JP2005251919A - バンプボンディング装置及びバンプ不着検出方法 - Google Patents

バンプボンディング装置及びバンプ不着検出方法 Download PDF

Info

Publication number
JP2005251919A
JP2005251919A JP2004059118A JP2004059118A JP2005251919A JP 2005251919 A JP2005251919 A JP 2005251919A JP 2004059118 A JP2004059118 A JP 2004059118A JP 2004059118 A JP2004059118 A JP 2004059118A JP 2005251919 A JP2005251919 A JP 2005251919A
Authority
JP
Japan
Prior art keywords
bump
ball
capillary
wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004059118A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005251919A5 (https=
Inventor
Kuniyuki Takahashi
邦行 高橋
Fumihiko Kato
文彦 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004059118A priority Critical patent/JP2005251919A/ja
Priority to TW094101995A priority patent/TW200531195A/zh
Priority to KR1020050016556A priority patent/KR100628706B1/ko
Priority to US11/071,842 priority patent/US20050194422A1/en
Publication of JP2005251919A publication Critical patent/JP2005251919A/ja
Publication of JP2005251919A5 publication Critical patent/JP2005251919A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Wire Bonding (AREA)
JP2004059118A 2004-03-03 2004-03-03 バンプボンディング装置及びバンプ不着検出方法 Pending JP2005251919A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004059118A JP2005251919A (ja) 2004-03-03 2004-03-03 バンプボンディング装置及びバンプ不着検出方法
TW094101995A TW200531195A (en) 2004-03-03 2005-01-24 Bump bonding apparatus and method for inspecting bump non-adhesion
KR1020050016556A KR100628706B1 (ko) 2004-03-03 2005-02-28 범프 본딩장치 및 범프 불착 검출방법
US11/071,842 US20050194422A1 (en) 2004-03-03 2005-03-03 Bump bonding apparatus and bump bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004059118A JP2005251919A (ja) 2004-03-03 2004-03-03 バンプボンディング装置及びバンプ不着検出方法

Publications (2)

Publication Number Publication Date
JP2005251919A true JP2005251919A (ja) 2005-09-15
JP2005251919A5 JP2005251919A5 (https=) 2006-07-27

Family

ID=34909148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004059118A Pending JP2005251919A (ja) 2004-03-03 2004-03-03 バンプボンディング装置及びバンプ不着検出方法

Country Status (4)

Country Link
US (1) US20050194422A1 (https=)
JP (1) JP2005251919A (https=)
KR (1) KR100628706B1 (https=)
TW (1) TW200531195A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100720269B1 (ko) * 2006-05-10 2007-05-23 삼성에스디에스 주식회사 Ｒｆｉｄ 태그 라벨 자동 부착시스템 및 그 방법
KR101231192B1 (ko) * 2008-03-19 2013-02-07 삼성테크윈 주식회사 와이어 본딩 모니터링 장치, 와이어 본딩 장비 및 와이어볼의 본딩 높이 값 모니터링 방법
JP2010123817A (ja) * 2008-11-21 2010-06-03 Fujitsu Ltd ワイヤボンディング方法および電子装置とその製造方法
JP2011066191A (ja) * 2009-09-17 2011-03-31 Renesas Electronics Corp 半導体装置の製造方法およびボンディング装置
SG187721A1 (en) * 2010-08-10 2013-03-28 Kulicke & Soffa Ind Inc Wire loops, methods of forming wire loops, and related process
US9604305B2 (en) * 2011-10-26 2017-03-28 GM Global Technology Operations LLC Quality status display for a vibration welding process
KR101620351B1 (ko) * 2012-01-30 2016-05-12 삼성전자주식회사 회로소자의 와이어 본딩 방법
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
US10755988B2 (en) 2018-06-29 2020-08-25 Kulicke And Soffa, Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370556B2 (ja) * 1997-05-14 2003-01-27 株式会社新川 ワイヤボンディング装置及びその制御方法
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
US6237833B1 (en) * 1998-06-15 2001-05-29 Rohm Co., Ltd. Method of checking wirebond condition

Also Published As

Publication number Publication date
TW200531195A (en) 2005-09-16
KR100628706B1 (ko) 2006-09-29
KR20060043245A (ko) 2006-05-15
US20050194422A1 (en) 2005-09-08

Similar Documents

Publication Publication Date Title
US11004821B2 (en) Wire bonding method and wire bonding apparatus
EP0368533B1 (en) Quality control for wire bonding
JP5827758B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JP5426000B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JP5008014B2 (ja) ワイヤクランピング用のワイヤボンディング装置及び方法、ボールの自動的形成方法、並びにワイヤボンディング部
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
JP2007180348A (ja) ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
CN104282591B (zh) 用于在导线键合过程中测量无空气球尺寸的方法和装置
US8231046B2 (en) Wire bonding apparatus and wire bonding method
JP2005251919A (ja) バンプボンディング装置及びバンプ不着検出方法
JP4106008B2 (ja) ワイヤボンディング方法及び装置
JP2617351B2 (ja) ワイヤ接続不良検出方法
JP7416491B2 (ja) ワイヤボンディング装置、ワイヤ切断方法及びプログラム
JP2009059878A (ja) ボンディング装置及びボンディング方法
JP2765833B2 (ja) 半導体装置のワイヤボンディング方法
KR100691222B1 (ko) 와이어 본딩 방법
TW202536983A (zh) 導線接合裝置、控制裝置及控制方法
JPH05283463A (ja) ワイヤボンディング方法
JPH08236573A (ja) ワイヤボンディング装置
JP3171012B2 (ja) ワイヤボンディング方法及びワイヤボンディング装置
JP2000294592A (ja) バンプボンディング装置、及びバンプ検査方法
JPH09115940A (ja) ワイヤボンディング方法
JPH06333971A (ja) ワイヤボンディング装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060613

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060613

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080317

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080711