JP2005336612A5 - - Google Patents

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Publication number
JP2005336612A5
JP2005336612A5 JP2005149681A JP2005149681A JP2005336612A5 JP 2005336612 A5 JP2005336612 A5 JP 2005336612A5 JP 2005149681 A JP2005149681 A JP 2005149681A JP 2005149681 A JP2005149681 A JP 2005149681A JP 2005336612 A5 JP2005336612 A5 JP 2005336612A5
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JP
Japan
Prior art keywords
substrates
substrate
arm
plating apparatus
arms
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JP2005149681A
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English (en)
Japanese (ja)
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JP4839017B2 (ja
JP2005336612A (ja
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Priority claimed from US10/853,953 external-priority patent/US7498062B2/en
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Publication of JP2005336612A publication Critical patent/JP2005336612A/ja
Publication of JP2005336612A5 publication Critical patent/JP2005336612A5/ja
Application granted granted Critical
Publication of JP4839017B2 publication Critical patent/JP4839017B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005149681A 2004-05-26 2005-05-23 基板のめっき方法 Expired - Fee Related JP4839017B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/853,953 US7498062B2 (en) 2004-05-26 2004-05-26 Method and apparatus for applying a voltage to a substrate during plating
US10/853953 2004-05-26

Publications (3)

Publication Number Publication Date
JP2005336612A JP2005336612A (ja) 2005-12-08
JP2005336612A5 true JP2005336612A5 (enExample) 2008-07-10
JP4839017B2 JP4839017B2 (ja) 2011-12-14

Family

ID=34936872

Family Applications (1)

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JP2005149681A Expired - Fee Related JP4839017B2 (ja) 2004-05-26 2005-05-23 基板のめっき方法

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US (3) US7498062B2 (enExample)
EP (1) EP1600529A3 (enExample)
JP (1) JP4839017B2 (enExample)
MY (1) MY146519A (enExample)

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