JP2005347770A5 - - Google Patents

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Publication number
JP2005347770A5
JP2005347770A5 JP2005212721A JP2005212721A JP2005347770A5 JP 2005347770 A5 JP2005347770 A5 JP 2005347770A5 JP 2005212721 A JP2005212721 A JP 2005212721A JP 2005212721 A JP2005212721 A JP 2005212721A JP 2005347770 A5 JP2005347770 A5 JP 2005347770A5
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
conductive film
film tape
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005212721A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005347770A (ja
JP4150033B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005212721A priority Critical patent/JP4150033B2/ja
Priority claimed from JP2005212721A external-priority patent/JP4150033B2/ja
Publication of JP2005347770A publication Critical patent/JP2005347770A/ja
Publication of JP2005347770A5 publication Critical patent/JP2005347770A5/ja
Application granted granted Critical
Publication of JP4150033B2 publication Critical patent/JP4150033B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005212721A 2005-07-22 2005-07-22 部品実装装置 Expired - Fee Related JP4150033B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005212721A JP4150033B2 (ja) 2005-07-22 2005-07-22 部品実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005212721A JP4150033B2 (ja) 2005-07-22 2005-07-22 部品実装装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP35369695A Division JP3734548B2 (ja) 1995-12-29 1995-12-29 部品実装装置

Publications (3)

Publication Number Publication Date
JP2005347770A JP2005347770A (ja) 2005-12-15
JP2005347770A5 true JP2005347770A5 (enExample) 2006-02-23
JP4150033B2 JP4150033B2 (ja) 2008-09-17

Family

ID=35499796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005212721A Expired - Fee Related JP4150033B2 (ja) 2005-07-22 2005-07-22 部品実装装置

Country Status (1)

Country Link
JP (1) JP4150033B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004001837A2 (en) 2002-06-25 2003-12-31 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
KR101774938B1 (ko) 2011-08-31 2017-09-06 삼성전자 주식회사 지지대를 갖는 반도체 패키지 및 그 형성 방법
CN111132468A (zh) * 2019-12-04 2020-05-08 深圳市东向同人科技有限公司 一种柔性薄膜电极与主板的连接方法及电子线路板

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