JP2005501753A5 - - Google Patents

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Publication number
JP2005501753A5
JP2005501753A5 JP2003526634A JP2003526634A JP2005501753A5 JP 2005501753 A5 JP2005501753 A5 JP 2005501753A5 JP 2003526634 A JP2003526634 A JP 2003526634A JP 2003526634 A JP2003526634 A JP 2003526634A JP 2005501753 A5 JP2005501753 A5 JP 2005501753A5
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JP
Japan
Prior art keywords
polishing
polishing surface
head
substrate
chemical solution
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Application number
JP2003526634A
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English (en)
Japanese (ja)
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JP2005501753A (ja
JP4054306B2 (ja
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Priority claimed from US10/234,780 external-priority patent/US6887132B2/en
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Publication of JP2005501753A publication Critical patent/JP2005501753A/ja
Publication of JP2005501753A5 publication Critical patent/JP2005501753A5/ja
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Publication of JP4054306B2 publication Critical patent/JP4054306B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003526634A 2001-09-10 2002-09-09 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法 Expired - Fee Related JP4054306B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32311701P 2001-09-10 2001-09-10
US10/234,780 US6887132B2 (en) 2001-09-10 2002-09-03 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
PCT/US2002/028787 WO2003022519A2 (en) 2001-09-10 2002-09-09 Slurry distributor for chemical mechanical polishing apparatus and method of using the same

Publications (3)

Publication Number Publication Date
JP2005501753A JP2005501753A (ja) 2005-01-20
JP2005501753A5 true JP2005501753A5 (enExample) 2006-01-05
JP4054306B2 JP4054306B2 (ja) 2008-02-27

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ID=26928275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003526634A Expired - Fee Related JP4054306B2 (ja) 2001-09-10 2002-09-09 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法

Country Status (4)

Country Link
US (2) US6887132B2 (enExample)
JP (1) JP4054306B2 (enExample)
AU (1) AU2002326867A1 (enExample)
WO (1) WO2003022519A2 (enExample)

Families Citing this family (46)

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US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US7086933B2 (en) * 2002-04-22 2006-08-08 Applied Materials, Inc. Flexible polishing fluid delivery system
US20040214508A1 (en) * 2002-06-28 2004-10-28 Lam Research Corporation Apparatus and method for controlling film thickness in a chemical mechanical planarization system
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US6939210B2 (en) * 2003-05-02 2005-09-06 Applied Materials, Inc. Slurry delivery arm
US7108497B2 (en) * 2004-01-12 2006-09-19 Omnimold, Llc Interchangeable blow mold parison closing apparatus
JP2005271151A (ja) * 2004-03-25 2005-10-06 Toshiba Corp 研磨装置及び研磨方法
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US20070032180A1 (en) * 2005-08-08 2007-02-08 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry residence time enhancement system
US20070131562A1 (en) * 2005-12-08 2007-06-14 Applied Materials, Inc. Method and apparatus for planarizing a substrate with low fluid consumption
US20070181442A1 (en) * 2006-02-03 2007-08-09 Applied Materials, Inc. Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process
JP4901301B2 (ja) * 2006-05-23 2012-03-21 株式会社東芝 研磨方法及び半導体装置の製造方法
US7452264B2 (en) * 2006-06-27 2008-11-18 Applied Materials, Inc. Pad cleaning method
JP5080769B2 (ja) * 2006-09-15 2012-11-21 株式会社東京精密 研磨方法及び研磨装置
JP2008279539A (ja) * 2007-05-10 2008-11-20 Nomura Micro Sci Co Ltd 研磨液の回収方法、及び研磨液の回収装置
US8845395B2 (en) 2008-10-31 2014-09-30 Araca Inc. Method and device for the injection of CMP slurry
US8197306B2 (en) * 2008-10-31 2012-06-12 Araca, Inc. Method and device for the injection of CMP slurry
KR101067608B1 (ko) * 2009-03-30 2011-09-27 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
US9296088B2 (en) 2010-12-16 2016-03-29 Araca Inc. Method and device for the injection of CMP slurry
US9296124B2 (en) 2010-12-30 2016-03-29 United States Gypsum Company Slurry distributor with a wiping mechanism, system, and method for using same
US10076853B2 (en) 2010-12-30 2018-09-18 United States Gypsum Company Slurry distributor, system, and method for using same
EP2658695B1 (en) 2010-12-30 2018-06-13 United States Gypsum Company Slurry distributor, system and method for using same
US9999989B2 (en) * 2010-12-30 2018-06-19 United States Gypsum Company Slurry distributor with a profiling mechanism, system, and method for using same
CN103906608B (zh) 2010-12-30 2016-05-18 美国石膏公司 浆料分配系统和方法
JP6341860B2 (ja) 2011-10-24 2018-06-13 ユナイテッド・ステイツ・ジプサム・カンパニー スラリー分配装置、石膏スラリー混合・分配組立体、および石膏製品を調整する方法。
WO2013063080A2 (en) 2011-10-24 2013-05-02 United States Gypsum Company Multi-piece mold and method of making slurry distributor
PL2771158T3 (pl) 2011-10-24 2017-05-31 United States Gypsum Company Wielodyszowa końcówka podająca do dystrybucji zaprawy
JP6139188B2 (ja) * 2013-03-12 2017-05-31 株式会社荏原製作所 研磨装置および研磨方法
US10059033B2 (en) 2014-02-18 2018-08-28 United States Gypsum Company Cementitious slurry mixing and dispensing system with pulser assembly and method for using same
WO2016125408A1 (ja) * 2015-02-05 2016-08-11 東京エレクトロン株式会社 研磨装置、塗布膜形成装置、塗布膜形成方法、記憶媒体、パターン形成方法及びパターン形成装置
JP6468147B2 (ja) * 2015-02-05 2019-02-13 東京エレクトロン株式会社 研磨装置、塗布膜形成装置、塗布膜形成方法及び記憶媒体
US11077536B2 (en) * 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
JP2019029562A (ja) * 2017-08-01 2019-02-21 株式会社荏原製作所 基板処理装置
JP7162465B2 (ja) * 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7083722B2 (ja) 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
WO2020082259A1 (en) * 2018-10-24 2020-04-30 Yangtze Memory Technologies Co., Ltd. Chemical mechanical polishing apparatus having scraping fixture
TWI838459B (zh) 2019-02-20 2024-04-11 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
TWI872101B (zh) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
KR102835295B1 (ko) * 2020-03-06 2025-07-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 처리 시스템 및 연마 방법
JP7492854B2 (ja) * 2020-05-11 2024-05-30 株式会社荏原製作所 研磨装置及び研磨方法
JP2022151237A (ja) * 2021-03-26 2022-10-07 株式会社東京精密 Ｃｍｐ装置
KR102880334B1 (ko) * 2021-11-26 2025-10-31 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery
US12521840B2 (en) * 2024-03-07 2026-01-13 Wolfspeed, Inc. Two component chemical mechanical polishing
US20260061557A1 (en) * 2024-08-29 2026-03-05 Applied Materials, Inc. Slurry delivery method

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JP3010572B2 (ja) * 1994-09-29 2000-02-21 株式会社東京精密 ウェーハエッジの加工装置
KR970018240A (ko) * 1995-09-08 1997-04-30 모리시다 요이치 반도체 기판의 연마방법 및 그 장치
US5709593A (en) 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US5645682A (en) * 1996-05-28 1997-07-08 Micron Technology, Inc. Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
US6139406A (en) 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5997392A (en) 1997-07-22 1999-12-07 International Business Machines Corporation Slurry injection technique for chemical-mechanical polishing
JPH11114811A (ja) 1997-10-15 1999-04-27 Ebara Corp ポリッシング装置のスラリ供給装置
US6429131B2 (en) 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6283840B1 (en) 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
US6284092B1 (en) 1999-08-06 2001-09-04 International Business Machines Corporation CMP slurry atomization slurry dispense system
US6468134B1 (en) 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
US6641468B2 (en) * 2002-03-05 2003-11-04 Promos Technologies Inc Slurry distributor

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