JP2005286291A - 窒化物半導体発光素子及びその製造方法 - Google Patents
窒化物半導体発光素子及びその製造方法 Download PDFInfo
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- JP2005286291A JP2005286291A JP2004329867A JP2004329867A JP2005286291A JP 2005286291 A JP2005286291 A JP 2005286291A JP 2004329867 A JP2004329867 A JP 2004329867A JP 2004329867 A JP2004329867 A JP 2004329867A JP 2005286291 A JP2005286291 A JP 2005286291A
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- Prior art keywords
- substrate
- nitride semiconductor
- pattern
- semiconductor layer
- emitting device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 127
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 125
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 7
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 27
- 229920002120 photoresistant polymer Polymers 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 8
- 229910052594 sapphire Inorganic materials 0.000 claims description 8
- 239000010980 sapphire Substances 0.000 claims description 8
- 230000001788 irregular Effects 0.000 claims description 3
- 229910003465 moissanite Inorganic materials 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 10
- 229910052757 nitrogen Inorganic materials 0.000 abstract 5
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/918—Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040021801A KR100568297B1 (ko) | 2004-03-30 | 2004-03-30 | 질화물 반도체 발광 소자 및 그 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005286291A true JP2005286291A (ja) | 2005-10-13 |
Family
ID=35054899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004329867A Pending JP2005286291A (ja) | 2004-03-30 | 2004-11-12 | 窒化物半導体発光素子及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7470938B2 (ko) |
JP (1) | JP2005286291A (ko) |
KR (1) | KR100568297B1 (ko) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007251130A (ja) * | 2006-03-17 | 2007-09-27 | Epitech Technology Corp | 発光ダイオード及びその製造方法 |
JP2013038438A (ja) * | 2007-11-14 | 2013-02-21 | Cree Inc | ワイヤボンディングのないウェーハ段階のled |
KR101298927B1 (ko) * | 2011-12-26 | 2013-08-22 | 전자부품연구원 | 질화물계 발광 다이오드 및 그의 제조 방법 |
JP2014082496A (ja) * | 2012-10-17 | 2014-05-08 | Lg Innotek Co Ltd | 発光素子 |
US9130134B2 (en) | 2012-09-21 | 2015-09-08 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing same |
US9337385B2 (en) | 2013-07-09 | 2016-05-10 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element and method for manufacturing the same |
KR101745996B1 (ko) * | 2011-01-03 | 2017-06-12 | 엘지이노텍 주식회사 | 발광소자 |
WO2017154973A1 (ja) * | 2016-03-08 | 2017-09-14 | 株式会社 東芝 | 半導体発光素子およびその製造方法 |
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KR100649494B1 (ko) * | 2004-08-17 | 2006-11-24 | 삼성전기주식회사 | 레이저를 이용하여 발광 다이오드 기판을 표면 처리하는발광 다이오드 제조 방법 및 이 방법에 의해 제조된 발광다이오드 |
KR100608933B1 (ko) * | 2004-11-19 | 2006-08-08 | 광주과학기술원 | 기판에 건식식각을 수행하여 개선된 광추출 효율을 가지는고효율 ⅲ-ⅴ 질화물계 플립칩 구조의 반도체 발광소자제조방법 |
DE112005002889B4 (de) * | 2004-12-14 | 2015-07-23 | Seoul Viosys Co., Ltd. | Licht emittierendes Bauelement mit einer Mehrzahl Licht emittierender Zellen und Baugruppen-Montage desselben |
EP1864339A4 (en) | 2005-03-11 | 2010-12-29 | Seoul Semiconductor Co Ltd | LIGHT-EMITTING DIODE DIODE WITH PHOTO-EMITTING CELL MATRIX |
KR100650990B1 (ko) * | 2005-03-21 | 2006-11-29 | 주식회사 이츠웰 | 질화물 반도체 발광 다이오드 및 그의 제조 방법 |
KR100631981B1 (ko) * | 2005-04-07 | 2006-10-11 | 삼성전기주식회사 | 수직구조 3족 질화물 발광 소자 및 그 제조 방법 |
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KR100716790B1 (ko) * | 2005-09-26 | 2007-05-14 | 삼성전기주식회사 | 질화갈륨계 반도체 발광소자 및 그 제조방법 |
KR101158076B1 (ko) * | 2006-01-13 | 2012-06-22 | 서울옵토디바이스주식회사 | 요철 반도체층을 갖는 발광 다이오드의 제조 방법 및 이를위한 발광 다이오드 |
KR100659373B1 (ko) | 2006-02-09 | 2006-12-19 | 서울옵토디바이스주식회사 | 패터닝된 발광다이오드용 기판 및 그것을 채택하는 발광다이오드 |
JP4637781B2 (ja) * | 2006-03-31 | 2011-02-23 | 昭和電工株式会社 | GaN系半導体発光素子の製造方法 |
KR101229830B1 (ko) * | 2006-04-14 | 2013-02-04 | 서울옵토디바이스주식회사 | 교류용 발광다이오드 및 그 제조방법 |
KR100735496B1 (ko) * | 2006-05-10 | 2007-07-04 | 삼성전기주식회사 | 수직구조 질화갈륨계 led 소자의 제조방법 |
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Also Published As
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KR100568297B1 (ko) | 2006-04-05 |
US7470938B2 (en) | 2008-12-30 |
KR20050097075A (ko) | 2005-10-07 |
US20050221521A1 (en) | 2005-10-06 |
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