JP2005311157A - 電子部品実装用装置の直動機構 - Google Patents
電子部品実装用装置の直動機構 Download PDFInfo
- Publication number
- JP2005311157A JP2005311157A JP2004127842A JP2004127842A JP2005311157A JP 2005311157 A JP2005311157 A JP 2005311157A JP 2004127842 A JP2004127842 A JP 2004127842A JP 2004127842 A JP2004127842 A JP 2004127842A JP 2005311157 A JP2005311157 A JP 2005311157A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- linear motor
- driven body
- motion mechanism
- linear motion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000001133 acceleration Effects 0.000 abstract description 11
- 230000002035 prolonged effect Effects 0.000 abstract 2
- 230000032258 transport Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53061—Responsive to work or work-related machine element
- Y10T29/53083—Responsive to work or work-related machine element including means to apply magnetic force directly to position or hold work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Linear Motors (AREA)
Abstract
【解決手段】電子部品を基板に実装する実装作業を行う電子部品実装用装置に配設されリニアモータによって移動ビーム8をY方向に直線駆動する直動機構において、移動ビーム8をY方向に駆動するリニアモータの推力発生位置Pを、移動ビーム8、搭載ヘッド9,移動プレート12などの可動部分よりなる被駆動体の慣性抵抗中心位置D1に略一致するように、被駆動体およびリニアモータを配置する。これにより、加減速時において慣性力による移動ビーム8へのねじりモーメントの負荷をなくし、搭載位置精度を確保するとともに部品寿命を延長することができる。
【選択図】図3
Description
被駆動体の慣性抵抗中心位置と前記ガイド部の摺動抵抗中心位置との間に位置するように、前記被駆動体、リニアモータおよびガイド部を配置した。
列のマグネット部材14の間に配置されており、可動子13は移動プレート12を介してY方向の駆動力を移動ビーム8に伝達する。
構6を配設した例を示している。
2 搬送路
3 基板
4 部品供給部
6 Y直動機構
7、18 ガイドレール
9 搭載ヘッド
13 可動子
14 マグネット部材
Claims (3)
- 電子部品を基板に実装する実装作業を行う電子部品実装用装置に配設されリニアモータによって被駆動体を第1方向に直線駆動する直動機構であって、前記被駆動体を第1方向にガイドするガイド部と、前記被駆動体を第1方向に駆動するリニアモータとを備え、前記リニアモータの推力発生位置が、前記被駆動体の慣性抵抗中心位置に略一致するように、前記被駆動体およびリニアモータを配置したことを特徴とする電子部品実装用装置の直動機構。
- 電子部品を基板に実装する実装作業を行う電子部品実装用装置に配設されリニアモータによって被駆動体を第1方向に直線駆動する直動機構であって、前記被駆動体を第1方向にガイドするガイド部と、前記被駆動体を第1方向に駆動するリニアモータとを備え、前記リニアモータの推力発生位置が、前記被駆動体の慣性抵抗中心位置と前記ガイド部の摺動抵抗中心位置との間に位置するように、前記被駆動体、リニアモータおよびガイド部を配置したことを特徴とする電子部品実装用装置の直動機構。
- 前記リニアモータは、前記第1方向に沿って水平姿勢で対向して上下2列に配列された固定子と、前記2列の固定子の間に配置された可動子とを備え、前記可動子は前記被駆動体の側端面に設けられた駆動伝達部を介して第1方向の駆動力を被駆動体に伝達することを特徴とする請求項1または2記載の電子部品実装用装置の直動機構。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004127842A JP4270019B2 (ja) | 2004-04-23 | 2004-04-23 | 電子部品実装用装置の直動機構 |
KR1020067017582A KR101170326B1 (ko) | 2004-04-23 | 2005-04-21 | 리니어 구동 기구 및 이를 이용한 전자부품 실장 장치 |
CN2005800064784A CN1926937B (zh) | 2004-04-23 | 2005-04-21 | 线性驱动机构和采用该线性驱动机构的电子元件安装装置 |
PCT/JP2005/008104 WO2005104645A1 (en) | 2004-04-23 | 2005-04-21 | Linear driving mechanism and electronic component mounting apparatus using the same |
EP05736891A EP1738628A1 (en) | 2004-04-23 | 2005-04-21 | Linear driving mechanism and electronic component mounting apparatus using the same |
US11/112,773 US7578054B2 (en) | 2004-04-23 | 2005-04-22 | Linear driving mechanism for electronic component mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004127842A JP4270019B2 (ja) | 2004-04-23 | 2004-04-23 | 電子部品実装用装置の直動機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005311157A true JP2005311157A (ja) | 2005-11-04 |
JP4270019B2 JP4270019B2 (ja) | 2009-05-27 |
Family
ID=34966377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004127842A Expired - Lifetime JP4270019B2 (ja) | 2004-04-23 | 2004-04-23 | 電子部品実装用装置の直動機構 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7578054B2 (ja) |
EP (1) | EP1738628A1 (ja) |
JP (1) | JP4270019B2 (ja) |
KR (1) | KR101170326B1 (ja) |
CN (1) | CN1926937B (ja) |
WO (1) | WO2005104645A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012205364A (ja) * | 2011-03-24 | 2012-10-22 | Yaskawa Electric Corp | 位置決め装置 |
JP2016004793A (ja) * | 2014-06-13 | 2016-01-12 | ヤマハ発動機株式会社 | 部品実装装置、及びアクチュエータシステム |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4270019B2 (ja) * | 2004-04-23 | 2009-05-27 | パナソニック株式会社 | 電子部品実装用装置の直動機構 |
JP5342159B2 (ja) * | 2008-03-25 | 2013-11-13 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP4883072B2 (ja) * | 2008-10-03 | 2012-02-22 | パナソニック株式会社 | 電子部品実装システム |
DE102012025425B4 (de) * | 2012-12-21 | 2017-12-14 | Mimot Gmbh | Vorichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
US11410866B2 (en) * | 2017-08-28 | 2022-08-09 | Shinkawa Ltd. | Apparatus and method for linearly moving movable body relative to object |
CN115285790B (zh) * | 2022-08-04 | 2023-07-25 | 昆山广辉精密五金有限公司 | 送线机构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163599A (ja) * | 1997-11-28 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP2001069744A (ja) * | 1999-08-13 | 2001-03-16 | Mirae Corp | Xyガントリーの冷却装置 |
JP2002315297A (ja) * | 2001-04-11 | 2002-10-25 | Shinko Electric Co Ltd | リニアモータシステムおよび移動体システム |
JP2003289693A (ja) * | 2002-03-27 | 2003-10-10 | Nikon Corp | モータ駆動装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61231867A (ja) * | 1985-04-08 | 1986-10-16 | Tamagawa Seiki Kk | 直線駆動機構 |
JPH081982B2 (ja) * | 1985-04-17 | 1996-01-10 | 株式会社日立製作所 | 電子部品搭載方法及び装置 |
US5994799A (en) * | 1998-02-25 | 1999-11-30 | Siemens Aktiengesellschaft | Positioning apparatus for a positioning head |
JP2001169529A (ja) * | 1999-12-06 | 2001-06-22 | Shinko Electric Co Ltd | 移動体および移動体システム |
TW538582B (en) * | 2000-09-29 | 2003-06-21 | Toshiba Machine Co Ltd | Linear motor drive apparatus |
ITTO20010141A1 (it) * | 2001-02-16 | 2002-08-16 | Pluritec S P A | Macchina utensile per la lavorazione di pacchi di schede di circuiti stampati. |
JP4551017B2 (ja) | 2001-03-30 | 2010-09-22 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
US6796022B2 (en) * | 2001-03-30 | 2004-09-28 | Sanyo Electric Co., Ltd. | Electronic component mounting apparatus |
KR100446443B1 (ko) * | 2001-12-17 | 2004-09-01 | 미래산업 주식회사 | 핸들러의 반도체 소자 이송장치 |
JP3772808B2 (ja) * | 2002-08-29 | 2006-05-10 | 株式会社村田製作所 | 部品装着装置 |
JP4113991B2 (ja) * | 2003-03-28 | 2008-07-09 | 株式会社東京精密 | 1軸駆動装置を用いた表面形状測定装置 |
US7026731B2 (en) * | 2003-06-20 | 2006-04-11 | Parker Hannifin Corp. | Linear motor glide assembly |
JP4062210B2 (ja) * | 2003-08-20 | 2008-03-19 | 松下電器産業株式会社 | 電子部品実装用装置の直動機構 |
JP4270019B2 (ja) * | 2004-04-23 | 2009-05-27 | パナソニック株式会社 | 電子部品実装用装置の直動機構 |
-
2004
- 2004-04-23 JP JP2004127842A patent/JP4270019B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-21 CN CN2005800064784A patent/CN1926937B/zh not_active Expired - Fee Related
- 2005-04-21 WO PCT/JP2005/008104 patent/WO2005104645A1/en not_active Application Discontinuation
- 2005-04-21 KR KR1020067017582A patent/KR101170326B1/ko not_active IP Right Cessation
- 2005-04-21 EP EP05736891A patent/EP1738628A1/en not_active Withdrawn
- 2005-04-22 US US11/112,773 patent/US7578054B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163599A (ja) * | 1997-11-28 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP2001069744A (ja) * | 1999-08-13 | 2001-03-16 | Mirae Corp | Xyガントリーの冷却装置 |
JP2002315297A (ja) * | 2001-04-11 | 2002-10-25 | Shinko Electric Co Ltd | リニアモータシステムおよび移動体システム |
JP2003289693A (ja) * | 2002-03-27 | 2003-10-10 | Nikon Corp | モータ駆動装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012205364A (ja) * | 2011-03-24 | 2012-10-22 | Yaskawa Electric Corp | 位置決め装置 |
JP2016004793A (ja) * | 2014-06-13 | 2016-01-12 | ヤマハ発動機株式会社 | 部品実装装置、及びアクチュエータシステム |
Also Published As
Publication number | Publication date |
---|---|
KR101170326B1 (ko) | 2012-07-31 |
WO2005104645A1 (en) | 2005-11-03 |
US7578054B2 (en) | 2009-08-25 |
CN1926937B (zh) | 2010-09-08 |
EP1738628A1 (en) | 2007-01-03 |
CN1926937A (zh) | 2007-03-07 |
KR20070001983A (ko) | 2007-01-04 |
JP4270019B2 (ja) | 2009-05-27 |
US20050257638A1 (en) | 2005-11-24 |
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