JP2005251176A5 - - Google Patents

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Publication number
JP2005251176A5
JP2005251176A5 JP2005018817A JP2005018817A JP2005251176A5 JP 2005251176 A5 JP2005251176 A5 JP 2005251176A5 JP 2005018817 A JP2005018817 A JP 2005018817A JP 2005018817 A JP2005018817 A JP 2005018817A JP 2005251176 A5 JP2005251176 A5 JP 2005251176A5
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JP
Japan
Prior art keywords
filler
antenna
thin film
integrated circuit
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005018817A
Other languages
English (en)
Japanese (ja)
Other versions
JP4939757B2 (ja
JP2005251176A (ja
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Publication date
Application filed filed Critical
Priority to JP2005018817A priority Critical patent/JP4939757B2/ja
Priority claimed from JP2005018817A external-priority patent/JP4939757B2/ja
Publication of JP2005251176A publication Critical patent/JP2005251176A/ja
Publication of JP2005251176A5 publication Critical patent/JP2005251176A5/ja
Application granted granted Critical
Publication of JP4939757B2 publication Critical patent/JP4939757B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005018817A 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード Expired - Fee Related JP4939757B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005018817A JP4939757B2 (ja) 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004027699 2004-02-04
JP2004027699 2004-02-04
JP2005018817A JP4939757B2 (ja) 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード

Publications (3)

Publication Number Publication Date
JP2005251176A JP2005251176A (ja) 2005-09-15
JP2005251176A5 true JP2005251176A5 (https=) 2008-02-14
JP4939757B2 JP4939757B2 (ja) 2012-05-30

Family

ID=35031549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005018817A Expired - Fee Related JP4939757B2 (ja) 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード

Country Status (1)

Country Link
JP (1) JP4939757B2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5127167B2 (ja) * 2005-06-30 2013-01-23 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
US7727859B2 (en) 2005-06-30 2010-06-01 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
JP4640221B2 (ja) 2006-03-10 2011-03-02 セイコーエプソン株式会社 インクカートリッジ及びプリンタ
JP4661643B2 (ja) 2006-03-13 2011-03-30 セイコーエプソン株式会社 半導体装置、インクカートリッジ及び電子機器
JP5196389B2 (ja) * 2006-03-23 2013-05-15 大阪シーリング印刷株式会社 Ｒｆｉｄラベル及びｒｆｉｄラベルの製造方法
JP2008236705A (ja) * 2006-08-09 2008-10-02 Daido Steel Co Ltd 超広帯域通信用アンテナ
EP1970951A3 (en) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101596698B1 (ko) * 2008-04-25 2016-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치 제조 방법
JP5351201B2 (ja) * 2011-03-25 2013-11-27 株式会社東芝 不揮発性半導体記憶装置及びその製造方法
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
KR102931665B1 (ko) 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
JP7136448B2 (ja) * 2018-11-22 2022-09-13 パイクリスタル株式会社 プロセスユニット並びに電子タグ及びその製造方法
KR102857459B1 (ko) * 2019-05-31 2025-09-08 컴포시큐어 엘.엘.씨. Rfid 디바이스
WO2021174033A1 (en) * 2020-02-26 2021-09-02 Avery Dennison Retail Information Services, Llc Rfid security label for packaging
JP2023107554A (ja) * 2022-01-24 2023-08-03 サトーホールディングス株式会社 容器及び容器の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2970411B2 (ja) * 1993-08-04 1999-11-02 株式会社日立製作所 半導体装置
JPH1044655A (ja) * 1996-07-30 1998-02-17 Toppan Printing Co Ltd Ｉｃカードおよびｉｃカードの製造方法
JP2001175829A (ja) * 1999-10-08 2001-06-29 Dainippon Printing Co Ltd 非接触式データキャリアおよびｉｃチップ
JP4620237B2 (ja) * 2000-10-18 2011-01-26 大日本印刷株式会社 防湿耐水性仕様非接触データキャリア
JP2002366917A (ja) * 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するｉｃカード
JP2003069238A (ja) * 2001-08-29 2003-03-07 Kyocera Corp 絶縁フィルムおよびこれを用いた多層配線基板

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