JP2005233757A - ホールパターン検査方法及びホールパターン検査装置 - Google Patents
ホールパターン検査方法及びホールパターン検査装置 Download PDFInfo
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- JP2005233757A JP2005233757A JP2004042919A JP2004042919A JP2005233757A JP 2005233757 A JP2005233757 A JP 2005233757A JP 2004042919 A JP2004042919 A JP 2004042919A JP 2004042919 A JP2004042919 A JP 2004042919A JP 2005233757 A JP2005233757 A JP 2005233757A
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000007689 inspection Methods 0.000 claims description 32
- 238000010894 electron beam technology Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 230000007261 regionalization Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
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- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004042919A JP2005233757A (ja) | 2004-02-19 | 2004-02-19 | ホールパターン検査方法及びホールパターン検査装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004042919A JP2005233757A (ja) | 2004-02-19 | 2004-02-19 | ホールパターン検査方法及びホールパターン検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005233757A true JP2005233757A (ja) | 2005-09-02 |
| JP2005233757A5 JP2005233757A5 (enExample) | 2008-12-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004042919A Pending JP2005233757A (ja) | 2004-02-19 | 2004-02-19 | ホールパターン検査方法及びホールパターン検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005233757A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007114642A1 (en) * | 2006-04-03 | 2007-10-11 | Cebt Co. Ltd. | Hole inspection apparatus and hole inspection method using the same |
| JP2011192837A (ja) * | 2010-03-15 | 2011-09-29 | Toshiba Corp | 評価装置および評価方法 |
-
2004
- 2004-02-19 JP JP2004042919A patent/JP2005233757A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007114642A1 (en) * | 2006-04-03 | 2007-10-11 | Cebt Co. Ltd. | Hole inspection apparatus and hole inspection method using the same |
| JP2011192837A (ja) * | 2010-03-15 | 2011-09-29 | Toshiba Corp | 評価装置および評価方法 |
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