JP2005191494A - 露光装置、デバイスの製造方法 - Google Patents

露光装置、デバイスの製造方法 Download PDF

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Publication number
JP2005191494A
JP2005191494A JP2003434539A JP2003434539A JP2005191494A JP 2005191494 A JP2005191494 A JP 2005191494A JP 2003434539 A JP2003434539 A JP 2003434539A JP 2003434539 A JP2003434539 A JP 2003434539A JP 2005191494 A JP2005191494 A JP 2005191494A
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JP
Japan
Prior art keywords
load lock
lock chamber
temperature
chamber
exposure apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003434539A
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English (en)
Japanese (ja)
Other versions
JP2005191494A5 (enExample
Inventor
Masami Yonekawa
雅見 米川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003434539A priority Critical patent/JP2005191494A/ja
Priority to US11/019,112 priority patent/US7193682B2/en
Publication of JP2005191494A publication Critical patent/JP2005191494A/ja
Publication of JP2005191494A5 publication Critical patent/JP2005191494A5/ja
Priority to US11/671,571 priority patent/US20070127004A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
JP2003434539A 2003-12-26 2003-12-26 露光装置、デバイスの製造方法 Pending JP2005191494A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003434539A JP2005191494A (ja) 2003-12-26 2003-12-26 露光装置、デバイスの製造方法
US11/019,112 US7193682B2 (en) 2003-12-26 2004-12-22 Exposure apparatus and device manufacturing method
US11/671,571 US20070127004A1 (en) 2003-12-26 2007-02-06 Exposure apparatus and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003434539A JP2005191494A (ja) 2003-12-26 2003-12-26 露光装置、デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2005191494A true JP2005191494A (ja) 2005-07-14
JP2005191494A5 JP2005191494A5 (enExample) 2007-02-01

Family

ID=34791584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003434539A Pending JP2005191494A (ja) 2003-12-26 2003-12-26 露光装置、デバイスの製造方法

Country Status (2)

Country Link
US (2) US7193682B2 (enExample)
JP (1) JP2005191494A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134586A (ja) * 2005-11-11 2007-05-31 Hitachi High-Technologies Corp 真空排気装置
JP2007173275A (ja) * 2005-12-19 2007-07-05 Mitsubishi Heavy Ind Ltd 真空処理システム及び基板予備加熱方法
JP2008147483A (ja) * 2006-12-12 2008-06-26 Tokyo Electron Ltd 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
JP2008258477A (ja) * 2007-04-06 2008-10-23 Canon Inc 処理装置及び雰囲気置換方法
JP2008277779A (ja) * 2007-04-06 2008-11-13 Canon Inc 雰囲気置換方法
JP2009218477A (ja) * 2008-03-12 2009-09-24 Tokyo Electron Ltd ゲートバルブおよび半導体製造装置
JP2011254101A (ja) * 2011-08-22 2011-12-15 Canon Inc ロードロック装置、露光装置、および、デバイス製造方法
JP2014030054A (ja) * 2007-05-18 2014-02-13 Brooks Automation Inc ロードロック高速排気および通気
JP2019212465A (ja) * 2018-06-04 2019-12-12 株式会社ニューフレアテクノロジー 真空装置
CN113491002A (zh) * 2019-01-04 2021-10-08 艾克塞利斯科技公司 经由用于半导体处理设备的经加热腔室壳体减少腔室壁上的凝结气体
JP2024543798A (ja) * 2021-10-28 2024-11-26 アプライド マテリアルズ インコーポレイテッド モデルベースの制御ロードロックポンピング方式

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8113757B2 (en) * 2006-08-01 2012-02-14 Tokyo Electron Limited Intermediate transfer chamber, substrate processing system, and exhaust method for the intermediate transfer chamber
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
US8905124B2 (en) * 2007-06-27 2014-12-09 Taiwan Semiconductor Manufacturing Company, Ltd. Temperature controlled loadlock chamber
JP4359640B2 (ja) * 2007-09-25 2009-11-04 東京エレクトロン株式会社 基板搬送装置及びダウンフロー制御方法
JP2009294439A (ja) * 2008-06-05 2009-12-17 Toshiba Corp レジストパターン形成方法
JP5899209B2 (ja) * 2010-05-28 2016-04-06 アクセリス テクノロジーズ， インコーポレイテッド ワークピース上の結露を防ぐためのアクティブ露点検出およびロードロック通気
EP2444993A1 (en) * 2010-10-21 2012-04-25 Applied Materials, Inc. Load lock chamber, substrate processing system and method for venting
US9242313B2 (en) * 2012-07-30 2016-01-26 General Electric Company Welding furnace and viewport assembly
JP2014139980A (ja) * 2013-01-21 2014-07-31 Hitachi High-Technologies Corp 試料処理装置およびその方法並びに荷電粒子線装置
US10627728B2 (en) * 2017-06-14 2020-04-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method for creating vacuum in load lock chamber
CN116447654B (zh) * 2023-03-07 2023-09-29 北京科技大学 一种保障人员健康舒适的多模式送风末端及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153662A (ja) * 1993-11-30 1995-06-16 Hitachi Ltd パターン描画装置
JP2002252155A (ja) * 2001-02-22 2002-09-06 Nikon Corp 荷電粒子線装置及び方法
JP2003229348A (ja) * 2002-01-31 2003-08-15 Canon Inc 半導体露光装置
JP2003234282A (ja) * 2002-02-08 2003-08-22 Canon Inc 半導体露光装置、およびそれに用いるロードロックチャンバー

Family Cites Families (8)

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US5223113A (en) * 1990-07-20 1993-06-29 Tokyo Electron Limited Apparatus for forming reduced pressure and for processing object
US6468918B1 (en) * 1995-09-29 2002-10-22 Taiwan Semiconductor Manufacturing Company In situ photoresist hot bake in loading chamber of dry etch
KR100189981B1 (ko) * 1995-11-21 1999-06-01 윤종용 진공 시스템을 구비한 반도체 소자 제조장치
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
JPH113861A (ja) * 1997-06-12 1999-01-06 Sony Corp 半導体装置の製造方法及びその装置
KR100296651B1 (ko) * 1998-07-09 2001-10-26 윤종용 반도체진공설비및이를이용하는방법
JP2005158926A (ja) * 2003-11-25 2005-06-16 Canon Inc ロードロック装置および方法
US7452637B2 (en) * 2004-06-09 2008-11-18 Intel Corporation Method and apparatus for clean photomask handling

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153662A (ja) * 1993-11-30 1995-06-16 Hitachi Ltd パターン描画装置
JP2002252155A (ja) * 2001-02-22 2002-09-06 Nikon Corp 荷電粒子線装置及び方法
JP2003229348A (ja) * 2002-01-31 2003-08-15 Canon Inc 半導体露光装置
JP2003234282A (ja) * 2002-02-08 2003-08-22 Canon Inc 半導体露光装置、およびそれに用いるロードロックチャンバー

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134586A (ja) * 2005-11-11 2007-05-31 Hitachi High-Technologies Corp 真空排気装置
JP2007173275A (ja) * 2005-12-19 2007-07-05 Mitsubishi Heavy Ind Ltd 真空処理システム及び基板予備加熱方法
JP2008147483A (ja) * 2006-12-12 2008-06-26 Tokyo Electron Ltd 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
JP2008258477A (ja) * 2007-04-06 2008-10-23 Canon Inc 処理装置及び雰囲気置換方法
JP2008277779A (ja) * 2007-04-06 2008-11-13 Canon Inc 雰囲気置換方法
JP2014030054A (ja) * 2007-05-18 2014-02-13 Brooks Automation Inc ロードロック高速排気および通気
JP2009218477A (ja) * 2008-03-12 2009-09-24 Tokyo Electron Ltd ゲートバルブおよび半導体製造装置
JP2011254101A (ja) * 2011-08-22 2011-12-15 Canon Inc ロードロック装置、露光装置、および、デバイス製造方法
JP2019212465A (ja) * 2018-06-04 2019-12-12 株式会社ニューフレアテクノロジー 真空装置
JP7163073B2 (ja) 2018-06-04 2022-10-31 株式会社ニューフレアテクノロジー 真空装置
CN113491002A (zh) * 2019-01-04 2021-10-08 艾克塞利斯科技公司 经由用于半导体处理设备的经加热腔室壳体减少腔室壁上的凝结气体
CN113491002B (zh) * 2019-01-04 2024-06-11 艾克塞利斯科技公司 经由用于半导体处理设备的经加热腔室壳体减少腔室壁上的凝结气体
TWI850296B (zh) * 2019-01-04 2024-08-01 美商艾克塞利斯科技公司 透過用於半導體處理設備的加熱腔室殼體來減少腔室壁上的凝結氣體的方法、系統和裝置
JP2024543798A (ja) * 2021-10-28 2024-11-26 アプライド マテリアルズ インコーポレイテッド モデルベースの制御ロードロックポンピング方式
JP7739613B2 (ja) 2021-10-28 2025-09-16 アプライド マテリアルズ インコーポレイテッド モデルベースの制御ロードロックポンピング方式

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Publication number Publication date
US20050183823A1 (en) 2005-08-25
US7193682B2 (en) 2007-03-20
US20070127004A1 (en) 2007-06-07

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