JP2005347303A5 - - Google Patents

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Publication number
JP2005347303A5
JP2005347303A5 JP2004161570A JP2004161570A JP2005347303A5 JP 2005347303 A5 JP2005347303 A5 JP 2005347303A5 JP 2004161570 A JP2004161570 A JP 2004161570A JP 2004161570 A JP2004161570 A JP 2004161570A JP 2005347303 A5 JP2005347303 A5 JP 2005347303A5
Authority
JP
Japan
Prior art keywords
heat insulating
bonding apparatus
thermocompression bonding
cooling medium
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004161570A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005347303A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004161570A priority Critical patent/JP2005347303A/ja
Priority claimed from JP2004161570A external-priority patent/JP2005347303A/ja
Publication of JP2005347303A publication Critical patent/JP2005347303A/ja
Publication of JP2005347303A5 publication Critical patent/JP2005347303A5/ja
Pending legal-status Critical Current

Links

JP2004161570A 2004-05-31 2004-05-31 熱圧着装置 Pending JP2005347303A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004161570A JP2005347303A (ja) 2004-05-31 2004-05-31 熱圧着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004161570A JP2005347303A (ja) 2004-05-31 2004-05-31 熱圧着装置

Publications (2)

Publication Number Publication Date
JP2005347303A JP2005347303A (ja) 2005-12-15
JP2005347303A5 true JP2005347303A5 (enExample) 2007-07-12

Family

ID=35499434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004161570A Pending JP2005347303A (ja) 2004-05-31 2004-05-31 熱圧着装置

Country Status (1)

Country Link
JP (1) JP2005347303A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6018732B2 (ja) * 2011-03-25 2016-11-02 不二越機械工業株式会社 ワーク貼着方法およびワーク貼着装置
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
KR102158822B1 (ko) * 2014-06-10 2020-09-22 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치
CN111390465B (zh) * 2020-01-20 2022-03-22 武汉高芯科技有限公司 一种用于倒装焊的液压装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3539826B2 (ja) * 1996-07-24 2004-07-07 東レエンジニアリング株式会社 熱圧着ツール
JP4087028B2 (ja) * 1999-06-14 2008-05-14 シャープ株式会社 外部回路実装方法および熱圧着装置
JP4014481B2 (ja) * 2002-04-30 2007-11-28 東レエンジニアリング株式会社 ボンディング方法およびその装置

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