JP2005286291A - 窒化物半導体発光素子及びその製造方法 - Google Patents

窒化物半導体発光素子及びその製造方法 Download PDF

Info

Publication number
JP2005286291A
JP2005286291A JP2004329867A JP2004329867A JP2005286291A JP 2005286291 A JP2005286291 A JP 2005286291A JP 2004329867 A JP2004329867 A JP 2004329867A JP 2004329867 A JP2004329867 A JP 2004329867A JP 2005286291 A JP2005286291 A JP 2005286291A
Authority
JP
Japan
Prior art keywords
substrate
nitride semiconductor
pattern
semiconductor layer
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004329867A
Other languages
English (en)
Japanese (ja)
Inventor
Jae Hoon Lee
ジェ フン イ
Jeong Wook Lee
ジョン ウク イ
Hyun Kyung Kim
ヒョン キョン キム
Yong Chun Kim
ヨン チョン キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2005286291A publication Critical patent/JP2005286291A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22Roughened surfaces, e.g. at the interface between epitaxial layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/918Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2004329867A 2004-03-30 2004-11-12 窒化物半導体発光素子及びその製造方法 Pending JP2005286291A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040021801A KR100568297B1 (ko) 2004-03-30 2004-03-30 질화물 반도체 발광 소자 및 그 제조 방법

Publications (1)

Publication Number Publication Date
JP2005286291A true JP2005286291A (ja) 2005-10-13

Family

ID=35054899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004329867A Pending JP2005286291A (ja) 2004-03-30 2004-11-12 窒化物半導体発光素子及びその製造方法

Country Status (3)

Country Link
US (1) US7470938B2 (ko)
JP (1) JP2005286291A (ko)
KR (1) KR100568297B1 (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251130A (ja) * 2006-03-17 2007-09-27 Epitech Technology Corp 発光ダイオード及びその製造方法
JP2013038438A (ja) * 2007-11-14 2013-02-21 Cree Inc ワイヤボンディングのないウェーハ段階のled
KR101298927B1 (ko) * 2011-12-26 2013-08-22 전자부품연구원 질화물계 발광 다이오드 및 그의 제조 방법
JP2014082496A (ja) * 2012-10-17 2014-05-08 Lg Innotek Co Ltd 発光素子
US9130134B2 (en) 2012-09-21 2015-09-08 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
US9337385B2 (en) 2013-07-09 2016-05-10 Kabushiki Kaisha Toshiba Semiconductor light emitting element and method for manufacturing the same
KR101745996B1 (ko) * 2011-01-03 2017-06-12 엘지이노텍 주식회사 발광소자
WO2017154973A1 (ja) * 2016-03-08 2017-09-14 株式会社 東芝 半導体発光素子およびその製造方法

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100649494B1 (ko) * 2004-08-17 2006-11-24 삼성전기주식회사 레이저를 이용하여 발광 다이오드 기판을 표면 처리하는발광 다이오드 제조 방법 및 이 방법에 의해 제조된 발광다이오드
KR100608933B1 (ko) * 2004-11-19 2006-08-08 광주과학기술원 기판에 건식식각을 수행하여 개선된 광추출 효율을 가지는고효율 ⅲ-ⅴ 질화물계 플립칩 구조의 반도체 발광소자제조방법
DE112005002889B4 (de) * 2004-12-14 2015-07-23 Seoul Viosys Co., Ltd. Licht emittierendes Bauelement mit einer Mehrzahl Licht emittierender Zellen und Baugruppen-Montage desselben
EP1864339A4 (en) 2005-03-11 2010-12-29 Seoul Semiconductor Co Ltd LIGHT-EMITTING DIODE DIODE WITH PHOTO-EMITTING CELL MATRIX
KR100650990B1 (ko) * 2005-03-21 2006-11-29 주식회사 이츠웰 질화물 반도체 발광 다이오드 및 그의 제조 방법
KR100631981B1 (ko) * 2005-04-07 2006-10-11 삼성전기주식회사 수직구조 3족 질화물 발광 소자 및 그 제조 방법
KR101154744B1 (ko) * 2005-08-01 2012-06-08 엘지이노텍 주식회사 질화물 발광 소자 및 그 제조 방법
KR100716790B1 (ko) * 2005-09-26 2007-05-14 삼성전기주식회사 질화갈륨계 반도체 발광소자 및 그 제조방법
KR101158076B1 (ko) * 2006-01-13 2012-06-22 서울옵토디바이스주식회사 요철 반도체층을 갖는 발광 다이오드의 제조 방법 및 이를위한 발광 다이오드
KR100659373B1 (ko) 2006-02-09 2006-12-19 서울옵토디바이스주식회사 패터닝된 발광다이오드용 기판 및 그것을 채택하는 발광다이오드
JP4637781B2 (ja) * 2006-03-31 2011-02-23 昭和電工株式会社 GaN系半導体発光素子の製造方法
KR101229830B1 (ko) * 2006-04-14 2013-02-04 서울옵토디바이스주식회사 교류용 발광다이오드 및 그 제조방법
KR100735496B1 (ko) * 2006-05-10 2007-07-04 삼성전기주식회사 수직구조 질화갈륨계 led 소자의 제조방법
KR100780233B1 (ko) * 2006-05-15 2007-11-27 삼성전기주식회사 다중 패턴 구조를 지닌 반도체 발광 소자
TWI336965B (en) * 2006-06-16 2011-02-01 High Power Optoelectronics Inc Semiconductor light emitting device and method of fabricating the same
TWI309481B (en) 2006-07-28 2009-05-01 Epistar Corp A light emitting device having a patterned substrate and the method thereof
KR100769727B1 (ko) * 2006-08-17 2007-10-23 삼성전기주식회사 표면 요철 형성방법 및 그를 이용한 질화갈륨계발광다이오드 소자의 제조방법
US7800122B2 (en) * 2006-09-07 2010-09-21 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Light emitting diode device, and manufacture and use thereof
CN100464437C (zh) * 2006-10-13 2009-02-25 杭州士兰明芯科技有限公司 一种提高芯片轴向出光亮度的方法
US9318327B2 (en) * 2006-11-28 2016-04-19 Cree, Inc. Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same
JP4908381B2 (ja) * 2006-12-22 2012-04-04 昭和電工株式会社 Iii族窒化物半導体層の製造方法、及びiii族窒化物半導体発光素子、並びにランプ
KR101393785B1 (ko) * 2007-05-21 2014-05-13 엘지이노텍 주식회사 반도체 발광 소자 및 그 제조방법
TWI354382B (en) * 2007-06-01 2011-12-11 Huga Optotech Inc Semiconductor substrate with electromagnetic-wave-
KR101305786B1 (ko) * 2007-06-21 2013-09-06 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
EP2020691A2 (en) * 2007-07-31 2009-02-04 Epivalley Co., Ltd. III-Nitride semiconductor light emitting device
KR101449000B1 (ko) * 2007-09-06 2014-10-13 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
DE102008021403A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zu dessen Herstellung
TW200921943A (en) * 2007-11-14 2009-05-16 Univ Nat Central Light emitting diode and light source composed of light emitting diode array
US7985979B2 (en) * 2007-12-19 2011-07-26 Koninklijke Philips Electronics, N.V. Semiconductor light emitting device with light extraction structures
KR100957742B1 (ko) 2007-12-31 2010-05-12 주식회사 에피밸리 3족 질화물 반도체 발광소자
US7888688B2 (en) * 2008-04-29 2011-02-15 Bridgelux, Inc. Thermal management for LED
US9404197B2 (en) 2008-07-07 2016-08-02 Soraa, Inc. Large area, low-defect gallium-containing nitride crystals, method of making, and method of use
KR101533296B1 (ko) * 2008-07-08 2015-07-02 삼성전자주식회사 패턴 형성 기판을 구비한 질화물 반도체 발광소자 및 그제조방법
US8080827B2 (en) * 2008-07-31 2011-12-20 Bridgelux, Inc. Top contact LED thermal management
US7859190B2 (en) * 2008-09-10 2010-12-28 Bridgelux, Inc. Phosphor layer arrangement for use with light emitting diodes
KR101047718B1 (ko) * 2008-11-26 2011-07-08 엘지이노텍 주식회사 발광 소자
US9589792B2 (en) 2012-11-26 2017-03-07 Soraa, Inc. High quality group-III metal nitride crystals, methods of making, and methods of use
US9543392B1 (en) 2008-12-12 2017-01-10 Soraa, Inc. Transparent group III metal nitride and method of manufacture
KR101134810B1 (ko) * 2009-03-03 2012-04-13 엘지이노텍 주식회사 발광소자 및 그 제조방법
WO2010101348A1 (ko) * 2009-03-05 2010-09-10 우리엘에스티 주식회사 3족 질화물 반도체 발광소자 및 그 제조방법
US8247886B1 (en) 2009-03-09 2012-08-21 Soraa, Inc. Polarization direction of optical devices using selected spatial configurations
DE112009004687B4 (de) 2009-04-24 2019-03-21 Hexasolution Co., Ltd. Verfahren zur Substratherstellung, bei dem Oxidkügelchen-Muster ausgebildet werden
CN102422444B (zh) 2009-04-29 2014-11-26 财团法人首尔大学校产学协力团 形成有图案的基板的制造方法
WO2010131434A1 (ja) * 2009-05-12 2010-11-18 パナソニック株式会社 シート、発光装置及びシートの製造方法
US8791499B1 (en) 2009-05-27 2014-07-29 Soraa, Inc. GaN containing optical devices and method with ESD stability
US9000466B1 (en) 2010-08-23 2015-04-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
US9293644B2 (en) 2009-09-18 2016-03-22 Soraa, Inc. Power light emitting diode and method with uniform current density operation
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
US8740413B1 (en) 2010-02-03 2014-06-03 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
KR200460752Y1 (ko) 2010-03-30 2012-06-01 에스디아이 코퍼레이션 신뢰성이 개선된 발광 장치의 패키지 프레임
US9450143B2 (en) 2010-06-18 2016-09-20 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
TWI641287B (zh) 2010-09-14 2018-11-11 半導體能源研究所股份有限公司 固態發光元件,發光裝置和照明裝置
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
CN103180972A (zh) * 2010-11-02 2013-06-26 皇家飞利浦电子股份有限公司 具有提高的提取效率的发光装置
US8786053B2 (en) 2011-01-24 2014-07-22 Soraa, Inc. Gallium-nitride-on-handle substrate materials and devices and method of manufacture
KR101104645B1 (ko) * 2011-03-25 2012-01-16 (주)세미머티리얼즈 발광 소자 및 그의 제조 방법
KR101115538B1 (ko) * 2011-04-04 2012-02-28 서울옵토디바이스주식회사 발광소자와 그 제조방법
KR101259999B1 (ko) * 2011-04-28 2013-05-06 서울옵토디바이스주식회사 반도체 기판 및 그 제조방법
US9741899B2 (en) 2011-06-15 2017-08-22 Sensor Electronic Technology, Inc. Device with inverted large scale light extraction structures
US9048378B2 (en) * 2011-06-15 2015-06-02 Sensor Electronic Technology, Inc. Device with inverted large scale light extraction structures
US9337387B2 (en) 2011-06-15 2016-05-10 Sensor Electronic Technology, Inc. Emitting device with improved extraction
US10319881B2 (en) 2011-06-15 2019-06-11 Sensor Electronic Technology, Inc. Device including transparent layer with profiled surface for improved extraction
US10522714B2 (en) 2011-06-15 2019-12-31 Sensor Electronic Technology, Inc. Device with inverted large scale light extraction structures
KR20130009399A (ko) * 2011-07-15 2013-01-23 포항공과대학교 산학협력단 발광다이오드용 기판의 제조방법, 이에 의해 제조된 발광다이오드용 기판 및 이 발광다이오드용 기판을 구비한 발광다이오드의 제조방법
EP3926698B1 (en) * 2011-09-16 2023-01-04 Seoul Viosys Co., Ltd. Light emitting diode
US8912025B2 (en) 2011-11-23 2014-12-16 Soraa, Inc. Method for manufacture of bright GaN LEDs using a selective removal process
KR101895297B1 (ko) * 2011-12-12 2018-09-05 엘지이노텍 주식회사 발광 소자 및 이를 구비한 발광 장치
CN104037317B (zh) * 2012-02-27 2016-04-06 义乌市运拓光电科技有限公司 一种使用陶瓷散热的高功率led灯具
EP2823515A4 (en) 2012-03-06 2015-08-19 Soraa Inc LIGHT-EMITTING DIODES WITH MATERIAL LAYERS WITH LOW BREAKING INDEX TO REDUCE LIGHT PIPE EFFECTS
CN104246027B (zh) * 2012-08-06 2015-11-25 日本碍子株式会社 复合基板及功能元件
US9275912B1 (en) 2012-08-30 2016-03-01 Soraa, Inc. Method for quantification of extended defects in gallium-containing nitride crystals
KR20140036405A (ko) * 2012-09-13 2014-03-26 포항공과대학교 산학협력단 발광다이오드 및 그 제조방법
US9299555B1 (en) 2012-09-28 2016-03-29 Soraa, Inc. Ultrapure mineralizers and methods for nitride crystal growth
CN103715323A (zh) * 2012-10-09 2014-04-09 晶元光电股份有限公司 发光装置
US9978904B2 (en) 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
CN103840038A (zh) * 2012-11-21 2014-06-04 中国科学院物理研究所 实现增强led样品光提取效率的三维类球形结构及制备方法
CN103035802A (zh) * 2012-12-15 2013-04-10 华南理工大学 一种用于led倒装结构的图形化衬底及led芯片
TWI540768B (zh) * 2012-12-21 2016-07-01 鴻海精密工業股份有限公司 發光晶片組合及其製造方法
US8802471B1 (en) * 2012-12-21 2014-08-12 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
CN103066178B (zh) * 2012-12-29 2015-07-29 映瑞光电科技(上海)有限公司 一种倒装光子晶体led芯片及其制造方法
US8994033B2 (en) 2013-07-09 2015-03-31 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
CN103367608A (zh) * 2013-07-24 2013-10-23 合肥彩虹蓝光科技有限公司 一种提高光取出效率的led倒装制程
CN103390709B (zh) * 2013-07-25 2015-09-16 圆融光电科技有限公司 一种具有双重作用电极的发光二极管及其制作方法
CN104183678A (zh) * 2014-08-22 2014-12-03 江苏鑫博电子科技有限公司 一种led倒装芯片、led倒装芯片的图形化衬底及制作方法
KR20160081391A (ko) * 2014-12-31 2016-07-08 서울바이오시스 주식회사 V-피트 전류분산 요소를 갖는 수직형 발광 다이오드 및 그 제조 방법
US10461221B2 (en) 2016-01-18 2019-10-29 Sensor Electronic Technology, Inc. Semiconductor device with improved light propagation
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
CN105914289A (zh) * 2016-06-08 2016-08-31 湖南华特光电科技有限公司 一种led芯片倒装cob的封装装置及其生产方法
KR102412469B1 (ko) 2017-08-01 2022-06-23 삼성디스플레이 주식회사 색변환 표시판 및 이를 포함하는 표시 장치
CN107863423A (zh) * 2017-10-26 2018-03-30 江苏新广联半导体有限公司 Led倒装芯片蓝宝石出光面图形化的制作方法
US11466384B2 (en) 2019-01-08 2022-10-11 Slt Technologies, Inc. Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate
CN110600598B (zh) * 2019-08-21 2021-02-05 苏州紫灿科技有限公司 一种双层纳米阵列结构的倒装紫外led及制备方法
US11705322B2 (en) 2020-02-11 2023-07-18 Slt Technologies, Inc. Group III nitride substrate, method of making, and method of use
US11721549B2 (en) 2020-02-11 2023-08-08 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5787104A (en) * 1995-01-19 1998-07-28 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting element and method for fabricating the same
JP2685030B2 (ja) * 1995-05-26 1997-12-03 日本電気株式会社 半導体装置及びその製造方法
US5779924A (en) * 1996-03-22 1998-07-14 Hewlett-Packard Company Ordered interface texturing for a light emitting device
US6091083A (en) * 1997-06-02 2000-07-18 Sharp Kabushiki Kaisha Gallium nitride type compound semiconductor light-emitting device having buffer layer with non-flat surface
JP4352473B2 (ja) * 1998-06-26 2009-10-28 ソニー株式会社 半導体装置の製造方法
JP3531722B2 (ja) 1998-12-28 2004-05-31 信越半導体株式会社 発光ダイオードの製造方法
US6426514B1 (en) * 1999-01-22 2002-07-30 Defence Science And Technology Organisation Dual non-parallel electronic field electro-optic effect device
KR100700993B1 (ko) 1999-12-03 2007-03-30 크리, 인코포레이티드 향상된 광 적출 구조체를 갖는 발광 다이오드 및 그 제조 방법
KR100337704B1 (ko) * 2000-07-04 2002-05-22 윤종용 전계흡수형 변조기가 집적된 레이저 다이오드의 제조 방법
TW466784B (en) * 2000-09-19 2001-12-01 United Epitaxy Co Ltd Method to manufacture high luminescence LED by using glass pasting
US7009210B2 (en) * 2000-10-06 2006-03-07 Alphion Corporation Method and apparatus for bit-rate and format insensitive performance monitoring of lightwave signals
US6891201B2 (en) * 2001-01-15 2005-05-10 Sharp Kabushiki Kaisha Nitride semiconductor laser element and optical device containing it
US6703780B2 (en) * 2001-01-16 2004-03-09 General Electric Company Organic electroluminescent device with a ceramic output coupler and method of making the same
JP3546023B2 (ja) 2001-03-23 2004-07-21 三菱電線工業株式会社 結晶成長用基板の製造方法、およびGaN系結晶の製造方法
JP3852000B2 (ja) 2001-09-28 2006-11-29 豊田合成株式会社 発光素子
AUPR534201A0 (en) * 2001-05-30 2001-06-21 Unisearch Limited High efficiency silicon light emitting device
JP4046485B2 (ja) 2001-06-05 2008-02-13 シャープ株式会社 窒化物系化合物半導体発光素子
US6787435B2 (en) * 2001-07-05 2004-09-07 Gelcore Llc GaN LED with solderable backside metal
JP4055503B2 (ja) * 2001-07-24 2008-03-05 日亜化学工業株式会社 半導体発光素子
JP4122739B2 (ja) 2001-07-26 2008-07-23 松下電工株式会社 発光素子及びその製造方法
JP4244542B2 (ja) 2001-08-28 2009-03-25 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子及びその製造方法
JP2003078162A (ja) 2001-08-31 2003-03-14 Shin Etsu Handotai Co Ltd GaP系半導体発光素子
JP2003115377A (ja) * 2001-10-03 2003-04-18 Nec Corp 発光素子、その製造方法およびこれを用いた表示装置
US6847483B2 (en) * 2001-12-21 2005-01-25 Bose Corporation Selective reflecting
JP2003197961A (ja) 2001-12-27 2003-07-11 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子
KR100940530B1 (ko) * 2003-01-17 2010-02-10 삼성전자주식회사 실리콘 광소자 제조방법 및 이에 의해 제조된 실리콘광소자 및 이를 적용한 화상 입력 및/또는 출력장치
JP3782357B2 (ja) * 2002-01-18 2006-06-07 株式会社東芝 半導体発光素子の製造方法
KR100459898B1 (ko) * 2002-03-07 2004-12-04 삼성전자주식회사 실리콘 발광소자 및 이를 채용한 디스플레이 장치
JP2004056088A (ja) * 2002-05-31 2004-02-19 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子
JP3874701B2 (ja) * 2002-06-26 2007-01-31 株式会社東芝 半導体発光素子及び半導体発光装置
TW571449B (en) * 2002-12-23 2004-01-11 Epistar Corp Light-emitting device having micro-reflective structure
EP1697983B1 (en) * 2003-12-09 2012-06-13 The Regents of The University of California Highly efficient gallium nitride based light emitting diodes having surface roughening

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251130A (ja) * 2006-03-17 2007-09-27 Epitech Technology Corp 発光ダイオード及びその製造方法
JP2013038438A (ja) * 2007-11-14 2013-02-21 Cree Inc ワイヤボンディングのないウェーハ段階のled
US9634191B2 (en) 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US10199360B2 (en) 2007-11-14 2019-02-05 Cree, Inc. Wire bond free wafer level LED
KR101745996B1 (ko) * 2011-01-03 2017-06-12 엘지이노텍 주식회사 발광소자
KR101298927B1 (ko) * 2011-12-26 2013-08-22 전자부품연구원 질화물계 발광 다이오드 및 그의 제조 방법
US9130134B2 (en) 2012-09-21 2015-09-08 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
JP2014082496A (ja) * 2012-10-17 2014-05-08 Lg Innotek Co Ltd 発光素子
US8890200B2 (en) 2012-10-17 2014-11-18 Lg Innotek Co., Ltd. Light emitting device and lighting apparatus having the same
US9337385B2 (en) 2013-07-09 2016-05-10 Kabushiki Kaisha Toshiba Semiconductor light emitting element and method for manufacturing the same
WO2017154973A1 (ja) * 2016-03-08 2017-09-14 株式会社 東芝 半導体発光素子およびその製造方法

Also Published As

Publication number Publication date
KR100568297B1 (ko) 2006-04-05
US7470938B2 (en) 2008-12-30
KR20050097075A (ko) 2005-10-07
US20050221521A1 (en) 2005-10-06

Similar Documents

Publication Publication Date Title
JP2005286291A (ja) 窒化物半導体発光素子及びその製造方法
KR100669142B1 (ko) 발광 소자와 이의 제조 방법
KR101004310B1 (ko) 광추출 효율이 향상된 발광 소자 및 그 제조 방법
US9153739B2 (en) Light emitting devices with textured active layer
JP5181371B2 (ja) 半導体発光装置
JP6751562B2 (ja) 側方放射用に成形された成長基板を有するled
CN103650174A (zh) 用于实现非对称光输出的发光二极管(led)
CN102263176A (zh) 发光器件、发光器件封装以及发光装置系统
CN105679915A (zh) 透镜和包括该透镜的发光器件模块
US20120171791A1 (en) Method for fabricating light emitting diode chip
JP5306779B2 (ja) 発光素子及びその製造方法
CN102332520A (zh) 发光器件
CN103187499B (zh) 发光二极管及其制作方法
CN102130256A (zh) 发光二极管及其制造方法
WO2021179279A1 (zh) 一种半导体发光元件及其制作方法
JP2009059851A (ja) 半導体発光ダイオード
CN102130252A (zh) 发光二极管及其制造方法
KR100889569B1 (ko) 질화물계 발광소자 및 그 제조방법
CN102064253A (zh) 发光二极管及其制造方法
KR100936058B1 (ko) 경사 입사 증착법을 이용한 발광효율이 향상된 질화물 발광소자 제조 방법 및 질화물 발광소자
CN114744095A (zh) 微型led芯片的制备方法、微型led芯片及显示设备
KR100716648B1 (ko) 복수개의 발광셀들을 갖는 발광소자 및 그 제조방법
KR100644052B1 (ko) 고 광적출 효율 발광 다이오드 및 그의 제조 방법
KR20100008513A (ko) 화합물 반도체 기판, 그 제조 방법 및 이를 이용한 화합물반도체 소자
KR102370021B1 (ko) 나노구조 반도체 발광소자 제조 방법

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070612

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070911

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071023