JP2005260015A5 - - Google Patents
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- Publication number
- JP2005260015A5 JP2005260015A5 JP2004070051A JP2004070051A JP2005260015A5 JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5 JP 2004070051 A JP2004070051 A JP 2004070051A JP 2004070051 A JP2004070051 A JP 2004070051A JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- held
- disposed
- plasma
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 21
- 238000007664 blowing Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 3
- 238000005507 spraying Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004070051A JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004070051A JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005260015A JP2005260015A (ja) | 2005-09-22 |
| JP2005260015A5 true JP2005260015A5 (enExample) | 2007-04-26 |
| JP4459666B2 JP4459666B2 (ja) | 2010-04-28 |
Family
ID=35085444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004070051A Expired - Fee Related JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4459666B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101218114B1 (ko) * | 2005-08-04 | 2013-01-18 | 주성엔지니어링(주) | 플라즈마 식각 장치 |
| JP2009302401A (ja) * | 2008-06-16 | 2009-12-24 | Tokyo Seimitsu Co Ltd | チャックテーブル洗浄方法、チャックテーブル洗浄装置及び半導体ウェーハ平面加工装置 |
| JP4696165B2 (ja) * | 2009-02-03 | 2011-06-08 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| US11921427B2 (en) | 2018-11-14 | 2024-03-05 | Lam Research Corporation | Methods for making hard masks useful in next-generation lithography |
| CN113227909B (zh) | 2018-12-20 | 2025-07-04 | 朗姆研究公司 | 抗蚀剂的干式显影 |
| TWI837391B (zh) | 2019-06-26 | 2024-04-01 | 美商蘭姆研究公司 | 利用鹵化物化學品的光阻顯影 |
| WO2021146138A1 (en) | 2020-01-15 | 2021-07-22 | Lam Research Corporation | Underlayer for photoresist adhesion and dose reduction |
| WO2022010809A1 (en) | 2020-07-07 | 2022-01-13 | Lam Research Corporation | Integrated dry processes for patterning radiation photoresist patterning |
| KR102797476B1 (ko) * | 2020-11-13 | 2025-04-21 | 램 리써치 코포레이션 | 포토레지스트의 건식 제거를 위한 프로세스 툴 |
| JP7769144B2 (ja) | 2023-03-17 | 2025-11-12 | ラム リサーチ コーポレーション | Euvパターニングのための乾式現像およびエッチングプロセスの単一プロセスチャンバへの統合 |
-
2004
- 2004-03-12 JP JP2004070051A patent/JP4459666B2/ja not_active Expired - Fee Related
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