JP2005210804A - リレーの配置構造 - Google Patents
リレーの配置構造 Download PDFInfo
- Publication number
- JP2005210804A JP2005210804A JP2004013364A JP2004013364A JP2005210804A JP 2005210804 A JP2005210804 A JP 2005210804A JP 2004013364 A JP2004013364 A JP 2004013364A JP 2004013364 A JP2004013364 A JP 2004013364A JP 2005210804 A JP2005210804 A JP 2005210804A
- Authority
- JP
- Japan
- Prior art keywords
- relay
- bus bar
- relays
- circuit board
- arrangement structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 29
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000000057 synthetic resin Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 5
- 230000007257 malfunction Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
- H01H2050/049—Assembling or mounting multiple relays in one common housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/14—Terminal arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Or Junction Boxes (AREA)
Abstract
【解決手段】二枚の回路板1’,3’が対向して配置され、一方の回路板1’に一方のリレー2が設けられ、一方のリレーに隣接して並列に、他方の回路板3’に他方のリレー4が設けられたリレーの配置構造を基本とする。各回路板1’,3’が垂直に配置され、各回路板に設けられた各リレー2,4が縦方向又は横方向に並列に配置される。回路板1’,3’がバスバー回路板であり、バスバー6,13にリレー2,4の端子7が接続される。バスバー6,13の一部がコネクタ用の端子部6c,13cとして回路板1’,3’から突出する。一方及び/又は他方の回路板1’,3’のバスバー6,13が他方及び/又は一方のリレー4,2に対してサブ絶縁基板9,14で覆われる。
【選択図】図2
Description
2 一方のリレー
3’ 他方の回路板
4 他方のリレー
6,13 バスバー
7 端子
6c,13c 端子部
9,14 サブ絶縁基板
Claims (5)
- 二枚の回路板が対向して配置され、一方の回路板に一方のリレーが設けられ、該一方のリレーに隣接して並列に、他方の回路板に他方のリレーが設けられたことを特徴とするリレーの配置構造。
- 前記各回路板が垂直に配置され、各回路板に設けられた前記各リレーが縦方向又は横方向に並列に配置されたことを特徴とする請求項1記載のリレーの配置構造。
- 前記回路板がバスバー回路板であり、バスバーに前記リレーの端子が接続されたことを特徴とする請求項1又は2記載のリレーの配置構造。
- 前記バスバーの一部がコネクタ用の端子部として前記回路板から突出したことを特徴とする請求項3記載のリレーの配置構造。
- 前記一方及び/又は他方の回路板のバスバーが前記他方及び/又は一方のリレーに対してサブ絶縁基板で覆われたことを特徴とする請求項3又は4記載のリレーの配置構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004013364A JP2005210804A (ja) | 2004-01-21 | 2004-01-21 | リレーの配置構造 |
US11/037,059 US20050159024A1 (en) | 2004-01-21 | 2005-01-19 | Relay arrangement structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004013364A JP2005210804A (ja) | 2004-01-21 | 2004-01-21 | リレーの配置構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005210804A true JP2005210804A (ja) | 2005-08-04 |
Family
ID=34747360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004013364A Pending JP2005210804A (ja) | 2004-01-21 | 2004-01-21 | リレーの配置構造 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050159024A1 (ja) |
JP (1) | JP2005210804A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010022161A (ja) * | 2008-07-11 | 2010-01-28 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
US7763796B2 (en) | 2006-01-30 | 2010-07-27 | Autonetworks Technologies, Ltd. | Electric connection box and manufacturing method of electric connection box |
CN103326212A (zh) * | 2012-03-22 | 2013-09-25 | 矢崎总业株式会社 | 电子零件模块 |
JP2013236512A (ja) * | 2012-05-10 | 2013-11-21 | Yazaki Corp | 部品接続体、部品接続モジュール及び電気接続箱 |
KR101382761B1 (ko) * | 2008-03-04 | 2014-04-08 | 델피 테크놀로지스 인코포레이티드 | 릴레이 모듈, 릴레이 모듈을 갖는 전기 센터 및 그 조립 방법 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4365745B2 (ja) * | 2004-08-06 | 2009-11-18 | 矢崎総業株式会社 | コネクタ構造 |
DE102010001472A1 (de) * | 2010-02-02 | 2011-08-04 | Tyco Electronics AMP GmbH, 64625 | Relais |
US20130155641A1 (en) * | 2011-12-14 | 2013-06-20 | Robert Profeta | Relay module |
TWI441578B (zh) * | 2012-01-11 | 2014-06-11 | Delta Electronics Inc | 電路板組合 |
JP6278770B2 (ja) * | 2014-03-19 | 2018-02-14 | キヤノン株式会社 | 被検体情報取得装置 |
CN109041406A (zh) * | 2018-08-21 | 2018-12-18 | 新乡市荣泰电器有限公司 | 空间紧凑型大电流线路板模组及运输车辆用保险丝盒 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3466591A (en) * | 1964-10-30 | 1969-09-09 | Olivetti & Co Spa | Electrical connector for printed-circuit boards |
US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
US6215662B1 (en) * | 2000-03-13 | 2001-04-10 | Intel Corporation | Circuit board with interleaved TO-220 heat sinks |
DE10232566B4 (de) * | 2001-07-23 | 2015-11-12 | Fuji Electric Co., Ltd. | Halbleiterbauteil |
US6885562B2 (en) * | 2001-12-28 | 2005-04-26 | Medtronic Physio-Control Manufacturing Corporation | Circuit package and method for making the same |
US6934152B1 (en) * | 2003-06-27 | 2005-08-23 | Emc Corporation | Systems and methods for connecting an electronic apparatus to a backplane |
-
2004
- 2004-01-21 JP JP2004013364A patent/JP2005210804A/ja active Pending
-
2005
- 2005-01-19 US US11/037,059 patent/US20050159024A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7763796B2 (en) | 2006-01-30 | 2010-07-27 | Autonetworks Technologies, Ltd. | Electric connection box and manufacturing method of electric connection box |
KR101382761B1 (ko) * | 2008-03-04 | 2014-04-08 | 델피 테크놀로지스 인코포레이티드 | 릴레이 모듈, 릴레이 모듈을 갖는 전기 센터 및 그 조립 방법 |
JP2010022161A (ja) * | 2008-07-11 | 2010-01-28 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
CN103326212A (zh) * | 2012-03-22 | 2013-09-25 | 矢崎总业株式会社 | 电子零件模块 |
JP2013198347A (ja) * | 2012-03-22 | 2013-09-30 | Yazaki Corp | 電子部品モジュール |
US9960573B2 (en) | 2012-03-22 | 2018-05-01 | Yazaki Corporation | Electronic part module |
JP2013236512A (ja) * | 2012-05-10 | 2013-11-21 | Yazaki Corp | 部品接続体、部品接続モジュール及び電気接続箱 |
Also Published As
Publication number | Publication date |
---|---|
US20050159024A1 (en) | 2005-07-21 |
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