JP4150033B2 - 部品実装装置 - Google Patents

部品実装装置 Download PDF

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Publication number
JP4150033B2
JP4150033B2 JP2005212721A JP2005212721A JP4150033B2 JP 4150033 B2 JP4150033 B2 JP 4150033B2 JP 2005212721 A JP2005212721 A JP 2005212721A JP 2005212721 A JP2005212721 A JP 2005212721A JP 4150033 B2 JP4150033 B2 JP 4150033B2
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JP
Japan
Prior art keywords
circuit board
printed circuit
liquid crystal
cell
acf
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005212721A
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English (en)
Japanese (ja)
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JP2005347770A5 (enExample
JP2005347770A (ja
Inventor
岳彦 宮本
裕之 遠藤
勉 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication date
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Priority to JP2005212721A priority Critical patent/JP4150033B2/ja
Publication of JP2005347770A publication Critical patent/JP2005347770A/ja
Publication of JP2005347770A5 publication Critical patent/JP2005347770A5/ja
Application granted granted Critical
Publication of JP4150033B2 publication Critical patent/JP4150033B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
JP2005212721A 2005-07-22 2005-07-22 部品実装装置 Expired - Fee Related JP4150033B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005212721A JP4150033B2 (ja) 2005-07-22 2005-07-22 部品実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005212721A JP4150033B2 (ja) 2005-07-22 2005-07-22 部品実装装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP35369695A Division JP3734548B2 (ja) 1995-12-29 1995-12-29 部品実装装置

Publications (3)

Publication Number Publication Date
JP2005347770A JP2005347770A (ja) 2005-12-15
JP2005347770A5 JP2005347770A5 (enExample) 2006-02-23
JP4150033B2 true JP4150033B2 (ja) 2008-09-17

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ID=35499796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005212721A Expired - Fee Related JP4150033B2 (ja) 2005-07-22 2005-07-22 部品実装装置

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JP (1) JP4150033B2 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7659621B2 (en) 2003-10-14 2010-02-09 Unitive International Limited Solder structures for out of plane connections
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7839000B2 (en) 2002-06-25 2010-11-23 Unitive International Limited Solder structures including barrier layers with nickel and/or copper
US7879715B2 (en) 2002-06-25 2011-02-01 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
US8674494B2 (en) 2011-08-31 2014-03-18 Samsung Electronics Co., Ltd. Semiconductor package having supporting plate and method of forming the same
CN111132468A (zh) * 2019-12-04 2020-05-08 深圳市东向同人科技有限公司 一种柔性薄膜电极与主板的连接方法及电子线路板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7839000B2 (en) 2002-06-25 2010-11-23 Unitive International Limited Solder structures including barrier layers with nickel and/or copper
US7879715B2 (en) 2002-06-25 2011-02-01 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US8294269B2 (en) 2002-06-25 2012-10-23 Unitive International Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
US7659621B2 (en) 2003-10-14 2010-02-09 Unitive International Limited Solder structures for out of plane connections
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
US8674494B2 (en) 2011-08-31 2014-03-18 Samsung Electronics Co., Ltd. Semiconductor package having supporting plate and method of forming the same
CN111132468A (zh) * 2019-12-04 2020-05-08 深圳市东向同人科技有限公司 一种柔性薄膜电极与主板的连接方法及电子线路板

Also Published As

Publication number Publication date
JP2005347770A (ja) 2005-12-15

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