CN106323539B - Sensor base - Google Patents
Sensor base Download PDFInfo
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- CN106323539B CN106323539B CN201610848756.0A CN201610848756A CN106323539B CN 106323539 B CN106323539 B CN 106323539B CN 201610848756 A CN201610848756 A CN 201610848756A CN 106323539 B CN106323539 B CN 106323539B
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- passage
- base
- main body
- connecting pipe
- sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
Abstract
The invention discloses a sensor base which comprises a base main body, a lateral passage, a first connecting pipe and a second connecting pipe, wherein one end part of the first connecting pipe is inserted into the base main body, the other end part of the first connecting pipe is exposed out of one end surface of the base main body, and the other end surface of the base main body is communicated with one end part of the first connecting pipe through the first passage; one end of the second connecting pipe is inserted into the base body, the other end is exposed out of one end face of the base body, and the other end face of the base body is communicated with one end of the second connecting pipe through a second passage. The sensor base provided by the invention can be used for packaging various sensors, a plurality of sensors can independently form a composite parameter sensor without the cooperation of other diaphragm capsule parts, the base body can be communicated with the atmosphere through a plurality of channels, an oil filling cavity is arranged between the sensors and the base body, and a circuit board is arranged on the rear side of the sensors.
Description
Technical Field
The invention belongs to the technical field of sensors, and particularly relates to a multi-chip porous sensor base.
Background
The currently used pressure/differential pressure sensor packaging bases have the following disadvantages: 1. 2 or less than 2 oil filling pipes (holes) can only encapsulate one or two sensors, and only one of the two sensors can be used for introducing atmospheric pressure (gauge pressure), so that the practical use is limited in occasions with high precision requirements; 2. the method can only be used for differential pressure sensors with bellows, and cannot be extended to the traditional pressure packaging process: the rapid resistance welding sealing process can not be independently used as a pressure sensor base.
Disclosure of Invention
In view of the shortcomings of the prior art, the present invention is directed to a sensor base for improving the application range thereof.
In order to achieve the above object, the sensor base provided by the present invention comprises a base main body, a lateral passage, a first connecting tube and a second connecting tube, wherein one end of the first connecting tube is inserted into the base main body, the other end of the first connecting tube is exposed out of one end surface of the base main body, and the other end surface of the base main body is communicated with one end of the first connecting tube through the first passage; one end of the second connecting pipe is inserted into the base main body, the other end of the second connecting pipe is exposed out of one end face of the base main body, and the other end face of the base main body is communicated with one end of the second connecting pipe through a second passage;
a third passage and a fourth passage are formed in the base main body, one end of the third passage is communicated with one end of the fourth passage, and the other end of the third passage and the other end of the fourth passage penetrate through two end faces of the base main body respectively;
the end face of the base main body is respectively provided with a first packaging hole, a second packaging hole and a third packaging hole, and the first packaging hole, the second packaging hole and the third packaging hole are respectively communicated with the first passage, the second passage and the third passage;
the lateral passageway is located within the base body and is in vertical communication with the first passageway.
In some embodiments of the present invention, a plurality of voltage-resistant insulating pins further penetrate through two end faces of the base body.
In some embodiments of the present invention, an end surface of the base body, at which the first, second, and third package holes are provided, is recessed inward.
In some embodiments of the present invention, an insulating sintered filler is disposed between the base body and the voltage-resistant insulating pin.
In some embodiments of the present invention, a material guide chute for fixing the first connection pipe and the second connection pipe is provided in the base body.
In some embodiments of the present invention, the diameter of the fourth passage is larger than that of the third passage, so that the third passage 11 and the fourth passage 12 form a T-shaped passage.
In some embodiments of the invention, the first passage has a diameter greater than an inner diameter of the first connection tube, and the first connection tube has an outer diameter greater than the diameter of the first passage.
In some embodiments of the present invention, the second passage has a diameter greater than an inner diameter of the second connection pipe, and an outer diameter of the second connection pipe is greater than the diameter of the second passage.
The invention effectively solves the problems in the prior art, can simultaneously encapsulate 2 arbitrary chips in gauge pressure, differential pressure and absolute pressure, and can be used as a traditional diffused silicon gauge pressure base and a composite multi-parameter sensor base by adding various temperature sensors. The device is particularly suitable for occasions needing to measure temperature, atmospheric pressure and differential pressure simultaneously or occasions needing to measure the differential pressure, the atmospheric pressure and the temperature simultaneously.
Therefore, the sensor base provided by the invention can be used for packaging various sensors, a plurality of sensors can independently form a composite parameter sensor without the cooperation of other diaphragm capsule parts, the base main body can be communicated with the atmosphere through a plurality of channels, an oil filling cavity is arranged between the sensor and the base main body, and a circuit board is arranged at the rear side of the sensor. The invention can charge oil once and in multiple ways, adopts an independent ventilating cavity and ventilates in multiple ways, ensures that a measuring medium is not polluted secondarily, and simultaneously, is naturally ventilated and can effectively prevent dewing and moisture leakage. The invention can adopt a common sealing pin (steel ball) mode for filling, thereby improving the packaging efficiency. In a word, the invention has the advantages of flexible packaging, high production efficiency and wide application range.
Drawings
For a better understanding of the objects, solutions and advantages of the present invention, reference will now be made in detail to the following description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic end view of a sensor base according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along A-A of FIG. 1;
FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1;
fig. 4 is a cross-sectional view taken along the direction C-C in fig. 1.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples.
As shown in fig. 1 to 4, the sensor base according to one embodiment of the present invention includes a base body 1, a lateral passage 8, a first connecting tube 3, and a second connecting tube 4, one end of the first connecting tube 3 is inserted into the base body 1, the other end is exposed to one end surface of the base body 1, and the other end surface of the base body 1 is communicated with one end of the first connecting tube 3 through a first passage 9; one end of the second connection pipe 4 is inserted into the base body 1, the other end is exposed to one end face of the base body 1, and the other end face of the base body 1 is communicated with one end of the second connection pipe 4 through a second passage 10; a third passage 11 and a fourth passage 12 are formed in the base main body 1, one end of the third passage 11 is communicated with one end of the fourth passage 12, and the other end of the third passage 11 and the other end of the fourth passage 12 penetrate through two end faces of the base main body 1 respectively; the end face of the base main body 1 is respectively provided with a first packaging hole 5, a second packaging hole 6 and a third packaging hole 6, and the first packaging hole 5, the second packaging hole 6 and the third packaging hole 6 are respectively communicated with a first passage 9, a second passage 10 and a third passage 11; said lateral passage 8 is located inside the base body 1 and communicates vertically with said first passage 9.
The second packaging hole 6 and the third packaging hole 6 can be used as gauge pressure packaging holes, can independently realize pressure sensor packaging and can be used as pressure sensors, or can be used for packaging 2 pressure sensors to realize multiple applications. The lateral passages 8 are permeable to air and oil. The first passage 9, the second passage 10, the third passage 11 and the fourth passage 12 can be used for air guiding when a plurality of pressure sensors are packaged, and can be filled in various modes.
The end face of the base main body 1 provided with the first packaging hole 5, the second packaging hole 6 and the third packaging hole 6 is recessed inwards, a plurality of chips can be packaged independently to form a multi-pressure sensor, and gauge pressure (differential pressure or absolute pressure sensors) is suitable. The lateral ventilation reference measurement or the axial vertical plane ventilation reference measurement can be selected; can be matched with a differential pressure diaphragm capsule, and simultaneously, a differential pressure sensor, a gauge pressure sensor (absolute pressure sensor) and a temperature sensor are encapsulated to form a multi-parameter sensor.
Preferably, the diameter of the fourth passage 12 is larger than that of the third passage 11, so that the third passage 11 and the fourth passage 12 form a T-shaped passage, which has the advantage that the pin can be sealed, and a tube (equivalent to 3 tubes can be made) can be brazed under the condition that the pin is needed, so as to play a role in positioning and stopping the passage. Likewise, the diameter of the first passage 9 may be larger than the inner diameter of the first connection pipe 3, and the outer diameter of the first connection pipe 3 may be larger than the diameter of the first passage 9. Alternatively, the diameter of the second passage 10 may be larger than the inner diameter of the second connection pipe 4, and the outer diameter of the second connection pipe 4 may be larger than the diameter of the second passage 10.
Furthermore, in another embodiment of the present invention, a plurality of voltage-resistant insulating pins 2 further penetrate through two end surfaces of the base main body 1, and the inside of the base main body 1 adopts a multi-pin insulating structure, so that the use of multi-chip packaging is satisfied, and a temperature sensor can be packaged. Preferably, the voltage-resistant insulating pin 2 is an insulating gold-plated pin, and can be connected with a plurality of temperature sensors and pressure sensors. The pressure-resistant insulating pin 2 is insulated from the base body 1, a thin pin at one end of the pressure-resistant insulating pin 2 can be processed into a mushroom-shaped head, a metal coating can be well used for bonding a pressure sensor lead, a temperature sensor can also be soldered, and the other end of the pressure-resistant insulating pin 2 is provided with measures (including but not limited to gold plating) which can be well rust-proof and easy to solder, and can be connected with an external lead or a circuit board.
Further, an insulating sintered filler is provided between the base body 1 and the voltage-resistant insulating pin 2, thereby insulating the base body 1 from the voltage-resistant insulating pin 2.
A material guide groove 7 is arranged in the base main body 1, and the material guide groove 7 is used for fixing the first connecting pipe 3 and the second connecting pipe 4. Solder filler may be introduced and affixed via an optional process including, but not limited to, glass sintering, stainless steel solder sintering or brazing, silver soldering, laser filler welding, and the like.
On the concave surface of the base main body 1, 2 pressure sensors can be fixed at the positions of a first packaging hole 5 and a second packaging hole (or a third packaging hole) 6, wherein the position of the second packaging hole 6 can be changed and configured as required, the second packaging hole is filled with oil through a third passage 11, sealed through a fourth passage 12 seal pin (steel ball), and guided through a lateral passage 8 and a first passage 9, and at the moment, an optional external appropriate pipe is connected through a first connecting pipe 3 and a second connecting pipe 4, so that the rear-end integral sensor can be conveniently sealed, or the sensor which is used for drying process and keeps gauge pressure can be smoothly connected with an atmosphere reference, if the first connecting pipe 3 is closed and the rear end is not guided, the lateral passage 8 can be laminated to form a double-air-permeable cavity structure, and the double-air-permeable cavity structure is used for high-protection high-precision gauge pressure measurement occasions.
On the concave surface of the base main body 1, the die bonding position of the second packaging hole (or the third packaging hole) 6 is selectable, if the pressure sensor is packaged independently and the rear end of the lead needs air guide and moisture prevention, the first connecting pipe 3 and the second connecting pipe 4 are used for air guide connection, and the third passage 11 and the fourth passage 12 are filled with oil.
On the concave surface of the base main body 1, the die bonding type of a second packaging hole (or a third packaging hole) 6 can be selected, if the die bonding type is used for differential pressure, and if the die bonding type is matched with a differential pressure diaphragm capsule, a pouring seal is formed by a lateral passage 8, a first passage 9, a first connecting pipe 3, a third passage 11 and a fourth passage 12; or the lateral passage 8, the first passage 9, the first connecting pipe 3, the second passage 10 and the second connecting pipe 4 form a pouring seal.
The concave surface of the base main body 1 is used for packaging a rear PCBA. When the lateral passage 8 is used for the double ventilating cavities, a high-molecular moisture-proof ventilating film can be attached; when the oil guide valve is used for a differential pressure diaphragm capsule, the oil guide valve is used for an oil guide path.
Therefore, the sensor base provided by the invention has the following advantages:
firstly, a gauge pressure sensor can be packaged by using a traditional steel ball packaging process, and the utilization rate and the production efficiency are improved by using traditional process equipment;
secondly, an internal multi-pin insulating structure meets the requirement of multi-chip packaging and can be used for packaging a temperature sensor;
thirdly, the side surface ventilation structure adopts a double-cavity ventilation design of a high-molecular ventilation film, so that natural ventilation is realized, condensation and moisture leakage of the gauge pressure sensor can be effectively prevented, and the encapsulation problem is solved;
fourthly, the ventilation structure has double purposes and can be used as a second sensor oil guide channel when packaged for other purposes;
fifthly, the pressure gauge packaging hole is provided with an independent gauge pressure packaging hole, the front end of the pressure gauge packaging hole is concave, the pressure sensor can be packaged independently and used as a pressure sensor, or 2 pressure sensors are packaged, and multiple applications are achieved.
The invention has the advantages that: the existing resistance welding process can be utilized, and the oil pipe can also be utilized for packaging; the pressure sensor can be independently packaged to form a bridge pile pressure sensor, and can also be packaged together with a differential pressure diaphragm capsule to form a multi-parameter sensor; the double-pressure sensor can be used for ventilating by utilizing the back hole and the side hole, so that a breathable film is convenient to attach to the side surface, and the double-cavity ventilating structure sensor is formed by processes such as sealing glue of the hose guided by the axial hole and the like.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (8)
1. A sensor base is characterized by comprising a base main body, a lateral passage, a first connecting pipe and a second connecting pipe, wherein one end part of the first connecting pipe is inserted into the base main body, the other end part of the first connecting pipe is exposed out of one end face of the base main body, and the other end face of the base main body is communicated with one end part of the first connecting pipe through the first passage; one end part of the second connecting pipe is inserted into the base main body, the other end part of the second connecting pipe is exposed out of one end surface of the base main body, and the other end surface of the base main body is communicated with one end part of the second connecting pipe through a second passage;
a third passage and a fourth passage are formed in the base main body, one end of the third passage is communicated with one end of the fourth passage, and the other end of the third passage and the other end of the fourth passage penetrate through two end faces of the base main body respectively;
the end face of the base main body is respectively provided with a first packaging hole, a second packaging hole and a third packaging hole, and the first packaging hole, the second packaging hole and the third packaging hole are respectively communicated with the first passage, the second passage and the third passage;
the lateral passageway is located within the base body and is in vertical communication with the first passageway.
2. The sensor base of claim 1, wherein a plurality of voltage-resistant insulating pins further penetrate through both end faces of the base body.
3. The sensor base of claim 1, wherein an end surface of the base body where the first package hole, the second package hole, and the third package hole are provided is recessed inward.
4. The sensor base of claim 1, wherein an insulating sintered filler is disposed between the base body and the voltage-resistant insulating pin.
5. The sensor base of claim 1, wherein a material guide chute is provided in the base body for fixing the first connection pipe and the second connection pipe.
6. The sensor base of claim 1, wherein the diameter of the fourth passage is larger than the diameter of the third passage, so that the third passage 11 and the fourth passage 12 form a T-shaped passage.
7. The sensor base of claim 1, wherein the first passageway has a diameter greater than an inner diameter of the first connecting tube and the first connecting tube has an outer diameter greater than the diameter of the first passageway.
8. The sensor base of claim 1, wherein the diameter of the second passageway is greater than the inner diameter of the second connecting tube and the outer diameter of the second connecting tube is greater than the diameter of the second passageway.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610848756.0A CN106323539B (en) | 2016-09-23 | 2016-09-23 | Sensor base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610848756.0A CN106323539B (en) | 2016-09-23 | 2016-09-23 | Sensor base |
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| Publication Number | Publication Date |
|---|---|
| CN106323539A CN106323539A (en) | 2017-01-11 |
| CN106323539B true CN106323539B (en) | 2022-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610848756.0A Active CN106323539B (en) | 2016-09-23 | 2016-09-23 | Sensor base |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696273B (en) * | 2019-03-06 | 2021-11-26 | 武汉飞恩微电子有限公司 | Automobile brake boosting vacuum pressure sensor device |
| CN114459665B (en) * | 2022-02-10 | 2023-09-26 | 南京沃天科技股份有限公司 | Differential pressure transmitter structure easy to assemble |
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|---|---|---|---|---|
| US6450039B1 (en) * | 1999-07-16 | 2002-09-17 | Yamatake Corporation | Pressure sensor and method of manufacturing the same |
| JP2005188990A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Package for pressure detector |
| CN101755197A (en) * | 2007-07-24 | 2010-06-23 | 株式会社山武 | Dual pressure sensor |
| DE102011005274A1 (en) * | 2011-03-09 | 2012-09-13 | Endress + Hauser Gmbh + Co. Kg | Ceramic pressure cell |
| CN103438919A (en) * | 2013-09-13 | 2013-12-11 | 蚌埠市创业电子有限责任公司 | Integrated base of multi-parameter silicon piezoresistive differential pressure transducer |
| CN103674411A (en) * | 2013-07-16 | 2014-03-26 | 上海洛丁森工业自动化设备有限公司 | A double-oil conduit differential pressure sensor chip tube base |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6927482B1 (en) * | 2003-10-01 | 2005-08-09 | General Electric Company | Surface mount package and method for forming multi-chip microsensor device |
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2016
- 2016-09-23 CN CN201610848756.0A patent/CN106323539B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6450039B1 (en) * | 1999-07-16 | 2002-09-17 | Yamatake Corporation | Pressure sensor and method of manufacturing the same |
| JP2005188990A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Package for pressure detector |
| CN101755197A (en) * | 2007-07-24 | 2010-06-23 | 株式会社山武 | Dual pressure sensor |
| DE102011005274A1 (en) * | 2011-03-09 | 2012-09-13 | Endress + Hauser Gmbh + Co. Kg | Ceramic pressure cell |
| CN103674411A (en) * | 2013-07-16 | 2014-03-26 | 上海洛丁森工业自动化设备有限公司 | A double-oil conduit differential pressure sensor chip tube base |
| CN103438919A (en) * | 2013-09-13 | 2013-12-11 | 蚌埠市创业电子有限责任公司 | Integrated base of multi-parameter silicon piezoresistive differential pressure transducer |
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| CN106323539A (en) | 2017-01-11 |
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