CN209979118U - High overvoltage protection type coplanar differential pressure sensor - Google Patents

High overvoltage protection type coplanar differential pressure sensor Download PDF

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Publication number
CN209979118U
CN209979118U CN201921133848.6U CN201921133848U CN209979118U CN 209979118 U CN209979118 U CN 209979118U CN 201921133848 U CN201921133848 U CN 201921133848U CN 209979118 U CN209979118 U CN 209979118U
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China
Prior art keywords
sensor
pressure
sensor body
silicon cup
differential pressure
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Expired - Fee Related
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CN201921133848.6U
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Chinese (zh)
Inventor
陈立新
牟恒
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Jiangsu Dexinke Intelligent Sensor Research Institute Co Ltd
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Jiangsu Dexinke Intelligent Sensor Research Institute Co Ltd
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Abstract

A high overvoltage protection type coplanar differential pressure sensor relates to the technical field of differential pressure sensors and differential pressure transmitter devices applied in industrial grade. The utility model discloses the upper portion of sensor body sets up the connecting piece, lies in and sets up the silicon cup between sensor body and connecting piece, leaves annular space between the outside of silicon cup and the sensor body; the sensor comprises a sensor body, a silicon cup, a binding plate, a welding table, a through hole, a V-shaped annular groove and a rectangular annular groove, wherein the lower end face of the sensor body is provided with two grooves, the binding plate is fixed in the mounting groove, a sensor chip is fixed on the binding plate, the port of the mounting groove is provided with the welding table, the welding table is provided with the through hole, the through hole is aligned with an H-end pressure guide hole, an annular gap is reserved between the outer side of the welding table and the sensor body, the outer side of the welding table is provided with the V-shaped annular groove. The utility model discloses an assembly is simple, and general degree is high, the high advantage of overloading the protection of single-ended.

Description

High overvoltage protection type coplanar differential pressure sensor
Technical Field
The utility model relates to a technical field of differential pressure sensor and differential pressure transmitter device of industrial grade application. In particular to a coplanar differential pressure sensor with larger one-way overpressure protection.
Background
The differential pressure sensor is used for measuring the pressure of fluid such as liquid, gas or steam, converting the measured pressure physical quantity into an electric signal for output, and converting the electric signal into a 4-20 mA standard current signal for output after circuit amplification, compensation and conditioning.
The chip in the current differential pressure sensor adopts a monocrystalline silicon sensor chip, and the monocrystalline silicon sensor chip has the problem of poor overload resistance due to the fragility of silicon materials. Aiming at the problem, a plurality of differential pressure sensors are designed with structural forms with central protection diaphragms for protecting monocrystalline silicon sensor chips, but the structures have the problems of complex structure and high requirement on size control of a machined part, and the overload protection function of the differential pressure sensor for the unidirectional pressure cannot be effectively realized.
Disclosure of Invention
The utility model aims at providing an assembly is simple, and general degree is high, and single-ended height overload protection's high overvoltage protection type coplanar differential pressure sensor.
The high overvoltage protection type coplanar differential pressure sensor comprises a sensor body, a silicon cup and a connecting piece, wherein the connecting piece is arranged at the upper part of the sensor body, the silicon cup is arranged between the sensor body and the connecting piece, and an annular gap is reserved between the outer side of the silicon cup and the sensor body; the lower terminal surface of sensor body sets up two recesses, is provided with central diaphragm in the recess, central diaphragm includes H end center protection diaphragm and L end center protection diaphragm, welds respectively in the recess, forms two accommodation space with the sensor body to hold and lead the pressure medium. Be provided with the isolation diaphragm in the recess, including H end isolation diaphragm and L end isolation diaphragm, two central diaphragms of one-to-one respectively form two accommodation space through welding the ring welding to hold and lead the pressure medium. The lower end of the silicon cup is provided with a mounting groove, a binding plate is fixed in the mounting groove, a sensor chip is fixed on the binding plate, and the positive pressure end and the negative pressure end of the sensor chip face downwards and upwards; the port department of mounting groove sets up the welding bench, sets up the through-hole on the welding bench, and the through-hole leads the pressure port with the H end and aligns, leaves annular space between the outside of welding bench and sensor body, and V type annular and rectangle annular have been seted up along radial direction in the welding bench outside, and V type annular and rectangle annular intercommunication annular space.
Preferably, the sensor body of the present invention further comprises: the H-end pressure guide hole is communicated with the H-end isolation diaphragm, the positive pressure end and the containing space to form a positive pressure cavity, and the L-end pressure guide hole is communicated with the L-end isolation diaphragm, the negative pressure end and the containing space to form a negative pressure cavity.
What is better, the utility model discloses a be provided with electrical interface on the silicon cup, electrical interface directly runs through the silicon cup, realizes binding plate and silicon cup's fixed, and sensor chip realizes electric connection through binding wire mode and binding plate, and electrical interface can provide the power and receive the outside signal of telecommunication of transmitting of sensor chip for sensor chip.
Preferably, the silicon cup of the utility model is provided with two oil-filled pipelines, a positive-pressure oil-filled conduit and a negative-pressure oil-filled conduit, which are respectively filled with pressure-guiding medium; still include two passageways: one end of the positive pressure channel penetrates through the binding plate to be communicated with the positive pressure end of the sensor chip, and the other end of the positive pressure channel is connected with the positive pressure oil filling guide pipe; and one end of the negative pressure channel is communicated with the negative pressure end of the sensor chip, and the other end of the negative pressure channel is connected with the negative pressure oil-filled conduit.
Preferably, the utility model discloses a still be equipped with the cross bore oil duct in the silicon cup, the one end intercommunication negative pressure passageway of this cross bore oil duct, other end intercommunication annular space, V type annular and rectangle annular.
Preferably, the utility model discloses a silicon cup upper end is provided with the ESD guard plate, and this guard plate adopts antistatic material for prevent electrostatic interference.
The utility model discloses sample above-mentioned technical scheme, compare with prior art and have following advantage:
1. the utility model is provided with a silicon cup between the sensor body and the connecting piece, and an annular gap is left between the outer side of the silicon cup and the sensor body; the lower terminal surface of sensor body sets up two recesses, is provided with central diaphragm in the recess and includes H end center protection diaphragm and L end center protection diaphragm, welds respectively in the recess, forms two accommodation space with the sensor body to hold and lead the pressure medium. Be provided with the isolation diaphragm in the recess, including H end isolation diaphragm and L end isolation diaphragm, two central diaphragms of one-to-one respectively form two accommodation space through welding the ring welding to hold and lead the pressure medium. The mounting groove has been seted up to the silicon cup lower extreme, the mounting groove internal fixation has the board of binding, be fixed with the sensor chip on the board of binding, sensor chip malleation end is down, the negative pressure end up, the port department of mounting groove sets up the welding bench, set up the through-hole on the welding bench, the through-hole leads the pressure port with the H end and aligns, leave annular space between the outside of welding bench and sensor body, V type annular and rectangle annular have been seted up along radial direction in the welding bench outside, V type annular and rectangle annular intercommunication annular space. The unidirectional overvoltage protection capability is improved, and the static pressure characteristic of the sensor is improved.
2. The utility model discloses the lower terminal surface of sensor body sets up two recesses, is provided with central diaphragm in the recess and includes H end center protection diaphragm and L end center protection diaphragm, welds respectively in the recess, forms two accommodation space with the sensor body to hold and lead the pressure medium. Be provided with the isolation diaphragm in the recess, including H end isolation diaphragm and L end isolation diaphragm, two central diaphragms of one-to-one respectively form two accommodation space through welding the ring welding to hold and lead the pressure medium. The production process of the traditional central membrane protection is simplified.
3. The utility model discloses the lower terminal surface of sensor body sets up two recesses, welds H end center protection diaphragm and L end center protection diaphragm in the recess respectively, keeps apart diaphragm and L end isolation diaphragm, two center diaphragms of difference one-to-one through welding ring welding H end in the recess. The inventive proposal combines the four-membrane protection technology with the coplanar technology.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a sectional view taken along line a-a in fig. 1.
Fig. 3 is a sectional view taken along line B-B in fig. 1.
Fig. 4 is an enlarged view at C in fig. 2.
Fig. 5 is a schematic structural view of the silicon cup in fig. 2.
Detailed Description
The technical scheme of the utility model is explained in detail with the attached drawings as follows:
as shown in fig. 1, 2, 3, 4 and 5, the high over-voltage protection type coplanar differential pressure sensor is characterized by comprising a sensor body 10, a silicon cup 20 and a connecting piece 30, wherein the connecting piece 30 is arranged at the upper part of the sensor body 10, the silicon cup 20 is arranged between the sensor body 10 and the connecting piece 30, and an annular gap 212 is reserved between the outer side of the silicon cup and the sensor body. The lower terminal surface of sensor body 10 sets up two recesses, is provided with central diaphragm in the recess, central diaphragm includes H end center protection diaphragm 104 and L end center protection diaphragm 103, welds respectively in the recess, forms two accommodation space with this 10 bodily forms of sensor to hold and lead the pressure medium. The silicon cup is characterized in that isolation diaphragms are arranged in the grooves and comprise an H-end isolation diaphragm 105 and an L-end isolation diaphragm 102 which are respectively in one-to-one correspondence with two central diaphragms, two containing spaces are formed by welding rings 101 to contain pressure guide media, a mounting groove 206 is formed in the lower end of the silicon cup 20, a binding plate 207 is fixed in the mounting groove 206, a sensor chip 205 is fixed on the binding plate 207, the positive pressure end of the sensor chip 205 faces downwards, the negative pressure end of the sensor chip faces upwards, a welding table 213 is arranged at the port of the mounting groove 206, an annular gap 212 is reserved between the outer side of the welding table 213 and the sensor body 10, a V-shaped annular groove 211 and a rectangular annular groove 214 are formed in the outer side of the welding table 213.
The utility model discloses a sensor body still includes: the H-end pressure guide hole is communicated with the H-end isolation diaphragm, the positive pressure end and the containing space to form a positive pressure cavity, and the L-end pressure guide hole is communicated with the L-end isolation diaphragm, the negative pressure end and the containing space to form a negative pressure cavity.
As shown in fig. 5, the utility model discloses a be provided with electrical property interface 202 on the silicon cup, electrical property interface 202 directly runs through silicon cup 20, realizes binding plate 207 and silicon cup 20's fixed, and sensor chip 205 realizes electric connection through binding wire mode and binding plate 207, and electrical property interface can provide the power and receive the outside signal of telecommunication of transmitting of sensor chip for sensor chip.
As shown in fig. 5, the silicon cup of the present invention has two oil-filled pipelines, a positive pressure oil-filled conduit 209 and a negative pressure oil-filled conduit 201, which are filled with pressure-guiding medium respectively; still include two passageways: a positive pressure channel 208, one end of which passes through the binding plate and is communicated with the positive pressure end of the sensor chip, and the other end of which is connected with a positive pressure oil filling conduit; and one end of the negative pressure channel 204 is communicated with the negative pressure end of the sensor chip, and the other end of the negative pressure channel is connected with a negative pressure oil-filled conduit. And a cross-hole oil passage is further arranged in the silicon cup, one end of the cross-hole oil passage is communicated with the negative pressure channel, and the other end of the cross-hole oil passage is communicated with the annular gap 212, the V-shaped annular groove 211 and the rectangular annular groove 214.
High overvoltage protection type coplanar differential pressure sensor, silicon cup upper end is provided with ESD protection plate 203, and this protection plate adopts antistatic material for prevent electrostatic interference.
The working principle of the utility model is as follows: when the high-overvoltage protection type coplanar differential pressure sensor works, the positive pressure channel is filled with pressure-guiding media through the positive-pressure oil-filled conduit, the negative pressure channel is filled with pressure-guiding media through the negative-pressure oil-filled conduit, the pressure-guiding media are uniformly distributed in the positive pressure channel and the negative pressure channel, and the two channels are completely isolated. The pressure-guiding medium can be silicone oil, fluorine oil, vegetable oil and other media, and is not limited by the utility model discloses, in this embodiment, the pressure-guiding medium is silicone oil.
When the H-end isolation diaphragm and the L-end isolation diaphragm are subjected to external pressure to squeeze the pressure-guiding medium in the accommodating space, the pressure-guiding medium transmits pressure to the positive pressure end and the negative pressure end of the sensor chip respectively through the positive pressure channel and the negative pressure channel, and the sensor chip slightly deforms under the action of the positive pressure and the negative pressure, so that the resistance value of a bridge resistor inside the sensor chip is changed, the outward output current of the sensor chip is changed, and the change is transmitted to a corresponding instrument through the binding plate, and the differential pressure value of the measuring system is measured.
When the H end of the sensor is subjected to larger one-way overload pressure, the H end isolation diaphragm is tightly attached to the H end center protection diaphragm due to the pressure, the H end center protection diaphragm deforms towards the direction of the sensor body due to the pressure, and the pressure is transmitted to the L end of the sensor body through the pressure guide medium, so that the larger one-way overload pressure can only act on the sensor body and can not be transmitted to act on the sensor chip, the differential pressure sensor has a reliable one-way pressure overload protection function, and the performance of the sensor is improved. The central protective membrane has the characteristic of not deforming under the rated pressure and deforming beyond the rated pressure. The utility model discloses the creative differential pressure sensor who provides four diaphragm protection technologies and coplanar technique and combine together.

Claims (6)

1. The high overvoltage protection type coplanar differential pressure sensor is characterized by comprising a sensor body (10), a silicon cup (20) and a connecting piece (30), wherein the connecting piece (30) is arranged at the upper part of the sensor body (10), the silicon cup (20) is arranged between the sensor body (10) and the connecting piece (30), and an annular gap is reserved between the outer side of the silicon cup and the sensor body; the lower end face of the sensor body (10) is provided with two grooves, and central diaphragms including an H-end central protection diaphragm (104) and an L-end central protection diaphragm (103) are arranged in the grooves and are respectively welded in the grooves; isolation diaphragms are arranged in the grooves and comprise H-end isolation diaphragms (105) and L-end isolation diaphragms (102), the H-end isolation diaphragms and the L-end isolation diaphragms correspond to the two central diaphragms one by one respectively, and two containing spaces for containing pressure guide media are formed by welding rings (101); the lower end of the silicon cup (20) is provided with a mounting groove (206), a binding plate (207) is fixed in the mounting groove (206), a sensor chip (205) is fixed on the binding plate (207), and the positive pressure end and the negative pressure end of the sensor chip (205) face downwards; the port department of mounting groove (206) sets up welding bench (213), leaves annular space (212) between the outside of welding bench (213) and sensor body (10), and V-arrangement annular groove (211) and rectangle annular groove (214) have been seted up along radial direction in the welding bench outside, and V-arrangement annular groove (211) and rectangle annular groove (214) communicate annular space (212).
2. The high overvoltage protection type coplanar differential pressure sensor as set forth in claim 1 wherein said sensor body further includes: and an H-end pressure guide hole (106) for communicating the H-end isolation diaphragm with the positive pressure end and the containing space to form a positive pressure cavity, and an L-end pressure guide hole (107) for communicating the L-end isolation diaphragm with the negative pressure end and the containing space to form a negative pressure cavity.
3. The high over-voltage protection type coplanar differential pressure sensor according to claim 1, wherein the silicon cup is provided with an electrical interface, the electrical interface directly penetrates through the silicon cup (20) to fix the binding plate (207) and the silicon cup (20), the sensor chip (205) is electrically connected with the binding plate (207) by a binding wire, and the electrical interface can provide power for the sensor chip and receive an electrical signal transmitted from the sensor chip.
4. The high overvoltage protection type coplanar differential pressure sensor according to claim 1, wherein the silicon cup has two oil-filled conduits, a positive pressure oil-filled conduit (209) and a negative pressure oil-filled conduit (201), which are filled with pressure-guiding medium; still include two passageways: one end of the positive pressure channel (208) penetrates through the binding plate to be communicated with the positive pressure end of the sensor chip, and the other end of the positive pressure channel is connected with the positive pressure oil filling conduit; and one end of the negative pressure channel (204) is communicated with the negative pressure end of the sensor chip, and the other end of the negative pressure channel is connected with the negative pressure oil-filled conduit.
5. The high overpressure protection type coplanar differential pressure sensor as claimed in claim 1, wherein the silicon cup is further provided with a cross-hole oil passage, one end of the cross-hole oil passage is communicated with the negative pressure channel, and the other end of the cross-hole oil passage is communicated with the annular gap (212), the V-shaped ring groove (211) and the rectangular ring groove (214).
6. The high over-voltage protection type coplanar differential pressure sensor according to claim 1, wherein an ESD protection plate (203) made of an antistatic material for preventing electrostatic interference is disposed at the upper end of the silicon cup.
CN201921133848.6U 2019-07-19 2019-07-19 High overvoltage protection type coplanar differential pressure sensor Expired - Fee Related CN209979118U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921133848.6U CN209979118U (en) 2019-07-19 2019-07-19 High overvoltage protection type coplanar differential pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921133848.6U CN209979118U (en) 2019-07-19 2019-07-19 High overvoltage protection type coplanar differential pressure sensor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112345158A (en) * 2021-01-07 2021-02-09 南京精准传感科技有限公司 Differential pressure sensing method of high-static-pressure monocrystalline silicon differential pressure sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112345158A (en) * 2021-01-07 2021-02-09 南京精准传感科技有限公司 Differential pressure sensing method of high-static-pressure monocrystalline silicon differential pressure sensor

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Granted publication date: 20200121