CN217716722U

CN217716722U - Ultra-thin barrier film low pressure steel seals pressure sensor

Info

Publication number: CN217716722U
Application number: CN202222071104.4U
Authority: CN
Inventors: 韩文娟; 冯杰
Original assignee: Zibo Natai Microsystem Sensing Co ltd
Current assignee: Zibo Natai Microsystem Sensing Co ltd
Priority date: 2022-08-05
Filing date: 2022-08-05
Publication date: 2022-11-01
Anticipated expiration: 2032-08-05

Abstract

The utility model discloses an ultra-thin barrier film low pressure steel seals pressure sensor relates to a sensor, including glass sintering base and diaphragm, establishes the chip installation cavity in the glass sintering base, is equipped with silicon piezoresistive chip in the chip installation cavity, characterized by, the diaphragm is located the sealing department of chip installation cavity, the chip installation cavity is sealed through the diaphragm, the chip installation cavity intussuseption is filled with silicon oil; the glass sintering base is provided with an internal pin, an external pin and a PCB, the silicon piezoresistive chip is connected with the internal pin, the internal pin is connected with the external pin, the external pin is connected with the PCB, and the PCB is connected with a lead; the thickness of the membrane is 0.015mm. The utility model discloses filled the application blank of ultra-thin barrier film on steel seal pressure sensor, ultra-thin barrier film is more excellent than conventional barrier film performance on the temperature drift performance and the sensitivity of induction that promote the product under the equal production condition.

Description

Ultra-thin barrier film low pressure steel seals pressure sensor

Technical Field

The utility model relates to a sensor specifically is an ultra-thin barrier film low pressure steel seals pressure sensor.

Background

The application range of the steel seal series diaphragm pressure sensor is very wide, the use range of the sensor is mainly concentrated in the range of 0-35 kPa-60 MPa, the production of the pressure sensor in the general range is relatively easy, and the extreme range outside the range is always a difficult problem in the industry, such as the low-pressure (within 10 kPa) range, the performance and the precision requirements of the sensor are high due to the small measurement pressure, and the requirements on the structure of the product are met, and the ideal requirements can be met only by strict production and process control.

In terms of sensor structure, when measuring lower pressure, the isolation film is required to have higher sensitivity to pressure, in other words, the thinner the thickness of the isolation film is, the higher the sensitivity to pressure is, and the better the temperature drift performance is. At present, steel seal sensor manufacturers on the market adopt a corrugated isolation membrane with the thickness of 0.02mm in the production of a small range, and the field is blank in China due to the fact that the manufacturing and production difficulty of the thinner isolation membrane is larger.

Disclosure of Invention

The utility model provides an ultra-thin barrier film low pressure steel seals pressure sensor has filled the application blank of the ultra-thin barrier film in this internal field on steel seals pressure sensor, has promoted the temperature drift performance and the sensitivity of response of current sensor.

The utility model discloses the technical scheme who specifically adopts is:

the utility model discloses an ultra-thin barrier film low pressure steel seals pressure sensor, including glass sintering base and diaphragm, establish the chip mounting chamber in the glass sintering base, be equipped with silicon piezoresistive chip in the chip mounting chamber, characterized by, the diaphragm is located the sealing of chip mounting chamber, the chip mounting chamber is sealed through the diaphragm, it is filled with silicon oil in the chip mounting chamber;

the glass sintering base is provided with an internal pin, an external pin and a PCB, the silicon piezoresistive chip is connected with the internal pin, the internal pin is connected with the external pin, the external pin is connected with the PCB, and the PCB is connected with a lead;

the thickness of the membrane is 0.015mm.

Due to the ultra-thin particularity of the diaphragm, in order to ensure that the diaphragm is not deformed after welding and better protect the performance of the diaphragm, the diaphragm is welded to the glass sintering base by laser welding; the application of the ultrathin isolating film on the steel-sealed pressure sensor fills the blank in the field in China, and the sensitivity of the sensor is improved.

Pressure signals of the silicon piezoresistive sensor are transmitted to the PCB through the internal pin and the external pin, and the signals are compensated by the PCB and then transmitted to pressure data through the lead.

Preferably, an oil filling hole is formed in the glass sintering base and communicated with the chip mounting cavity, and a steel ball is arranged at an oil inlet of the oil filling hole.

Generally, silicone oil is filled into the chip mounting cavity from the oil filling hole in a vacuum filling mode, and after filling is completed, the steel ball is welded at the oil inlet of the oil filling hole to seal the chip mounting cavity and prevent oil from overflowing.

Preferably, a pressure guide hole is formed in the glass sintering base, one end of the pressure guide hole is arranged on the back face of the silicon piezoresistive chip, the other end of the pressure guide hole is connected with a pressure guide pipe, and the pressure guide pipe is communicated with the atmosphere.

The pressure guide hole is formed in the center of the glass sintering base, the silicon piezoresistive chip is bonded in the center of the glass sintering base through silica gel, and the silica gel is bonded in the periphery of the silicon piezoresistive chip to ensure that the pressure guide hole and the chip mounting cavity are not ventilated. The back of the silicon piezoresistive chip is communicated with the atmosphere through the pressure guide hole, so that the good performance of the silicon piezoresistive chip is ensured.

Preferably, a ceramic filling block is arranged in the chip mounting cavity, a chip hole and an indexing circular hole are formed in the ceramic filling block, the silicon piezoresistive chip is arranged in the chip hole, and the oil filling hole is communicated with the chip mounting cavity through the indexing circular hole.

And silicone oil is filled into the chip mounting cavity through the oil filling hole and the indexing circular hole, and silicone oil is filled between the diaphragm and the silicon piezoresistive chip.

Preferably, a chip resistor is arranged on the PCB to form a complete ultrathin isolating membrane steel seal pressure sensor.

Preferably, still include the clamping ring, the clamping ring is located the outside of diaphragm, the clamping ring has played the effect of protection diaphragm on laser welding is fixed in glass sintering base, prevents that the diaphragm is not hard up to drop.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses an ultra-thin barrier film low pressure steel seals pressure sensor sets up 0.015 mm's ultra-thin membrane piece, has filled the application blank of ultra-thin barrier film on steel seals pressure sensor, and ultra-thin barrier film is more excellent than conventional barrier film performance on the temperature drift performance and the sensitivity of response that promote the product under the same production condition.

Drawings

Fig. 1 is the structure schematic diagram of the pressure sensor sealed by the ultra-thin isolating film low-pressure steel of the utility model.

In the figure: 1 wire, 2 chip resistors, 3 steel balls, 4 oil filling holes, 5 ceramic filling blocks, 6 diaphragms, 7 pressing rings, 8PCB boards, 9 glass sintering bases, 10 silicon piezoresistive chips, 11 leads, 12 pressure guiding holes, 13 pressure guiding pipes and 14 pins.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

As shown in fig. 1, a chip mounting cavity is formed at the lower end of a glass sintering base 9, a silicon piezoresistive chip 10 is bonded in the middle of the chip mounting cavity, a pressure guide hole 12 is formed in the center of the glass sintering base 9 at the back of the silicon piezoresistive chip 10, the end of the pressure guide hole 12 is connected with a pressure guide pipe 13, the pressure guide pipe 13 is fixed on the glass sintering base 9 through a fixing seat, the pressure guide hole 12 is communicated with the pressure guide pipe 13, and the back of the silicon piezoresistive chip 10 is communicated with the atmosphere through the pressure guide hole and the pressure guide pipe 13. An inner pin 14 is arranged in a chip mounting cavity of the glass sintering base 9, an outer pin is arranged outside the glass sintering base 9, a lead 11 is connected between the inner pin 14 and the silicon piezoresistive chip 10, the lead 11 is set to be a gold wire or an aluminum wire, and the inner pin 14 is connected with the outer pin and used for transmitting pressure signals. The glass sintering base 9 is also fixed with a PCB 8, and an external pin is connected with the PCB 8. The PCB 8 is provided with the chip resistor 2 which compensates the sensor and converts the sensor into pressure data, and the pressure data is transmitted to a display interface of the sensor through a lead.

Wherein, the PCB installation cavity has been seted up to the upper end of glass sintering base 9, and PCB board 8 is installed in the PCB installation cavity, protects PCB board 8's safety, prevents that PCB board 8 from damaging.

An oil filling hole 4 is further formed in the glass sintering base 9, silicone oil is filled into the chip mounting cavity through the oil filling hole 4, it is guaranteed that the chip mounting cavity is filled with the silicone oil, after the silicone oil is filled, the steel ball 3 is welded to an oil inlet of the oil filling hole 4, the oil filling hole 4 is sealed, and oil is prevented from being leached.

The chip mounting cavity is filled with ceramic filling block 5, and ceramic filling block 5 is last to be seted up chip hole and index round hole, and it is downthehole that silicon piezoresistive chip 10 and inside pin 14 all locate the chip, and the inboard of diaphragm 6 communicates with each other through index round hole and oil charge hole 4, guarantees to be full of silicon oil between the inboard of diaphragm 6 and silicon piezoresistive chip 10, guarantees the sensitivity of sensor.

The glass sintering base 9 outside the diaphragm 6 is welded with the pressure ring 7, so that the fixing strength of the diaphragm 6 is enhanced, the diaphragm 6 is prevented from falling off, and the sensor is prevented from being damaged.

Claims

1. The ultra-thin isolating membrane low-pressure steel seal pressure sensor comprises a glass sintering base (9) and a diaphragm (6), wherein a chip mounting cavity is arranged in the glass sintering base (9), and a silicon piezoresistive chip (10) is arranged in the chip mounting cavity, and the ultra-thin isolating membrane low-pressure steel seal pressure sensor is characterized in that the diaphragm (6) is arranged at the sealing position of the chip mounting cavity, the chip mounting cavity is sealed by the diaphragm (6), and silicone oil is filled in the chip mounting cavity;

an inner pin (14), an outer pin and a PCB (8) are arranged on the glass sintering base (9), the silicon piezoresistive chip (10) is connected with the inner pin (14), the inner pin is connected with the outer pin, the outer pin is connected with the PCB (8), and a lead (1) is connected on the PCB (8);

the thickness of the membrane (6) is 0.015mm.

2. The ultra-thin isolating membrane low-pressure steel seal pressure sensor as claimed in claim 1, wherein an oil filling hole (4) is formed in the glass sintering base (9), the oil filling hole (4) is communicated with the chip mounting cavity, and a steel ball (3) is arranged at an oil inlet of the oil filling hole (4).

3. The ultra-thin isolating membrane low-pressure steel seal pressure sensor according to claim 2, wherein a pressure guide hole (12) is formed in the glass sintering base (9), one end of the pressure guide hole (12) is arranged on the back surface of the silicon piezoresistive chip (10), the other end of the pressure guide hole is connected with a pressure guide pipe (13), and the pressure guide pipe (13) is communicated with the atmosphere.

4. The ultra-thin isolating membrane low-voltage steel seal pressure sensor as claimed in claim 3, wherein a ceramic filling block (5) is arranged in the chip mounting cavity, a chip hole and an indexing circular hole are formed in the ceramic filling block (5), the silicon piezoresistive chip (10) is arranged in the chip hole, and the oil filling hole is communicated with the chip mounting cavity through the indexing circular hole.

5. The ultra-thin isolating membrane low-voltage steel seal pressure sensor as claimed in claim 1, wherein a chip resistor (2) is arranged on the PCB (8).

6. The ultra-thin isolating diaphragm low-pressure steel-sealed pressure sensor as claimed in claim 1, further comprising a pressure ring (7), wherein the pressure ring (7) is disposed outside the diaphragm (6).