JP2005508403A5 - - Google Patents
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- JP2005508403A5 JP2005508403A5 JP2003527018A JP2003527018A JP2005508403A5 JP 2005508403 A5 JP2005508403 A5 JP 2005508403A5 JP 2003527018 A JP2003527018 A JP 2003527018A JP 2003527018 A JP2003527018 A JP 2003527018A JP 2005508403 A5 JP2005508403 A5 JP 2005508403A5
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- JP
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- Prior art keywords
- substrate
- space
- joint
- groove portion
- heating
- Prior art date
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- 239000000758 substrate Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920001038 ethylene copolymer Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004604 Blowing Agent Substances 0.000 claims description 3
- XOZUGNYVDXMRKW-AATRIKPKSA-N Azodicarbonamide Chemical group NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 claims description 2
- 239000004156 Azodicarbonamide Substances 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 2
- 239000004831 Hot glue Substances 0.000 claims description 2
- 235000019399 azodicarbonamide Nutrition 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000004088 foaming agent Substances 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
Description
【特許請求の範囲】
【請求項1】 ジョイントの製造方法であって、
a)溝部を有するように形成された第1の基板を用意するステップと、
b)前記溝部内に第2の基板の端部を配することで、前記第1の基板と前記溝部との間に空間が形成されるようにするステップと、
c)前記空間を、
1)エチレンコポリマー
2)エポキシ樹脂、及び
3)硬化剤
を含有する材料で充填するステップと、
d)前記材料を加熱して、前記材料が前記空間に流入し、カバー及び充填するようにしてジョイントを形成するステップと、
を有する方法。
【請求項2】 前記ジョイントは、自動車のヘムフランジジョイントであり、前記第1の基板は溝部を有するように形成され、前記第2の基板の端部を前記溝部内に配され、前記材料は、前記第1の基板と第2の基板との間の前記空間に配される、請求項1記載の方法。
【請求項3】 前記材料は、再加熱されても、従来のホットメルト接着剤とは異なり、再溶解して流動することがない、請求項1又は2記載の方法。
【請求項4】 溶接作業時に加熱がなされる、請求項1〜3のいずれかに記載の方法。
【請求項5】 自動車のペインティング作業時に前記加熱がなされる、請求項1〜3のいずれかに記載の方法。
【請求項6】 前記エチレンコポリマーは、エチレンメタクリレートコポリマーである、請求項1〜5のいずれかに記載の方法。
【請求項7】 前記エポキシ樹脂は、ビスフェノールA樹脂である、請求項1〜6のいずれかに記載の方法。
【請求項8】 前記材料は発泡剤を有し、当該発泡剤は、アゾジカルボンアミドである、請求項1〜7のいずれかに記載の方法。
【請求項9】 更に硬化促進剤を含む、請求項1〜8のいずれかに記載の方法。
【請求項10】 更に充填材を含む、請求項1〜9のいずれかに記載の方法。
【請求項11】 前記材料は、ロッド形状で提供される、請求項1〜9のいずれかに記載の方法。
【請求項1】 ジョイントの製造方法であって、
a)溝部を有するように形成された第1の基板を用意するステップと、
b)前記溝部内に第2の基板の端部を配することで、前記第1の基板と前記溝部との間に空間が形成されるようにするステップと、
c)前記空間を、
1)エチレンコポリマー
2)エポキシ樹脂、及び
3)硬化剤
を含有する材料で充填するステップと、
d)前記材料を加熱して、前記材料が前記空間に流入し、カバー及び充填するようにしてジョイントを形成するステップと、
を有する方法。
【請求項2】 前記ジョイントは、自動車のヘムフランジジョイントであり、前記第1の基板は溝部を有するように形成され、前記第2の基板の端部を前記溝部内に配され、前記材料は、前記第1の基板と第2の基板との間の前記空間に配される、請求項1記載の方法。
【請求項3】 前記材料は、再加熱されても、従来のホットメルト接着剤とは異なり、再溶解して流動することがない、請求項1又は2記載の方法。
【請求項4】 溶接作業時に加熱がなされる、請求項1〜3のいずれかに記載の方法。
【請求項5】 自動車のペインティング作業時に前記加熱がなされる、請求項1〜3のいずれかに記載の方法。
【請求項6】 前記エチレンコポリマーは、エチレンメタクリレートコポリマーである、請求項1〜5のいずれかに記載の方法。
【請求項7】 前記エポキシ樹脂は、ビスフェノールA樹脂である、請求項1〜6のいずれかに記載の方法。
【請求項8】 前記材料は発泡剤を有し、当該発泡剤は、アゾジカルボンアミドである、請求項1〜7のいずれかに記載の方法。
【請求項9】 更に硬化促進剤を含む、請求項1〜8のいずれかに記載の方法。
【請求項10】 更に充填材を含む、請求項1〜9のいずれかに記載の方法。
【請求項11】 前記材料は、ロッド形状で提供される、請求項1〜9のいずれかに記載の方法。
Claims (12)
- ジョイントの製造方法であって、
a)溝部を有するように形成された第1の基板を用意するステップと、
b)前記溝部内に第2の基板の端部を配することで、前記第1の基板と前記溝部との間に空間が形成されるようにするステップと、
c)前記空間を、
1)エチレンコポリマー
2)エポキシ樹脂、及び
3)発泡剤
を含有する材料で充填するステップと、
d)前記材料を加熱して、前記材料が前記空間に流入し、カバー及び充填するようにしてジョイントを形成するステップと、
を有する方法。 - 前記ジョイントは、自動車のヘムフランジジョイントであり、前記第1の基板は溝部を有するように形成され、前記第2の基板の端部を前記溝部内に配され、前記材料は、前記第1の基板と第2の基板との間の前記空間に配される、請求項1記載の方法。
- 前記材料は、再加熱されても、従来のホットメルト接着剤とは異なり、再溶解して流動することがない、請求項1又は2記載の方法。
- 溶接作業時に加熱がなされる、請求項1〜3のいずれかに記載の方法。
- 自動車のペインティング作業時に前記加熱がなされる、請求項1〜3のいずれかに記載の方法。
- 前記エチレンコポリマーは、エチレンメタクリレートコポリマーである、請求項1〜5のいずれかに記載の方法。
- 前記エポキシ樹脂は、ビスフェノールA樹脂である、請求項1〜6のいずれかに記載の方法。
- 前記発泡剤は、アゾジカルボンアミドである、請求項1〜7のいずれかに記載の方法。
- 更に硬化剤を含む、請求項1〜8のいずれかに記載の方法。
- 更に硬化促進剤を含む、請求項1〜9のいずれかに記載の方法。
- 更に充填材を含む、請求項1〜10のいずれかに記載の方法。
- 前記材料は、ロッド形状で提供される、請求項1〜10のいずれかに記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31818301P | 2001-09-07 | 2001-09-07 | |
US10/234,902 US6887914B2 (en) | 2001-09-07 | 2002-09-04 | Structural hot melt material and methods |
PCT/US2002/028185 WO2003022953A1 (en) | 2001-09-07 | 2002-09-05 | Structural hot melt material and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005508403A JP2005508403A (ja) | 2005-03-31 |
JP2005508403A5 true JP2005508403A5 (ja) | 2007-04-12 |
Family
ID=26928381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003527018A Pending JP2005508403A (ja) | 2001-09-07 | 2002-09-05 | ホットメルト構造材料及びその製造方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US6887914B2 (ja) |
EP (1) | EP1334161B1 (ja) |
JP (1) | JP2005508403A (ja) |
AT (1) | ATE285458T1 (ja) |
AU (1) | AU2002332839A1 (ja) |
CA (1) | CA2427866A1 (ja) |
DE (1) | DE60202349T2 (ja) |
ES (1) | ES2230522T3 (ja) |
MX (1) | MXPA03003579A (ja) |
WO (1) | WO2003022953A1 (ja) |
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-
2002
- 2002-09-04 US US10/234,902 patent/US6887914B2/en not_active Expired - Lifetime
- 2002-09-05 CA CA 2427866 patent/CA2427866A1/en not_active Abandoned
- 2002-09-05 WO PCT/US2002/028185 patent/WO2003022953A1/en active IP Right Grant
- 2002-09-05 AU AU2002332839A patent/AU2002332839A1/en not_active Abandoned
- 2002-09-05 JP JP2003527018A patent/JP2005508403A/ja active Pending
- 2002-09-05 EP EP20020798115 patent/EP1334161B1/en not_active Expired - Lifetime
- 2002-09-05 AT AT02798115T patent/ATE285458T1/de not_active IP Right Cessation
- 2002-09-05 MX MXPA03003579A patent/MXPA03003579A/es not_active Application Discontinuation
- 2002-09-05 ES ES02798115T patent/ES2230522T3/es not_active Expired - Lifetime
- 2002-09-05 DE DE2002602349 patent/DE60202349T2/de not_active Expired - Fee Related
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