JP2005302997A - 絶縁層と絶縁層の間に接着補助層を有するプリント配線板およびその製造方法 - Google Patents
絶縁層と絶縁層の間に接着補助層を有するプリント配線板およびその製造方法 Download PDFInfo
- Publication number
- JP2005302997A JP2005302997A JP2004116726A JP2004116726A JP2005302997A JP 2005302997 A JP2005302997 A JP 2005302997A JP 2004116726 A JP2004116726 A JP 2004116726A JP 2004116726 A JP2004116726 A JP 2004116726A JP 2005302997 A JP2005302997 A JP 2005302997A
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- Prior art keywords
- printed wiring
- wiring board
- resin
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- Prior art date
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- 238000000034 method Methods 0.000 claims description 39
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- 229910000679 solder Inorganic materials 0.000 claims description 21
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 19
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 18
- 229930003836 cresol Natural products 0.000 claims description 18
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 15
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- 229910000365 copper sulfate Inorganic materials 0.000 description 9
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 9
- 125000005442 diisocyanate group Chemical group 0.000 description 9
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- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 8
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- 125000000753 cycloalkyl group Chemical group 0.000 description 7
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- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 7
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 6
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- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
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- 125000000524 functional group Chemical group 0.000 description 6
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- SIZDMAYTWUINIG-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)ethyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)C1=CC=C(OC#N)C=C1 SIZDMAYTWUINIG-UHFFFAOYSA-N 0.000 description 1
- MGURRWJWGJUVEM-UHFFFAOYSA-N [4-[2,6-di(propan-2-yl)phenyl]phenyl] cyanate Chemical compound CC(C)C1=CC=CC(C(C)C)=C1C1=CC=C(OC#N)C=C1 MGURRWJWGJUVEM-UHFFFAOYSA-N 0.000 description 1
- INHGSGHLQLYYND-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(OC#N)C=C1 INHGSGHLQLYYND-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- VOZYXUHNEBULJT-UHFFFAOYSA-N aluminum oxygen(2-) rhodium(3+) Chemical compound [O--].[O--].[O--].[Al+3].[Rh+3] VOZYXUHNEBULJT-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 150000001556 benzimidazoles Chemical class 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- RNWMOSZLRHZXRD-UHFFFAOYSA-N bis[4-(4-aminocyclohexyl)oxycyclohexyl]methanone Chemical compound C1CC(N)CCC1OC1CCC(C(=O)C2CCC(CC2)OC2CCC(N)CC2)CC1 RNWMOSZLRHZXRD-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- MZUPWNMULGRONZ-UHFFFAOYSA-N cyclohexylsulfonylcyclohexane Chemical compound C1CCCCC1S(=O)(=O)C1CCCCC1 MZUPWNMULGRONZ-UHFFFAOYSA-N 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- GRTGGSXWHGKRSB-UHFFFAOYSA-N dichloromethyl methyl ether Chemical compound COC(Cl)Cl GRTGGSXWHGKRSB-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- BGRWYRAHAFMIBJ-UHFFFAOYSA-N diisopropylcarbodiimide Natural products CC(C)NC(=O)NC(C)C BGRWYRAHAFMIBJ-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- PPTYNCJKYCGKEA-UHFFFAOYSA-N dimethoxy-phenyl-prop-2-enoxysilane Chemical compound C=CCO[Si](OC)(OC)C1=CC=CC=C1 PPTYNCJKYCGKEA-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000006838 isophorone group Chemical group 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- MUMZUERVLWJKNR-UHFFFAOYSA-N oxoplatinum Chemical compound [Pt]=O MUMZUERVLWJKNR-UHFFFAOYSA-N 0.000 description 1
- OOSUVFMPZZUMMJ-UHFFFAOYSA-N oxoplatinum oxorhodium Chemical compound O=[Rh].O=[Pt] OOSUVFMPZZUMMJ-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- UHZYTMXLRWXGPK-UHFFFAOYSA-N phosphorus pentachloride Chemical compound ClP(Cl)(Cl)(Cl)Cl UHZYTMXLRWXGPK-UHFFFAOYSA-N 0.000 description 1
- FAIAAWCVCHQXDN-UHFFFAOYSA-N phosphorus trichloride Chemical compound ClP(Cl)Cl FAIAAWCVCHQXDN-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910003446 platinum oxide Inorganic materials 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 125000005649 substituted arylene group Chemical group 0.000 description 1
- 125000005650 substituted phenylene group Chemical group 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical class CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
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- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】 複数層を有する多層プリント配線板であって、絶縁層と絶縁層の間に少なくとも1層以上の接着補助層を有することを特徴とするプリント配線板。
【選択図】 なし
Description
であらわすことができる。
R12及びR13の具体例としては、水素原子、炭素数が1〜3のアルキル基、フェニル基、置換フェニル基が好ましく、フェニル基に結合していてもよい置換基としては、炭素数1〜3のアルキル基、ハロゲン原子等が例示できる。
下記に示す金属箔Aを作製した。
幅510mm、厚み35μmの電解銅箔(キャリア銅箔)の光択面に下記の条件でクロムめっきを連続的に行って1.0mg/dm2の厚さのクロムめっき層(剥離層)を形成した。クロムめっき形成後の表面粗度Rz=0.5μmであった。なお、表面粗さはJIS−B−0601に基づき測定した。
液組成:三酸化クロム250g/L、硫酸2.5g/L
・浴温:25℃
アノード:鉛
電流密度20A/dm2
液組成:硫酸銅5水和物100g/L、硫酸150g/L、塩化物イオン30ppm
・浴温:25℃
アノード:鉛
電流密度:10A/dm2
・浴温:40℃
アノード:鉛
電流密度:15A/dm2
電解時間:10秒
・pH11.5
・浴温:55℃
アノード:鉛
・浸漬時間:5秒
液温25℃
浸漬時間10秒
シランカップリング処理後、金属箔を120℃で乾燥してカップリング剤を金属箔表面に吸着させた。そのときの金属箔表面粗さはRz=0.6μmであった。
・ビフェニル系エポキシ樹脂、NC3000S−H(日本化薬株式会社社製)
80重量部
・カルボン酸変性アクリロニトリルブタジエンゴム粒子、XER−91SE−
15(JSR株式会社) 5重量部
・トリアジン環含有クレゾールノボラック型フェノール樹脂、フェノライトE
XB−9829(窒素含有量18%、水酸基当量151、大日本インキ化学工業
株式会社製) 9重量部
・リン含有化合物、HCA−HQ(三光株式会社製) 26重量部
・無機フィラー、球状シリカ、アドマファインSC−2050(株式会社アド
マテックス社製) 40重量部
・イミダゾール誘導体化合物、1−シアノエチル−2フェニルイミダゾリウム
トリメリテート、2PZ−CNS(四国化成工業株式会社製) 0.24重量部
・溶剤、メチルエチルケトン
ディーンスターク還流冷却器、温度計、撹拌器を備えた500mLのセパラブルフラスコに脂環式ジアミン化合物として(4,4’−ジアミノ)ジシクロヘキシルメタン(ワンダミンHM(略号WHM)新日本理化(株)製商品名)45mmol、シロキサンジアミンとして反応性シリコーンオイルX−22−161−B(信越化学工業(株)製商品名、アミン当量1500)5mmol、無水トリメリット酸(TMA)105mmol、非プロトン性極性溶媒としてN−メチル−2−ピロリドン(NMP)145g加え、80℃で30分間撹拌した。
金属箔Aのシランカップリング剤処理面に樹脂組成物Aを塗工した。塗工後は残溶剤が1%以下になるように160℃で1分程度の乾燥を行った。塗工した樹脂組成物Aの厚みは2.0μmであった。
実施例1の工程(g)において、基板全体を樹脂組成物Bの溶液に浸漬し、引き上げた後160℃10分乾燥を行うことで残溶剤を1%以下にし、基板全体を樹脂組成物Bでコーティングする代わりに導体回路をエッチングし、3μm程度の凹凸を作製した以外は実施例1と同様に基板を作製した。エッチングにはCZ処理(メック株式会社製、商品名)を用いた。
実施例1において、金属箔Bを作製する際、樹脂組成物Aを5μmの厚みに塗布したこと以外は実施例1と同様に基板を作製した。
実施例1の工程(h)において、コーティング後のコア基板上に厚み60μmのプリプレグであるGEA-679-FG(日立化成工業株式会社製、商品名)と金属箔Bを積層する代わりに金属箔Aを積層したこと以外は実施例1と同様に基板を作製した。
実施例1〜3、比較例1で作製した基板の吸湿耐熱試験を行った。基板の試験は各サンプルを121℃、湿度100%、2気圧の条件で96時間処理し、基板に膨れ等が発生しないかどうかの確認を行った。試験には平山製作所製飽和型PCT装置PC-242を用いた。
実施例1〜3、比較例1で作製した基板の吸湿はんだ試験を行った。基板の試験は各サンプルを121℃、湿度100%、2気圧の条件で1時間処理し、その後288℃のはんだ槽に浸漬し、膨れ等の異常が発生しないかどうか確認した。試験には平山製作所製飽和型PCT装置PC-242を用いた。
実施例1〜3、比較例1で作製した基板の試験結果を表3に示す。表3に示した通り、実施例1〜3で作製した基板は接着補助層を有するため特に異常が発生しなかったが、比較例1で作製した基板は基材とソルダーレジストの間で膨れが発生した。
2 金属箔
3 接着補助層
4 貫通スルーホール
5 無電解めっき層
6 めっきレジスト
7 回路パターン
8 接着補助層
9 絶縁層
10 金属箔
11 接着補助層
12 IVH
13 無電解めっき層
14 めっきレジスト
15 回路パターン
16 ソルダーレジスト
Claims (11)
- 複数層を有する多層プリント配線板であって、絶縁層と絶縁層の間に少なくとも1層以上の接着補助層を有することを特徴とするプリント配線板。
- 最外層にソルダーレジストを有するプリント配線板であって、絶縁層とソルダーレジストの間に少なくとも1層以上の接着補助層を有することを特徴とするプリント配線板。
- 1層の接着補助層の厚みが0.1〜5μmの範囲であることを特徴とする請求項1または2に記載のプリント配線板。
- 接着補助層がエポキシ樹脂を必須成分とすることを特徴とする請求項1〜3のいずれかに記載のプリント配線板。
- 前記エポキシ樹脂を必須成分とする樹脂が
(A)ビフェニル構造を有するノボラック型エポキシ樹脂、
(B)カルボン酸変性アクリロニトリルブタジエンゴム粒子、および
(C)トリアジン環含有クレゾールノボラック型フェノール樹脂、
を含むことを特徴とする請求項4に記載のプリント配線板。 - (C)成分が、窒素含有量が12〜22重量%のトリアジン環含有クレゾールノボラック型フェノール樹脂である、請求項5に記載のプリント配線板。
- (A)成分中のエポキシ基の個数に対する、(C)成分中の水酸基の比が、0.6〜1.3である、請求項5又は6に記載のプリント配線板。
- (B)成分の重量に対する(A)成分の重量が、88/12〜98/2である、請求項5〜7のいずれかに記載のプリント配線板。
- 接着補助層がポリアミドイミド樹脂を必須成分とすることを特徴とする請求項1〜3のいずれかに記載のプリント配線板。
- 飽和炭化水素からなる単位成分を有するポリアミドイミドを用いることを特徴とする請求項9に記載のプリント配線板。
- 絶縁層表面粗さがRz=2.0μm以下のコア基板上に樹脂層を形成する工程を有するプリント配線板の製造方法であって、接着補助層がコア基板側或いはコア基板上の何れかに存在するプリント配線板の製造方法。
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JP2004116726A JP4345554B2 (ja) | 2004-04-12 | 2004-04-12 | 絶縁層と絶縁層の間に接着補助層を有するプリント配線板およびその製造方法 |
TW095142602A TW200721932A (en) | 2004-01-30 | 2005-01-21 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
TW94101895A TWI282259B (en) | 2004-01-30 | 2005-01-21 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
US11/044,533 US7629045B2 (en) | 2004-01-30 | 2005-01-28 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
CN2005100051273A CN1662120B (zh) | 2004-01-30 | 2005-01-28 | 带有粘着辅助剂的金属箔、印刷线路板及其制造方法 |
CN200810149260XA CN101528007B (zh) | 2004-01-30 | 2005-01-28 | 带有粘着辅助剂的金属箔、印刷线路板及其制造方法 |
KR1020050007902A KR100741449B1 (ko) | 2004-01-30 | 2005-01-28 | 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법 |
KR1020070026304A KR100741615B1 (ko) | 2004-01-30 | 2007-03-16 | 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법 |
KR1020070027999A KR100767177B1 (ko) | 2004-01-30 | 2007-03-22 | 접착 보조제 부착 금속박, 인쇄 배선판 및 인쇄 배선판의제조 방법 |
US12/368,019 US8815334B2 (en) | 2004-01-30 | 2009-02-09 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
US12/613,222 US7862889B2 (en) | 2004-01-30 | 2009-11-05 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
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