように形成され、前記第2の基板の端部を前記溝部内に配され、前記材料は、前記第1の基板と第2の基板との間の前記空間に配される、請求項1記載の方法。
  3. 前記材料は、再加熱されても、従来のホットメルト接着剤とは異なり、再溶解して流動することがない、請求項1又は2記載の方法。
  4. 溶接作業時に加熱がなされる、請求項1〜3のいずれかに記載の方法。
  5. 自動車のペインティング作業時に前記加熱がなされる、請求項1〜3のいずれかに記載の方法。
  6. 前記エチレンコポリマーは、エチレンメタクリレートコポリマーである、請求項1〜5のいずれかに記載の方法。
  7. 前記エポキシ樹脂は、ビスフェノールA樹脂である、請求項1〜6のいずれかに記載の方法。
  8. 前記発泡剤は、アゾジカルボンアミドである、請求項1〜7のいずれかに記載の方法。
  9. 更に硬化剤を含む、請求項1〜8のいずれかに記載の方法。
  10. 更に硬化促進剤を含む、請求項1〜9のいずれかに記載の方法。
  11. 更に充填材を含む、請求項1〜10のいずれかに記載の方法。
  12. 前記材料は、ロッド形状で提供される、請求項1〜10のいずれかに記載の方法。
JP2003527018A 2001-09-07 2002-09-05 ホットメルト構造材料及びその製造方法 Pending JP2005508403A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31818301P 2001-09-07 2001-09-07
US10/234,902 US6887914B2 (en) 2001-09-07 2002-09-04 Structural hot melt material and methods
PCT/US2002/028185 WO2003022953A1 (en) 2001-09-07 2002-09-05 Structural hot melt material and methods

Publications (2)

Publication Number Publication Date
JP2005508403A JP2005508403A (ja) 2005-03-31
JP2005508403A5 true JP2005508403A5 (ja) 2007-04-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003527018A Pending JP2005508403A (ja) 2001-09-07 2002-09-05 ホットメルト構造材料及びその製造方法

Country Status (10)

Country Link
US (1) US6887914B2 (ja)
EP (1) EP1334161B1 (ja)
JP (1) JP2005508403A (ja)
AT (1) ATE285458T1 (ja)
AU (1) AU2002332839A1 (ja)
CA (1) CA2427866A1 (ja)
DE (1) DE60202349T2 (ja)
ES (1) ES2230522T3 (ja)
MX (1) MXPA03003579A (ja)
WO (1) WO2003022953A1 (ja)

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