CN204831647U - Ceramic condenser formula pressure sensor - Google Patents
Ceramic condenser formula pressure sensor Download PDFInfo
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- CN204831647U CN204831647U CN201520562613.4U CN201520562613U CN204831647U CN 204831647 U CN204831647 U CN 204831647U CN 201520562613 U CN201520562613 U CN 201520562613U CN 204831647 U CN204831647 U CN 204831647U
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Abstract
The utility model provides a ceramic condenser formula pressure sensor and manufacturing method. And belongs to the technical field of pressure sensors. It solves the low problem of adhesion strength between the big and ceramic substrate of current ceramic condenser formula pressure sensor initial capacity deviation. Its leading features is: set up annular glass and give birth to the diaphragm between thin base plate of pottery and the thick base plate of pottery, come the distance between thin base plate of accurate control pottery and the thick base plate of pottery through controlling its thickness to the first initial value of capacity of accurate control ceramic condenser, still lie in simultaneously the glass powder through using 500-700 DEG C of sintering. The utility model has the characteristics of guarantee good leakproofness and adhesion strength between the base plate, improve the pressure sensor reliability, mainly used ceramic condenser formula pressure sensor.
Description
Technical field
The utility model belongs to pressure sensor technique field, is specifically related to a kind of ceramic capacitive pressure sensor.
Background technology
Current ceramic capacitive pressure sensor is all arrange electrode at each opposite face of thickness two panels ceramic substrate, and adopt ceramic bead, resin beads, low temperature co-fired (LTCC) ceramic green sheet etc. as the distance between sept control electrode, form the plate condenser of regulation initial capacitance value.When ceramic substrate is subject to external pressure, thin substrate there will be along plate thickness direction flexural deformation, causes capacitance variation, according to the changing value of this electric capacity, can detect the external pressure that substrate bears.
Above-mentioned employing ceramic bead, resin beads control the method for dull and stereotyped spacing, see No. 5-288623, Unexamined Patent or 10-111206.This method due to the distance between its strong point uneven, easily cause initial capacity value deviation large.
Above-mentioned employing low temperature co-fired (LTCC) ceramics green ceramic chip, see Chinese patent 201210398251.0, ceramics green ceramic chip is made by the tape casting, ceramic chips thickness can accurately control, improve initial capacitance and be worth precision, but because ceramic chips is with ceramic main, and the fusing point of pottery is all more than 1000 DEG C, be difficult to when low temperature (800-900 DEG C) burns altogether together with ceramic substrate well welding, cause the cohesive strength of two panels ceramic substrate and sealing inadequate, thus the reliability of pressure transducer is reduced.
Summary of the invention
The utility model, for overcoming above-mentioned defect, guarantees the initial capacitance value precision of ceramic condenser, improves the cohesive strength between ceramic substrate and sealing, thus improves the reliability of product, provides a kind of ceramic capacitive pressure sensor.
Technical solution of the present utility model is: a kind of ceramic capacitive pressure sensor, comprise ceramic thin substrate, pottery thick substrate, ceramic thin substrate is provided with thin substrate metal electrode and thin electrode of substrate pad, pottery thick substrate is provided with thick substrate metal electrode, circular metal electrode, circular metal electrode pad, thick substrate electrode pad, thin substrate lead pad, thick substrate electrode pad, circular metal electrode pad and thin substrate lead pad are equipped with lead-in wire via hole, it is characterized in that: also comprise the raw diaphragm of ring glass be arranged between ceramic thin substrate and ceramic thick substrate, described ceramic thin substrate edges is provided with thin substrate orientation breach, and ceramic thick substrate edge is provided with thick substrate locating notch, and the raw diaphragm edge of ring glass is provided with and thin substrate orientation breach, raw diaphragm locating notch that thick substrate locating notch is corresponding, the raw diaphragm of ring glass is provided with 3 lead-in wires corresponding with the via hole that goes between and pad via hole.
Ceramic thin substrate described in the technical solution of the utility model ceramic capacitive pressure sensor is circular, and thickness is 0.3 ~ 0.8mm, and the thickness of thin substrate metal electrode and thin substrate lead pad is 0.5 ~ 1 μm; Pottery thick substrate is circular, and thickness is 3 ~ 8mm, and the thickness of thick substrate metal electrode and circular metal electrode is 0.5 ~ 1 μm; The raw diaphragm of ring glass is annular, and thickness is 20 ~ 60 μm.
Lead-in wire and conducting resinl is provided with in lead-in wire via hole described in the technical solution of the utility model ceramic capacitive pressure sensor and lead-in wire and pad via hole.
The utility model is because employing thickness is at the raw diaphragm of ring glass of 20 μm ~ 60 μm, high-precision initial capacitance value can be obtained, in sintering process, the glass dust of low fever's temperature can be welded together well with ceramic thin substrate and ceramic thick substrate, ensure that sealing good between substrate and cohesive strength, improve the reliability of pressure transducer.The utility model is mainly used in ceramic capacitive pressure sensor.
Accompanying drawing explanation
Fig. 1 is pressure transducer ceramic thin substrate figure.
Fig. 2 is pressure transducer pottery thick substrate figure.
Fig. 3 is the raw diaphragm figure of glass.
Fig. 4 is pressure transducer sectional view.
1-ceramic thin substrate, 2-thin electrode of substrate pad, 3-thin substrate metal electrode, 4-thin substrate orientation breach, 5-thick substrate locating notch, 6-pottery thick substrate, 7-thick substrate metal electrode, 8-circular metal electrode, 9-thick substrate electrode pad, 10-lead-in wire via hole, 11-circular metal electrode pad, the thin substrate lead pad of 12-, the raw diaphragm locating notch of 13-, the raw diaphragm of 14-ring glass, 15-lead-in wire and pad via hole in figure.
Embodiment
As shown in Figure 1, ceramic thin substrate 1 is circular, and thickness is 0.3 ~ 0.8mm.This ceramic thin substrate 1 makes thin substrate metal electrode 3 and thin substrate lead pad 2 by serigraphy or vacuum sputtering mode, and its thickness is 0.5 ~ 1 μm.Ceramic thin substrate 1 edge is provided with thin substrate orientation breach 4.Thin substrate metal electrode 3 is concentric with round ceramic thin substrate 1.When pressure transducer is subject to external pressure, this ceramic thin substrate 1 can produce elastic bending along the thickness direction of plate.
As shown in Figure 2, ceramic thick substrate 6 is circular, and thickness is 3 ~ 8mm.On this ceramic thick substrate 6, same serigraphy or vacuum sputtering mode make thickness is the thick substrate metal electrode 7 of 0.5 ~ 1 μm and the circular metal electrode 8 around thick substrate metal electrode 7, thick substrate metal electrode 7 and circular metal electrode 8 are with one heart and concentric with ceramic thick substrate 6, thick substrate metal electrode 7 connects thick substrate electrode pad 9, and circular metal electrode 8 connects circular metal electrode pad 11.Thin substrate lead pad 12 is corresponding with thin electrode of substrate pad 2 position on ceramic thin substrate 1.Thick substrate electrode pad 9, circular metal electrode pad 11 and thin substrate lead pad 12 are equipped with lead-in wire via hole 10, are used for inserting lead-in wire and connect outside line.Pottery thick substrate 6 edge is provided with thick substrate locating notch 5.
As shown in Figure 3, the raw diaphragm 14 of ring glass is annular, and thickness is 20 ~ 60 μm, is specifically determined by the specification of pressure transducer.Raw diaphragm 14 edge of ring glass is provided with raw diaphragm locating notch 13.The raw diaphragm 14 of ring glass is provided with 3 lead-in wires and pad via hole 15, and the via hole 10 that goes between with 3 is respectively corresponding.The raw diaphragm 14 of ring glass and ceramic thick substrate 6, ceramic thin substrate 1 are concentric.Be placed on after between ceramic thick substrate 6, ceramic thin substrate 1 to give birth to diaphragm locating notch 13 contraposition, the raw diaphragm 14 of ring glass is looped around around circular metal electrode 8.
The sectional view of pressure transducer as shown in Figure 4.Raw for ring glass diaphragm 14 is clipped between ceramic thin substrate 1 and ceramic thick substrate 6, stack after accurately locating with thin substrate orientation breach 4, thick substrate locating notch 5 and raw diaphragm locating notch 13, wherein the electrode of ceramic thin substrate 1 and ceramic thick substrate 6 is staggered relatively, then carries out binder removal and sintering.
The raw diaphragm 14 of ring glass is by the glass dust of 1 part 500 ~ 700 DEG C sintering, 0.5 part of bonding agent, 0.25 part of absolute ethyl alcohol, 0.25 part of toluene, 0.1 part of olein, 0.1 part of dimethyl silicon oil, adopts the method for flow casting molding to make.
Within the dwell time of the pressure of 2.5 ~ 10MPa, the temperature of 60 ~ 80 DEG C and 10 ~ 20min, thin for round ceramic substrate 1, the raw diaphragm 14 of ring glass and ceramic thick substrate 6 are formed entirety by hot pressing pressing.Carry out binder removal process to above-mentioned entirety, temperature is 300 ~ 450 DEG C, and the time is 2 ~ 4 hours.In sintering furnace, carry out pressure sintering, pressure is 0.3 ~ 0.6Mpa, and sintering temperature is 500 ~ 700 DEG C, temperature retention time 1 ~ 2 hour.The pressure transducer sintered, pours into conducting resinl, inserts lead-in wire, form electrical connection, can connect external detection instrument after solidification in 3 lead-in wire via holes 10.
Detect the initial capacity value of ceramic capacitive pressure sensor, its precision can reach ± 5%, only the accomplishing of alternate manner manufacture ± 10%; Detect cohesive strength, the power cutting sheet and thin slice open is 70-80N, and that alternate manner making is 50-60N, on average exceeds 36.3%; Detect sealing, with moisture test case test 1000hr, all qualified.
Claims (3)
1. a ceramic capacitive pressure sensor, comprise ceramic thin substrate (1), pottery thick substrate (6), ceramic thin substrate (1) is provided with thin substrate metal electrode (3) and thin electrode of substrate pad (2), pottery thick substrate (6) is provided with thick substrate metal electrode (7), circular metal electrode (8), circular metal electrode pad (11), thick substrate electrode pad (9), thin substrate lead pad (12), thick substrate electrode pad (9), circular metal electrode pad (11) and thin substrate lead pad (12) are equipped with lead-in wire via hole (10), it is characterized in that: also comprise the raw diaphragm (14) of ring glass be arranged between ceramic thin substrate (1) and ceramic thick substrate (6), described ceramic thin substrate (1) edge is provided with thin substrate orientation breach (4), pottery thick substrate (6) edge is provided with thick substrate locating notch (5), and raw diaphragm (14) edge of ring glass is provided with and thin substrate orientation breach (4), raw diaphragm locating notch (13) that thick substrate locating notch (5) is corresponding, the raw diaphragm of ring glass (14) is provided with 3 lead-in wires corresponding with the via hole (10) that goes between and pad via hole (15).
2. ceramic capacitive pressure sensor according to claim 1, is characterized in that: described ceramic thin substrate (1) is for circular, and thickness is 0.3 ~ 0.8mm, and the thickness of thin substrate metal electrode (3) and thin electrode of substrate pad (2) is 0.5 ~ 1 μm; Pottery thick substrate (6) is circular, and thickness is 3 ~ 8mm, and the thickness of thick substrate metal electrode (7) and circular metal electrode (8) is 0.5 ~ 1 μm; The raw diaphragm (14) of ring glass is annular, and thickness is 20 ~ 60 μm.
3. ceramic capacitive pressure sensor according to claim 1 and 2, is characterized in that: described lead-in wire via hole (10) and lead-in wire and pad via hole (15) in be provided with go between and conducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201520562613.4U CN204831647U (en) | 2015-07-30 | 2015-07-30 | Ceramic condenser formula pressure sensor |
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| CN201520562613.4U CN204831647U (en) | 2015-07-30 | 2015-07-30 | Ceramic condenser formula pressure sensor |
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| CN204831647U true CN204831647U (en) | 2015-12-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105067179A (en) * | 2015-07-30 | 2015-11-18 | 湖北美标中芯电子科技有限公司 | Ceramic capacitive pressure sensor and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105067179A (en) * | 2015-07-30 | 2015-11-18 | 湖北美标中芯电子科技有限公司 | Ceramic capacitive pressure sensor and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170119 Address after: 441004, No. A58, No. A58, Jia Hai Industrial Park, hi tech Zone, Hubei, Xiangyang, China Patentee after: Xiangyang core sensor technology Co., Ltd. Address before: 441000 Xiangfan Road, Shenzhen high tech Zone, Nanjing Road, No. 18, No. Patentee before: HUBEI MEIBIAO ZHONGXIN ELECTRONICS TECHNOLOGY CO., LTD. |