CN106323539A - Sensor base - Google Patents
Sensor base Download PDFInfo
- Publication number
- CN106323539A CN106323539A CN201610848756.0A CN201610848756A CN106323539A CN 106323539 A CN106323539 A CN 106323539A CN 201610848756 A CN201610848756 A CN 201610848756A CN 106323539 A CN106323539 A CN 106323539A
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- Prior art keywords
- path
- base body
- connecting tube
- sensor
- diameter
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
Abstract
The present invention discloses a sensor base. The sensor base comprises a base main body, a lateral passage, a first connecting pipe and a second connecting pipe; one end portion of the first connecting pipe is inserted into the base main body, and the other end portion of the first connecting pipe protrudes out from one end surface of the base main body; the other end surface of the base main body is communicated with one end portion of the first connection pipe through a first passage; one end portion of the second connecting pipe is inserted into the base main body, and the other end portion of the second connecting pipe protrudes out from one end surface of the base main body; and the other end surface of the base main body is communicated with one end portion of the second connecting pipe through a second passage. With the sensor base provided by the invention adopted, a plurality of sensors can be encapsulated, and the plurality of sensors can independently form a composite parameter sensor without the matching of other film box parts required; the base main body can communicate with the atmosphere through a plurality of passages; oil-filled cavities are arranged between the sensors and the sensor base; and a circuit board is arranged at the rear sides of the sensors.
Description
Technical field
The invention belongs to sensor technical field, be specifically related to a kind of multi-chip porous sensor base.
Background technology
There is following defect in currently used pressure/differential pressure sensor encapsulation base: 1,2 or less than 2 oil filler pipes
(hole), can only encapsulate in one or two sensor, and two sensors can only be the mode of a logical air (gauge pressure), to essence
Degree requires high occasion, actually used limited；2, the differential pressure pick-up of band bellows it is only used for, it is impossible to adopt conventional pressure encapsulation
Technique: fast electric welding resistance sealing technology, can not do alone pressure transducer pedestal.
Summary of the invention
For the deficiencies in the prior art, it is an object of the invention to propose a kind of sensor base, to improve its applicable model
Enclose.
For achieving the above object, the sensor base that the present invention provides includes Base body, lateral approach, the first connecting tube
With the second connecting tube, the one end of described first connecting tube inserts in Base body, and the other end is exposed to the one of Base body
The one end of end face, the other end of described Base body and the first connecting tube is by the first communication；Described second connects
The one end of pipe inserts in Base body, and the other end is exposed to the end face of Base body, the other end of described Base body
Face is connected by alternate path with the one end of the second connecting tube；
Third path and fourth passage, the one end of described third path and fourth passage is offered in described Base body
One end be connected, the other end of described third path and the other end of fourth passage extend through to Base body
Two end faces；
The end face of described Base body is respectively arranged with the first encapsulated holes, the second encapsulated holes and the 3rd encapsulated holes, and described
One encapsulated holes, the second encapsulated holes connect with the first path, alternate path and third path respectively with the 3rd encapsulated holes；
Described lateral approach is positioned at Base body, and with described first path vertical connection.
In some embodiments of the invention, two end faces of described Base body have also extended through multiple pressure insulation to draw
Foot.
In some embodiments of the invention, described Base body be provided with the first encapsulated holes, the second encapsulated holes and
The end face of three encapsulated holes caves inward.
In some embodiments of the invention, it is provided with insulation sintering between described Base body and pressure insulation pin to fill out
Material.
In some embodiments of the invention, being provided with deflector chute in described Base body, described deflector chute is used for fixing
First connecting tube and the second connecting tube.
In some embodiments of the invention, the diameter of described fourth passage is more than the diameter of third path, so that the
Three-way 11 and fourth passage 12 form T-shaped path.
In some embodiments of the invention, the diameter of described first path is more than the internal diameter of the first connecting tube and described
The external diameter of the first connecting tube is more than the diameter of the first path.
In some embodiments of the invention, the diameter of described alternate path is more than the internal diameter of the second connecting tube, and second
The external diameter of connecting tube is more than the diameter of alternate path.
The present invention efficiently solves the problems of the prior art, can encapsulate gauge pressure, differential pressure, any 2 kinds in absolute pressure simultaneously
Chip, adds various temperature sensor, can be as conventional diffusion silicon gauge pressure pedestal, it is possible to as compound multi-parameter sensor base
Seat.Measure temperature at needs simultaneously, atmospheric pressure, the occasion of differential pressure or to measure the occasion of differential pressure and atmospheric pressure and temperature outstanding simultaneously
It is suitable for.
Therefore, the sensor base that the present invention provides, multiple sensors, multiple sensors can be encapsulated, can be individually formed multiple
Close parameter sensors, it is not necessary to other bellows parts coordinate, and Base body can be connected with air by multi-path, sensor and base
Being provided with oil-filled chamber between seat main body, sensors back side is provided with wiring board.The present invention can once, and multimode is oil-filled, and can use
Independent ventilative chamber, multi-path is breathed freely, it is ensured that measurement medium is not by secondary pollution, meanwhile, and natural permeable, can effectively prevent again knot
Dew, aqueous vapor seepage.The present invention charges and common offset can be used to follow closely (steel ball) pattern, improves packaging efficiency.Present invention envelope in a word
Flexibly, production efficiency is high, and applicable surface is the widest for dress.
Accompanying drawing explanation
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Accompanying drawing, the present invention is described in more detail, wherein:
Fig. 1 is the end face structure schematic diagram of the sensor base of the embodiment of the present invention；
Fig. 2 is the sectional view in Fig. 1 along A-A direction；
Fig. 3 is the sectional view in Fig. 1 along B-B direction；
Fig. 4 is the sectional view in Fig. 1 along C-C direction.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
As Figure 1-4, as one embodiment of the present of invention, described sensor base includes Base body 1, laterally leads to
Road the 8, first connecting tube 3 and the second connecting tube 4, the one end of described first connecting tube 3 inserts in Base body 1, the other end
It is exposed to the one end of the end face of Base body 1, the other end of described Base body 1 and the first connecting tube 3 by first
Path 9 connects；The one end of described second connecting tube 4 inserts in Base body 1, and the other end is exposed to the one of Base body 1
End face, the other end of described Base body 1 is connected by alternate path 10 with the one end of the second connecting tube 4；Described pedestal
Third path 11 and fourth passage 12, the one end of described third path 11 and one end of fourth passage 12 is offered in main body 1
Portion is connected, and the other end of described third path 11 and the other end of fourth passage 12 extend through to Base body 1
Two end faces；The end face of described Base body 1 is respectively arranged with the first encapsulated holes the 5, second encapsulated holes 6 and the 3rd encapsulated holes 6, institute
State first encapsulated holes the 5, second encapsulated holes 6 and the 3rd encapsulated holes 6 respectively with the first path 9, alternate path 10 and third path 11
Connection；Described lateral approach 8 is positioned at Base body 1, and with described first path 9 vertical connection.
Wherein, described second encapsulated holes 6 and the 3rd encapsulated holes 6 can independently realize pressure pass as gauge pressure encapsulated holes
Sensor encapsulates, and uses as pressure transducer, or 2 pressure transducers of encapsulation, it is achieved multiple application.Lateral approach 8 can be saturating
Gas, can Oil Guide.First path 9, alternate path 10, third path 11 and fourth passage 12 are led when can encapsulate multiple pressure transducer
Gas use, and carry out various ways and charge.
The end face being provided with first encapsulated holes the 5, second encapsulated holes 6 and the 3rd encapsulated holes 6 of described Base body 1 concaves
Fall into, multiple chip can be encapsulated alone and become many pressure transducers, gauge pressure (differential pressure or absolute pressure sensor) to be suitable for.Optional side is saturating
Gas reference measure or axially vertical ventilative reference measure；Can coordinate with differential capsule, encapsulate differential pressure pick-up simultaneously, gauge pressure passes
Sensor (absolute pressure sensor), temperature sensor, form multi-parameter sensor.
Preferably, the diameter of described fourth passage 12 is more than the diameter of third path 11, so that third path 11 and the
Four paths 12 form T-shaped path, advantage of this is that, can also soldering one in case there is a need while can following closely with offset
Individual pipe (is equivalent to make 3 pipes), plays location stop-pass effect.Similarly, the diameter of described first path 9 can also
More than the internal diameter of the first connecting tube 3, and the external diameter of described first connecting tube 3 is more than the diameter of the first path 9.Or can also
It is that the diameter of described alternate path 10 is more than the internal diameter of the second connecting tube 4, and the external diameter of the second connecting tube 4 is more than alternate path
The diameter of 10.
Further, in another embodiment of the present invention, two end faces of described Base body 1 have also extended through many
Individual pressure insulation pin 2, the inside of Base body 1 uses many pins insulation system, meets multi-chip package and uses, can encapsulate temperature
Degree sensor.Preferably, described pressure insulation pin 2 is the gold-plated pin that insulate, and can connect multiple temperature sensor and pressure passes
Sensor.Described pressure insulation pin 2 insulate with Base body 1, can be processed into during a thin pin of described pressure insulation pin 2
Mushroom head, has the coat of metal can be well for bonding pressure sensor lead, it is also possible to soldering temperature sensor, pressure absolutely
The other end of edge pin 2 has the measure (including but not limited to gold-plated) can be the most antirust, and easy soldering can connect outside lead or line
Road plate.
Further, between described Base body 1 and pressure insulation pin 2, it is provided with insulation sintering filler, so that base
Insulate between seat main body 1 and pressure insulation pin 2.
Being provided with deflector chute 7 in described Base body 1, described deflector chute 7 is used for fixing the first connecting tube 3 and second and connects
Pipe 4.Weld filler can be imported, (include but not limited to glass sintering, rustless steel solder sintering or soldering, silver through optional technique
Weldering, the technique such as laser filler weldering) it is fixed.
On the concave surface of described Base body 1,2 pressure transducers can be fixed in the first encapsulated holes 5 and the second encapsulated holes
The position of (or the 3rd encapsulated holes) 6, wherein the position of the second encapsulated holes 6 can be varied as desired in configuration, and through third path 11
Oil Guide charges, and seals through fourth passage 12 offset nail (steel ball), through lateral approach 8 and the first path 9 inducing QI, now by the
One connecting tube 3 and the second connecting tube 4 connect optional outside appropriate pipes, can facilitate rear end integral sensors sealing, or be dried
Technique and keep meter pressure sensor can unimpeded connection air reference, as the first connecting tube 3 is closed, rear end not inducing QI, laterally
Path 8 can form double ventilative cavity configuration by pad pasting, measures occasion for height protection meter pressure in high precision.
On the concave surface of described Base body 1, the die bond position of the second encapsulated holes (or the 3rd encapsulated holes) 6 is optional, as solely
Stand and be packaged into pressure transducer, and lead-in wire rear end needs inducing QI and protection against the tide, then be used for leading by the first connecting tube 3 and the second connecting tube 4
Gas connects, and third path 11 and fourth passage 12 carry out charging oil.
On the concave surface of described Base body 1, the die bond type of the second encapsulated holes (or the 3rd encapsulated holes) 6 is optional, as with
In differential pressure, coordinate with differential capsule, then lateral approach the 8, first path the 9, first connecting tube 3 and third path 11, fourth passage
12 composition embedding mouths；Or, lateral approach the 8, first path the 9, first connecting tube 3 and alternate path the 10, second connecting tube 4 form
Embedding mouth.
The concave surface of described Base body 1 is used for encapsulating rear end PCBA.Described lateral approach 8, can when for double ventilative chamber
Patch polymer moisture-proof ventilated membrane；When for differential capsule, for Oil Guide oil circuit.
As can be seen here, the sensor base that the present invention provides has the advantage that
First, available conventional steel pearl packaging technology encapsulating sheet pressure sensor, utilize traditional process equipment improve utilization rate and
Production efficiency；
Second, internal many pins insulation system, meet multi-chip package and use, can encapsulation temperature sensor；
3rd, side ventilating structure, use the two-chamber of gas permeable polymer film to breathe freely and design, natural permeable, again can be the most anti-
Only gauge pressure transducer condensation, aqueous vapor seepage, solve embedding problem；
4th, ventilating structure has double duty, can be used as the second sensor Oil Guide passage when other purposes encapsulate；
5th, band independence gauge pressure encapsulated holes, and front end indent, can independently realize pressure sensor package, as pressure
Sensor uses, or 2 pressure transducers of encapsulation, it is achieved multiple application.
The invention have the advantage that and i.e. may utilize existing resistance-welding process, it is also possible to utilize oil pipe to be packaged；I.e. can be only
From being packaged into pressure transducer, form bridge heap pressure transducer, it is also possible to be packaged into multi-parameter sensor together with differential capsule；
Dual pressure sensor i.e. can utilize dorsal pore to breathe freely, it is also possible to lateral aperture is breathed freely, and facilitates side to paste ventilated membrane, and flexible pipe is drawn in axial hole
The technique composition two-chamber ventilating structure sensors such as sealing.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among still in the protection domain of the invention.
Claims (8)
1. a sensor base, it is characterised in that include Base body, lateral approach, the first connecting tube and the second connecting tube,
The one end of described first connecting tube inserts in Base body, and the other end is exposed to the end face of Base body, described pedestal
The one end of the other end of main body and the first connecting tube is by the first communication；The one end of described second connecting tube inserts
In Base body, the other end is exposed to the end face of Base body, the other end of described Base body and the second connecting tube
One end connected by alternate path；
Third path and fourth passage, the one end of described third path and the one of fourth passage is offered in described Base body
End is connected, and the other end of described third path and the other end of fourth passage extend through two to Base body
End face；
The end face of described Base body is respectively arranged with the first encapsulated holes, the second encapsulated holes and the 3rd encapsulated holes, described first envelope
Dress hole, the second encapsulated holes connect with the first path, alternate path and third path respectively with the 3rd encapsulated holes；
Described lateral approach is positioned at Base body, and with described first path vertical connection.
Sensor base the most according to claim 1, it is characterised in that also extend through on two end faces of described Base body
There is multiple pressure insulation pin.
Sensor base the most according to claim 1, it is characterised in that described Base body be provided with the first encapsulation
The end face of hole, the second encapsulated holes and the 3rd encapsulated holes caves inward.
Sensor base the most according to claim 1, it is characterised in that between described Base body and pressure insulation pin
It is provided with insulation sintering filler.
Sensor base the most according to claim 1, it is characterised in that be provided with deflector chute, institute in described Base body
State deflector chute for fixing the first connecting tube and the second connecting tube.
Sensor base the most according to claim 1, it is characterised in that the diameter of described fourth passage is more than third path
Diameter so that third path 11 and fourth passage 12 form T-shaped path.
Sensor base the most according to claim 1, it is characterised in that the diameter of described first path is more than the first connection
The internal diameter of pipe, and the external diameter of described first connecting tube is more than the diameter of the first path.
Sensor base the most according to claim 1, it is characterised in that the diameter of described alternate path is more than the second connection
The internal diameter of pipe, and the external diameter of the second connecting tube is more than the diameter of alternate path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610848756.0A CN106323539B (en) | 2016-09-23 | 2016-09-23 | Sensor base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610848756.0A CN106323539B (en) | 2016-09-23 | 2016-09-23 | Sensor base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106323539A true CN106323539A (en) | 2017-01-11 |
| CN106323539B CN106323539B (en) | 2022-07-22 |
Family
ID=57819920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610848756.0A Active CN106323539B (en) | 2016-09-23 | 2016-09-23 | Sensor base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106323539B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696273A (en) * | 2019-03-06 | 2019-04-30 | 武汉飞恩微电子有限公司 | Automobile brake boosting vacuum pressure sensor device |
| CN114459665A (en) * | 2022-02-10 | 2022-05-10 | 南京沃天科技股份有限公司 | Easily assemble differential pressure transmitter structure |
Citations (7)
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|---|---|---|---|---|
| US6450039B1 (en) * | 1999-07-16 | 2002-09-17 | Yamatake Corporation | Pressure sensor and method of manufacturing the same |
| US20050146000A1 (en) * | 2003-10-01 | 2005-07-07 | Woojin Kim | Surface mount package and method for forming multi-chip microsensor device |
| JP2005188990A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Package for pressure detector |
| CN101755197A (en) * | 2007-07-24 | 2010-06-23 | 株式会社山武 | Dual pressure sensor |
| DE102011005274A1 (en) * | 2011-03-09 | 2012-09-13 | Endress + Hauser Gmbh + Co. Kg | Ceramic pressure cell |
| CN103438919A (en) * | 2013-09-13 | 2013-12-11 | 蚌埠市创业电子有限责任公司 | Integrated base of multi-parameter silicon piezoresistive differential pressure transducer |
| CN103674411A (en) * | 2013-07-16 | 2014-03-26 | 上海洛丁森工业自动化设备有限公司 | A double-oil conduit differential pressure sensor chip tube base |
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2016
- 2016-09-23 CN CN201610848756.0A patent/CN106323539B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6450039B1 (en) * | 1999-07-16 | 2002-09-17 | Yamatake Corporation | Pressure sensor and method of manufacturing the same |
| US20050146000A1 (en) * | 2003-10-01 | 2005-07-07 | Woojin Kim | Surface mount package and method for forming multi-chip microsensor device |
| JP2005188990A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Package for pressure detector |
| CN101755197A (en) * | 2007-07-24 | 2010-06-23 | 株式会社山武 | Dual pressure sensor |
| DE102011005274A1 (en) * | 2011-03-09 | 2012-09-13 | Endress + Hauser Gmbh + Co. Kg | Ceramic pressure cell |
| CN103674411A (en) * | 2013-07-16 | 2014-03-26 | 上海洛丁森工业自动化设备有限公司 | A double-oil conduit differential pressure sensor chip tube base |
| CN103438919A (en) * | 2013-09-13 | 2013-12-11 | 蚌埠市创业电子有限责任公司 | Integrated base of multi-parameter silicon piezoresistive differential pressure transducer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696273A (en) * | 2019-03-06 | 2019-04-30 | 武汉飞恩微电子有限公司 | Automobile brake boosting vacuum pressure sensor device |
| CN114459665A (en) * | 2022-02-10 | 2022-05-10 | 南京沃天科技股份有限公司 | Easily assemble differential pressure transmitter structure |
| CN114459665B (en) * | 2022-02-10 | 2023-09-26 | 南京沃天科技股份有限公司 | Differential pressure transmitter structure easy to assemble |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106323539B (en) | 2022-07-22 |
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