JP2005188990A - Package for pressure detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for pressure detector which is enhanced in detecting sensitivity for an externally applied pressure with a small size and can perform precise detection over a long period with high reliability. <P>SOLUTION: This package for pressure detector comprises an insulating base body 1 having a mounting part 1b for mounting a semiconductor element 3 on one main surface thereof, an insulating plate 2 bonded to the insulating base body 1 in a flexible state so as to form a closed space with the other main surface of the insulating base body 1, an electrostatic capacity forming first electrode 7 fitted to the insulating base body 1, and a second electrode 9 fitted to the insulating plate 2. The insulating plate 2 has a recessed part on the closed space-side main surface, and the inner side wall surface of the recessed part is inclined so as to extended outwardly from the bottom side of the recessed part to the insulating base body 1 side. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a package for a pressure detection device used in a pressure detection device for detecting pressure.

  Conventionally, a capacitance type pressure detection device is known as a pressure detection device for detecting pressure. As shown in a cross-sectional view in FIG. 3, this capacitance type pressure detection device has a capacitance type pressure sensitive element 22 and a pressure detection device package on a wiring board 21 made of a ceramic material or a resin material. 28 and a semiconductor element 29 for calculation contained in 28.

  The pressure sensitive element 22 is made of, for example, an electrically insulating material such as a ceramic material, and has an insulating base 24 having a concave portion with a capacitance forming electrode 23 attached to the center of the upper surface thereof. An insulating plate 26 is bonded to the upper surface in a flexible state so that the concave portion of the insulating base 24 becomes a sealed space, and an electrostatic capacitance forming electrode 25 is attached to the main surface on the sealed space side. Each of the capacitance forming electrode 23 and the electrode 25 is composed of an external lead terminal 27 for electrically connecting to the outside. As a result, the capacitance formed between the electrode 23 and the electrode 25 is changed by bending the insulating plate 26 according to the pressure applied from the outside, and this change is calculated by the semiconductor element 29 for calculation. By doing so, the pressure applied from the outside can be detected.

  However, according to this conventional pressure detection device, since the pressure sensitive element 22 and the semiconductor element 29 are individually mounted on the wiring board 21, the pressure detection device is enlarged and the pressure detection electrode 23 and The wiring conductor that connects the electrode 25 and the semiconductor element 29 becomes long, and there is a problem that sensitivity is lowered because unnecessary capacitance is generated.

  Therefore, as shown in a cross-sectional view in FIG. 2, an insulating base 11 having a mounting portion 11 b on which the semiconductor element 13 is mounted on one main surface, and the surface and inside of the insulating base 11 are provided. A plurality of wiring conductors 15 that are electrically connected to each other and a central portion of the other main surface of the insulating base 11 are attached to the wiring conductor 15a that is one of the wiring conductors 15 and electrically connected to the wiring conductor 15a. Insulating plate joined in a flexible state so as to form a sealed space between the first electrode 17 for forming capacitance and the other main surface of the insulating substrate 11 and the central portion of the main surface. 12 is formed on the inner surface of the insulating plate 12 so as to face the first electrode 17 and is electrically connected to a wiring conductor 15b, which is another wiring conductor 15. And a second electrode 19 for the pressure sensing device package is proposed. And are (for example, see Patent Document 1 below).

  According to this pressure detection device package, since the pressure sensitive element is integrally formed in the pressure detection device package that accommodates the semiconductor element 13, the pressure detection device can be reduced in size and the pressure detection electrode and The wiring conductor 15 connecting the semiconductor element 13 can be shortened, and unnecessary capacitance generated between the plurality of wiring conductors 15 can be reduced.

  Conventionally, the wiring conductor 15 of the pressure detection device package, the first electrode 17 for forming the capacitance, and the second electrode 19 are made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc. A metallized paste obtained by adding and mixing an appropriate organic binder, solvent, plasticizer and dispersant is printed on a ceramic green sheet by a conventionally known screen printing method or the like, and these are ceramics to be the insulating substrate 11 and the insulating plate 12. The green sheet is manufactured by firing together with a green ceramic molded body laminated on top and bottom.

  Further, in order to use the first electrode 17 and the second electrode 19 for forming a capacitance, it is necessary to form a certain space region between the first electrode 17 and the second electrode 19. Alternatively, by forming the frame-shaped protrusion 12 a on the outer peripheral portion of the insulating plate 12, a sealed space for forming a capacitance is formed between the insulating base 11 and the insulating plate 12.

  The insulating substrate 11 and the insulating plate 12 are a first bonding metallization layer 18 provided around the first electrode 17 on the insulating substrate 11 and a second bonding material provided on the outer periphery of the insulating plate 12. The metallized layer 20 is attached by bonding with a conductive bonding material such as a brazing material.

In addition, the insulating plate 12 having such a protruding portion 12a is formed with the ceramic green sheet for the protruding portion 12a in which a through hole for forming a sealed space is formed by a punching method or the like, and the second electrode 19. It is formed by laminating ceramic green sheets for the bottom plate portion 12b to form a green sheet for the insulating plate 12, and firing at a high temperature.
JP 2001-356064 A

  However, according to the conventional package for a pressure detection device, when the bottom plate portion 12b of the insulating plate 12 is bent due to pressure applied from the outside, it is bent near the corner between the inner surface of the projection 12a and the bottom plate portion 12b. As a result, the stress generated by the above is concentrated and cracks or the like are likely to occur in the insulating plate 12. For this reason, when a large pressure is applied to the insulating plate 12 from the outside, if a vibration or impact is applied for a long period of time, a crack is generated near the corner between the inner surface of the protruding portion 12a and the bottom plate portion 12b. Therefore, there is a problem that it is difficult to accurately detect the pressure applied from a long time.

  Further, when the insulating base 11 and the insulating plate 12 are bonded, the conductive bonding material such as the brazing material flows out into the sealed space and easily spreads on the second electrode 19 along the inner surface of the protruding portion 12a. Therefore, there is a problem that it is difficult to set the capacitance between the first electrode 17 and the second electrode 19 to a predetermined value. In order to prevent such wetting and spreading of the brazing material, the first bonding metallization layer 18 and the second bonding metallization layer 20 are formed only on the outer peripheral portions of the insulating base 11 and the insulating plate 12 to form a brazing material in a sealed space. If this is not achieved, the bonding area between the first bonding metallization layer 18 and the second bonding metallization layer 20 becomes small, and the bonding strength between the insulating substrate 11 and the insulating plate 12 decreases. It was.

  Therefore, the present invention has been devised in view of the conventional problems, and the purpose thereof is small and has high detection sensitivity of pressure applied from the outside, and can be accurately detected over a long period of time. It is to provide a package for a high pressure sensing device.

  The package for a pressure detection device according to the present invention includes an insulating base having a mounting portion on which a semiconductor element is mounted on one main surface, and a surface and an inside of the insulating base, and each electrode of the semiconductor element is electrically An insulating plate joined to the insulating substrate in a flexible state so as to form a sealed space between the plurality of wiring conductors connected to the other main surface of the insulating substrate, and the inside of the sealed space A first electrode for forming a capacitance that is attached to the other main surface of the insulating base and is electrically connected to one of the wiring conductors, and a first electrode on the inner main surface of the front insulating plate. A package for a pressure detection device, comprising: a second electrode for forming a capacitance that is attached so as to face an electrode and is electrically connected to the other one of the wiring conductors; Is formed with a recess in the inner main surface, and the inner surface of the side wall of the recess is Characterized in that from the bottom side of the serial recess are inclined so as to spread outwardly along with toward the insulating substrate side.

  In the package for a pressure detection device according to the present invention, the recess has an angle between the inner surface and the bottom surface located directly above the outer peripheral end of the first electrode.

  According to the pressure sensing device package of the present invention, the insulating plate has a recess formed in the main surface on the sealed space side, and the inner side surface of the side wall of the recess is wider on the insulating base side than the bottom surface side of the recess. Therefore, when the bottom plate portion, which is a part constituting the bottom surface of the concave portion of the insulating plate, is bent, the stress applied to the corner between the inner surface and the bottom surface is effectively dispersed, and a large pressure is applied to the insulating plate from the outside. Even if vibration, impact, or the like is applied for a long time in the applied state, it is possible to effectively prevent cracks from occurring at the corners between the inner surface and the bottom surface of the recess. Thereby, the package for pressure detection apparatuses which can detect the pressure applied from the outside accurately over a long period of time can be provided.

  In addition, since the inner side surface of the side wall of the recess is inclined, the distance between the joint between the insulating plate and the insulating base and the second electrode can be increased, and the insulating plate and the insulating base are joined. It is possible to effectively prevent the brazing material from spreading on the second electrode.

  According to the pressure detection device package of the present invention, preferably, the recess formed in the insulating plate has a corner between the inner surface and the bottom surface located immediately above the outer peripheral end of the first electrode. The outer peripheries of the first electrode and the second electrode coincide with each other in a plan view so that the areas of the first electrode and the second electrode are equal. It is possible to effectively suppress the non-uniformity of the electrostatic capacitance that is generated by forming the electrostatic capacitance by the end portion of the first electrode and the non-uniform electric lines of force. Thereby, it is possible to provide a package for a pressure detection device that can more accurately detect the pressure applied from the outside.

  Next, the pressure detection device package of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing an example of an embodiment of a pressure detecting device package according to the present invention, wherein 1 is an insulating substrate, 2 is an insulating plate, 3 is a semiconductor element, 7 is a first electrode, and 9 is a second. Electrode.

  The insulating substrate 1 and the insulating plate 2 are made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. Consists of. If the insulating base 1 and the insulating plate 2 are made of, for example, an aluminum oxide sintered body, a suitable organic binder, solvent, plastics for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide are used. Add and mix the agent and dispersant to make a mud, and by molding this into a sheet by a conventionally known doctor blade method, etc., a plurality of ceramic green sheets are obtained. Appropriate punching, laminating, cutting and the like are performed, and a green ceramic molded body is formed by stacking up and down, and is fired at a temperature of about 1600 ° C.

  The insulating base 1 has a concave portion 1a formed on one main surface (the lower surface in FIG. 1), and the concave portion 1a has a mounting portion 1b for mounting the semiconductor element 3 at the center of the bottom surface. The insulating substrate 1 functions as a container for housing the semiconductor element 3. The semiconductor element 3 is mounted on the mounting portion 1b and sealed by being covered in the recess 1a with a resin sealing material 4 such as an epoxy resin. Alternatively, the insulating base 1 may be sealed by joining a lid made of metal, ceramics, or the like to one main surface so as to close the recess 1a.

  A plurality of wiring conductors 5 are led out to the mounting portion 1b, and the wiring conductor 5 and each electrode of the semiconductor element 3 are joined via a conductive bonding material 6 such as a solder bump, so that the semiconductor element 3 Each electrode and each wiring conductor 5 are electrically connected, and the semiconductor element 3 is attached to the mounting portion 1b. Alternatively, the semiconductor element 3 may be connected to the wiring conductor 5 by other electrical connection means such as a bonding wire.

  The wiring conductor 5 functions as a conductive path for electrically connecting each electrode of the semiconductor element 3 to the external electric circuit, the first electrode 7 and the second electrode 9, and a part of the wiring conductor 5 is one main part of the insulating substrate 1. It is led out to the outer peripheral part of the surface, and another part is electrically connected to the first electrode 7 and the second electrode 9.

  Such a wiring conductor 5 is made of metal powder metallization such as tungsten, molybdenum, copper, and silver, and is obtained by adding and mixing an appropriate organic binder, solvent, plasticizer, dispersant, and the like to metal powder such as tungsten. The paste is printed and applied in a predetermined pattern on a ceramic green sheet for the insulating substrate 1 by a well-known screen printing method, and this is fired together with a green ceramic molded body for the insulating substrate 1 to form the inside and the surface of the insulating substrate 1. A predetermined pattern is formed. The exposed surface of the wiring conductor 5 has a thickness of 1 in order to prevent the wiring conductor 5 from being oxidatively corroded and to improve the bonding between the wiring conductor 5 and the conductive bonding material 6 such as solder. It is preferable that a nickel plating layer having a thickness of about 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited.

  A first electrode 7 for forming a capacitance is attached to the center of the other main surface (upper surface in FIG. 1) of the insulating substrate 1, and this first electrode 7 is a part of the wiring conductor 5. Is electrically connected to the wiring conductor 5a. The first electrode 7 and the electrode of the semiconductor element 3 are electrically connected by connecting the electrode of the semiconductor element 3 to the wiring conductor 5a via the conductive bonding material 6 such as a solder bump. The first electrode 7 is formed in a circular shape, for example.

  Further, a frame-shaped first bonding metallization layer 8 is deposited on the outer peripheral portion of the other main surface of the insulating base 1 over the entire periphery, and the insulating plate 2 having the metallized layer 8 and a concave portion to be described later. A sealed space is formed between the insulating base 1 and the insulating plate 2 by bonding the second bonding metallization layer 10 via a brazing material such as a silver-copper brazing material.

  The first bonding metallized layer 8 is electrically connected to a wiring conductor 5b, which is one of the metallized wiring conductors 5. The conductive bonding material 6 such as a solder bump is connected to the electrode of the semiconductor element 3 on the wiring conductor 5b. The electrode of the semiconductor element 3 and the second electrode 9 are electrically connected by being electrically connected via.

  The insulating plate 2 has a rectangular shape, a polygonal shape such as an octagonal shape, or a flat plate shape such as a circular shape, and a frame-shaped protruding portion 2a having a height of 0.01 to 5 mm is formed on the outer peripheral portion of one main surface. Thus, a recess is formed. The bottom plate portion 2b, which is a portion constituting the bottom surface of the concave portion of the insulating plate 2, bends toward the insulating base 1 according to the pressure applied from the outside, and functions as a so-called pressure detecting diaphragm.

  The insulating plate 2 has a low mechanical strength when the thickness of the bottom plate portion 2b is less than 0.01 mm, and is easily broken when the pressure applied from the outside is large. On the other hand, if the thickness of the bottom plate portion 2b exceeds 5 mm, the bottom plate portion 2 is difficult to bend when the pressure applied from the outside is small, and the accuracy as a pressure detecting diaphragm is likely to be lowered. Therefore, the thickness of the bottom plate portion 2b of the concave portion of the insulating plate 2 is preferably in the range of 0.01 to 5 mm.

  A second electrode 9 for forming a capacitance is attached to the bottom surface of the recess of the insulating plate 2. The second electrode 9 is formed in a circular shape, for example, and forms a capacitance for the pressure sensitive element so as to face the first electrode 7 described above.

  The first electrode 7 and the second electrode 9 as described above are made of metal powder metallization such as tungsten, molybdenum, copper, and silver having a thickness of about 10 to 50 μm, and are formed by the same method as the wiring conductor 5. Further, a nickel plating layer having a thickness of about 1 to 10 μm is preferably deposited on the surfaces of the first electrode 7 and the second electrode 9 in order to prevent oxidative corrosion.

  Further, a polygonal or circular frame-shaped second bonding metallization layer 10 electrically connected to the second electrode 9 is attached to the main surface of the protrusion 2a of the insulating plate 2 on the insulating base 1 side. ing. The second bonding metallization layer 10 functions as a bonding base metal layer for bonding the insulating plate 2 to the insulating substrate 1, and the second bonding metallization layer 10 and the first bonding metallization layer 8 are silver- The first metallization layer 8 for bonding and the second metallization layer 10 for bonding are electrically connected to each other through a brazing material such as copper brazing.

  At this time, the first electrode 7 and the second electrode 9 are opposed to each other with a sealed space formed between the insulating base 1 and the insulating plate 2 interposed therebetween, and the first electrode 7 and the second electrode 9 are interposed between the electrodes. A predetermined capacitance is formed according to the area of the first electrode 7 and the distance between the first electrode 7 and the second electrode 9. Then, the bottom plate portion 2b of the insulating plate 2 bends toward the insulating base 1 according to the pressure applied to the other main surface of the insulating plate 2 from the outside, and the distance between the first electrode 7 and the second electrode 9 changes. By changing the capacitance, it functions as a pressure-sensitive element that senses a change in pressure applied from the outside as a change in capacitance. Further, the change in capacitance is transmitted to the semiconductor element 3 accommodated in the recess 1a via the metallized wiring conductors 5a and 5b, and the magnitude of the pressure applied from the outside is known by performing arithmetic processing in the semiconductor element 3. be able to.

  The first bonding metallization layer 8 and the second bonding metallization layer 10 are made of metal powder metallization of tungsten, molybdenum, copper, silver or the like having a thickness of about 10 to 50 μm, and are similar to the wiring conductor 5 described above. It is formed by the method. It should be noted that the surfaces of the first bonding metallization layer 8 and the second bonding metallization layer 10 are prevented from being oxidized and corroded, and the first bonding metallization layer 8 and the second bonding metallization layer 10 are bonded to the brazing material. In order to strengthen the thickness, a nickel plating layer having a thickness of about 1 to 10 μm is preferably applied.

  In addition, in the bonding of the insulating substrate 1 and the insulating plate 2, a nickel plating layer having a thickness of about 1 to 10 μm is previously deposited on the surfaces of the first bonding metallization layer 8 and the second bonding metallization layer 10, respectively. In addition, a brazing material foil made of silver-copper brazing having a thickness of about 10 to 200 μm is sandwiched between the metallizing layer 8 for the first bonding and the metallizing layer 10 for the second bonding, and these are about 850 ° C. in a reducing atmosphere. This is performed by melting the brazing material foil by heating to a temperature of 1 mm and brazing the metallized layer 8 for first bonding and the metallized layer 10 for second bonding.

  The insulating plate 2 of the present invention has a recess formed in the main surface on the sealed space side, and the inner side surface of the side wall of the recess is inclined so as to spread outward from the bottom surface side of the recess toward the insulating base 1 side. doing. As a result, the insulating plate 2 of such a pressure detection device package is formed by, for example, using a punching die or the like to form a through-hole serving as a sealed space in the ceramic green sheet for the protruding portion 2a from one main surface to the other main surface. It forms so that it may spread outside as it goes to the surface side. And after printing the conductor paste used as the 2nd electrode, the metallizing layer 10 for 2nd joining, and the wiring conductor 5 to the ceramic green sheet for the protrusion part 2a, and the ceramic green sheet for the mounting part 2b by these screen printing methods etc., these After laminating the ceramic green sheets so that the inner side surface of the through hole serving as a sealed space spreads outward from the bottom plate portion 2b side toward the side to be joined to the insulating base 1, and after performing a predetermined cutting process, Manufactured by firing at high temperature.

  Moreover, the recessed part used as sealed space can also be formed by pressing a single layer ceramic green sheet using a metal mold | die. In this case, the end on the bottom plate 2b side of the protrusion 2a can be a curved surface, and stress applied to the corner between the bottom surface and the inner surface can be more effectively dispersed. The occurrence of cracks and the like can be more effectively prevented.

  Further, since the bottom plate portion 2b of the insulating plate 2 is formed while being pressed by pressing, the warping and twisting of the bottom plate portion 2b can be extremely reduced, and the insulating plate 2 is formed from a single-layer ceramic green sheet. Therefore, the height of the projecting portion 2a can be reduced, and the distance between the first electrode 7 and the second electrode 9 can be reduced to provide a highly sensitive pressure detecting device package.

  The insulating plate 2 may have recesses formed on both main surfaces, for example. Thereby, when the bottom plate portion 2b of the insulating plate 2 is bent by the pressure applied from the outside, the stress applied to the corner between the bottom surface of the concave portion of the main surface on the sealed space side of the insulating plate 2 and the inner surface is changed to the insulating plate. It becomes possible to disperse even at the angle between the bottom surface of the recess of the other main surface of 2 and the inner surface, and the stress can be dispersed more effectively. Furthermore, the concave portion of the main surface of the insulating plate 2 on the sealed space side may be formed wider than the concave portion of the other main surface. As a result, the peripheral edge of the bottom surface of the recessed portion on the sealed space side is more easily bent, so that the stress applied to the corner between the bottom surface and the inner surface of the recessed portion on the sealed space side can be extremely effectively dispersed, and Even if vibration, impact, or the like is applied to the plate 2 with a large external pressure, cracks or the like can be more effectively prevented from occurring in the insulating plate 2. Therefore, it is possible to provide a package for a pressure detection device that can accurately detect the pressure applied from the outside over a long period of time.

  Moreover, when the inner surface of the recessed part of the insulating plate 2 is a flat inclined surface, the angle formed by the bottom surface of the recessed part and the inner surface is preferably 90 to 135 °. When the angle is smaller than 90 °, when the bottom plate portion 2b of the recess is bent by the pressure applied from the outside, it is difficult to effectively disperse the stress applied to the corner between the bottom surface and the inner surface of the recess. 2 easily cracks. Further, when the angle is larger than 135 °, the area of the second electrode 9 for forming capacitance and the region of the flexible bottom plate portion 2b attached to the bottom surface of the recess is reduced, and the pressure detection sensitivity is reduced. While becoming easy to fall, the area of the 2nd joining metallization layer 10 used as a junction part with the insulating base | substrate 1 becomes small, and the joining strength of the metallizing layer 8 for 1st joining and the metallizing layer 10 for 2nd joining falls. It becomes easy. Moreover, if the area of the 2nd electrode 9 and the area of the metallizing layer 10 for 2nd joining are ensured large, the insulation board 2 will enlarge and a package will enlarge.

  In addition, the inner side surface of the recess of the insulating plate 2 may be a gently curved surface that is inclined so as to spread outward from the bottom surface side of the recess toward the insulating substrate 1. In this case, it is more preferable that the connection is made with a smooth corner so that there is no boundary (ridge) between the bottom surface and the inner side surface of the recess of the insulating plate 2. Thereby, when the bottom plate portion 2b of the concave portion is bent by the pressure applied from the outside, it is possible to disperse the generated stress very effectively and to effectively suppress the occurrence of cracks and the like.

  Furthermore, a step that is recessed inside the protrusion 2a may be provided between the main surface and the inner surface of the protrusion 2a of the insulating plate 2 on the insulating base 1 side. As a result, the brazing material protruding from between the first bonding metallization layer 8 and the second bonding metallization layer 10 can be accumulated at this step, and the brazing material can be effectively prevented from contacting the first electrode 7. Can do. Further, the second bonding metallization layer 10 may be applied to the surface of the step. As a result, when the first bonding metallized layer 8 and the second bonding metallized layer 10 are bonded with a brazing material or the like, a good meniscus is formed by wetting and spreading the brazing material in this step. The brazing material can be more effectively prevented from flowing into the sealed space, and the bonding strength between the first bonding metallization layer 8 and the second bonding metallization layer 10 can be further increased.

  Thus, according to the package for a pressure detection device of the present invention, the first electrode 7 for forming a capacitance is attached to the other main surface of the insulating substrate 1 on which the semiconductor element 3 is mounted on one main surface. In addition, the inner surface of the insulating plate 2 joined to the insulating substrate 1 in a flexible state so as to form a sealed space with the insulating substrate 1 is covered with the first electrode 7 so as to face the first electrode 7. Since the attached second electrode 9 for forming capacitance is provided, the container for housing the semiconductor element 3 and the pressure sensitive element are integrated, and the pressure detection device can be miniaturized.

  In addition, the first electrode 7 and the second electrode 9 for forming capacitance are connected to the respective electrodes of the semiconductor element 3 via the wiring conductors 5a and 5b disposed on the surface and inside of the insulating base 1. Therefore, the first electrode 7 and the second electrode 9 can be connected to the semiconductor element 3 at a short distance, and as a result, the unnecessary capacitance generated between the wiring conductors 5a and 5b is reduced to a small sensitivity. It is possible to provide a high pressure detection device package.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. For example, in FIG. 1, the insulating substrate 1 and the insulating plate 2 are bonded together by a conductive bonding material. After the green sheet for the insulating substrate 1 and the green sheet for the insulating plate 2 are laminated, sintering is performed. It may be integrated. In addition, the inner side surface of the side wall of the recess of the insulating plate 2 is a flat inclined surface or curved surface that spreads outward from the bottom surface side of the recess toward the insulating base 1 side on the bottom surface side of the recess. It may be a vertical surface from the middle to the main surface of the insulating substrate 1.

  The present invention can be used for a pressure detection device for detecting a pressure state of a tire or the like.

It is sectional drawing which shows an example of embodiment of the package for pressure detection apparatuses of this invention. It is sectional drawing of the conventional package for pressure detection apparatuses. It is sectional drawing of the conventional pressure detection apparatus.

Explanation of symbols

1 ·········· Insulation base 1b ····· Mounting portion 2 ················ Insulation plate 2b ··· ·················································· Semiconductor elements 5, 5a, 5b ... Wiring conductor ..... Second electrode

Claims (2)

An insulating base having a mounting portion on which a semiconductor element is mounted on one main surface; and a plurality of wiring conductors disposed on and inside the insulating base and electrically connected to the electrodes of the semiconductor element; An insulating plate joined to the insulating base in a flexible state so as to form a sealed space with the other main surface of the insulating base; and the other main surface of the insulating base in the sealed space. A first electrode for forming a capacitance that is attached and electrically connected to one of the wiring conductors, and is attached to the inner main surface of the front insulating plate so as to face the first electrode; And a second electrode for forming a capacitance electrically connected to the other one of the wiring conductors, wherein the insulating plate has a recess on the inner main surface. The inner surface of the side wall of the recess is formed from the bottom surface side of the recess to the insulating base side. Pressure sensing device package, characterized in that is inclined so as to spread outwardly along with the cow. 2. The package for a pressure detection device according to claim 1, wherein an angle between an inner surface and a bottom surface of the recess is located immediately above an outer peripheral end of the first electrode.

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