JP4939757B2 - Ｉｄラベル、ｉｄタグ及びｉｄカード - Google Patents

Ｉｄラベル、ｉｄタグ及びｉｄカード Download PDF

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Publication number
JP4939757B2
JP4939757B2 JP2005018817A JP2005018817A JP4939757B2 JP 4939757 B2 JP4939757 B2 JP 4939757B2 JP 2005018817 A JP2005018817 A JP 2005018817A JP 2005018817 A JP2005018817 A JP 2005018817A JP 4939757 B2 JP4939757 B2 JP 4939757B2
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JP
Japan
Prior art keywords
antenna
thin film
integrated circuit
label
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005018817A
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English (en)
Japanese (ja)
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JP2005251176A5 (https=
JP2005251176A (ja
Inventor
康行 荒井
麻衣 秋葉
祐子 舘村
洋平 神野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005018817A priority Critical patent/JP4939757B2/ja
Publication of JP2005251176A publication Critical patent/JP2005251176A/ja
Publication of JP2005251176A5 publication Critical patent/JP2005251176A5/ja
Application granted granted Critical
Publication of JP4939757B2 publication Critical patent/JP4939757B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
JP2005018817A 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード Expired - Fee Related JP4939757B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005018817A JP4939757B2 (ja) 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004027699 2004-02-04
JP2004027699 2004-02-04
JP2005018817A JP4939757B2 (ja) 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード

Publications (3)

Publication Number Publication Date
JP2005251176A JP2005251176A (ja) 2005-09-15
JP2005251176A5 JP2005251176A5 (https=) 2008-02-14
JP4939757B2 true JP4939757B2 (ja) 2012-05-30

Family

ID=35031549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005018817A Expired - Fee Related JP4939757B2 (ja) 2004-02-04 2005-01-26 Ｉｄラベル、ｉｄタグ及びｉｄカード

Country Status (1)

Country Link
JP (1) JP4939757B2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5127167B2 (ja) * 2005-06-30 2013-01-23 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
US7727859B2 (en) 2005-06-30 2010-06-01 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
JP4640221B2 (ja) 2006-03-10 2011-03-02 セイコーエプソン株式会社 インクカートリッジ及びプリンタ
JP4661643B2 (ja) 2006-03-13 2011-03-30 セイコーエプソン株式会社 半導体装置、インクカートリッジ及び電子機器
JP5196389B2 (ja) * 2006-03-23 2013-05-15 大阪シーリング印刷株式会社 Ｒｆｉｄラベル及びｒｆｉｄラベルの製造方法
JP2008236705A (ja) * 2006-08-09 2008-10-02 Daido Steel Co Ltd 超広帯域通信用アンテナ
EP1970951A3 (en) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101596698B1 (ko) * 2008-04-25 2016-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치 제조 방법
JP5351201B2 (ja) * 2011-03-25 2013-11-27 株式会社東芝 不揮発性半導体記憶装置及びその製造方法
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
KR102931665B1 (ko) 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
JP7136448B2 (ja) * 2018-11-22 2022-09-13 パイクリスタル株式会社 プロセスユニット並びに電子タグ及びその製造方法
KR102857459B1 (ko) * 2019-05-31 2025-09-08 컴포시큐어 엘.엘.씨. Rfid 디바이스
WO2021174033A1 (en) * 2020-02-26 2021-09-02 Avery Dennison Retail Information Services, Llc Rfid security label for packaging
JP2023107554A (ja) * 2022-01-24 2023-08-03 サトーホールディングス株式会社 容器及び容器の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2970411B2 (ja) * 1993-08-04 1999-11-02 株式会社日立製作所 半導体装置
JPH1044655A (ja) * 1996-07-30 1998-02-17 Toppan Printing Co Ltd Ｉｃカードおよびｉｃカードの製造方法
JP2001175829A (ja) * 1999-10-08 2001-06-29 Dainippon Printing Co Ltd 非接触式データキャリアおよびｉｃチップ
JP4620237B2 (ja) * 2000-10-18 2011-01-26 大日本印刷株式会社 防湿耐水性仕様非接触データキャリア
JP2002366917A (ja) * 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するｉｃカード
JP2003069238A (ja) * 2001-08-29 2003-03-07 Kyocera Corp 絶縁フィルムおよびこれを用いた多層配線基板

Also Published As

Publication number Publication date
JP2005251176A (ja) 2005-09-15

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