CN109870266A - A kind of dual chip differential pressure core - Google Patents

A kind of dual chip differential pressure core Download PDF

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Publication number
CN109870266A
CN109870266A CN201711290707.0A CN201711290707A CN109870266A CN 109870266 A CN109870266 A CN 109870266A CN 201711290707 A CN201711290707 A CN 201711290707A CN 109870266 A CN109870266 A CN 109870266A
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CN
China
Prior art keywords
chip
differential pressure
oil
core
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711290707.0A
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Chinese (zh)
Inventor
高峰
熊峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANJING WOTIAN TECHNOLOGY Co Ltd
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NANJING WOTIAN TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201711290707.0A priority Critical patent/CN109870266A/en
Publication of CN109870266A publication Critical patent/CN109870266A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a kind of dual chip differential pressure cores, belong to sensitive components technical field.The present invention includes chip, is sintered pedestal, pressure ring, diaphragm, ceramic blanket, O-ring, glass insulator, the sintering pedestal are equipped with oil-filled hole, filling oil can be poured into the cavity of core by oil-filled hole, and the chip is fixed on sintering pedestal, the pressure ring, diaphragm is by being welded to connect on sintering pedestal, the chip, pressure ring, diaphragm, ceramic blanket, O-ring, glass insulator, oil-filled hole are 2 groups, symmetrical above and below to be distributed on sintering pedestal.Relative to single-chip differential pressure core, the present invention solves the below technical problem that 1. chip installation direction need not be fixed, and differential pressure core packaging technology is simple, and differential pressure core damages caused by avoiding because of installation fault.2. guaranteeing chip only positive stress when using in its range, chip backside pressure suddenly change is avoided to cause to damage to chip, the precision of raising differential pressure core.

Description

A kind of dual chip differential pressure core
Technical field
The present invention relates to sensitive components technical field, specially a kind of dual chip differential pressure core.
Background technique
Differential pressure core DPS (Differential Pressure Sensor) is a kind of poor between two pressure for measuring The core of value is commonly used to measure the pressure difference of a certain equipment or component rear and front end.Differential pressure core is mainly that single-chip is poor at present Press core, obverse and reverse is under pressure chip at work, when chip reverse side pressure suddenly change (or even occur it is only anti- The case where face stress), chip pressure is excessive, causes the damage of core.The present invention provides one kind by dual chip differential pressure core Body, only positive stress when work, the effective solution above problem, and the shadow that chip itself is subject to when eliminating two sides stress It rings, improves core precision, there is beneficial technical effect.
Summary of the invention
For disadvantages mentioned above existing in the prior art, the present invention is directed to propose a kind of dual chip differential pressure core, the core Only positive stress when work effectively prevents (or even the feelings of only reverse side stress occur when the pressure suddenly change of chip reverse side Condition), chip pressure is excessive, the problem of causing the damage of core.
To achieve the goals above, present invention employs following technical solutions:
A kind of dual chip differential pressure core, including chip are sintered pedestal, pressure ring, diaphragm, ceramic blanket, O-ring, glass insulation Son, the sintering pedestal are equipped with oil-filled hole, and filling oil can be poured into the cavity of core by oil-filled hole, and the chip is fixed on It is sintered on pedestal, the pressure ring, diaphragm is by being welded to connect on sintering pedestal, the chip, pressure ring, diaphragm, ceramic blanket, O Type circle, glass insulator, oil-filled hole are 2, symmetrical above and below to be distributed on sintering pedestal.
Preferably, the chip is by chip glue sticking on sintering pedestal.
Preferably, described be welded as Laser Welding, argon arc welding.
Preferably, the oil-filled hole is sealed by steel ball.
Preferably, the oil-filled hole is located at the side of sintering pedestal, core both ends are respectively led to, are drawn by six roots of sensation pin Out.
Preferably, by spun gold binding, it can be achieved that the electrical connection of chip and pin.
Compared with prior art, the beneficial effects of the present invention are: 1. chip installation direction need not be fixed, the encapsulation of differential pressure core Simple process, differential pressure core damages caused by avoiding because of installation fault.2. guarantee chip only front stress when using in its range, It avoids chip backside pressure suddenly change from causing to damage to chip, improves the precision of differential pressure core.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that the present invention proposes a kind of dual chip differential pressure core.
Fig. 2 is the partial enlarged view of Fig. 1.
In figure: 1- chip, 2- are sintered pedestal, 3- pressure ring, 4- diaphragm, 5- ceramic blanket, 6-O type circle, 7- glass insulator, 8- Oil-filled hole, 9- fill oil, 10- chip glue, 11- steel ball, 12- pin, 13- spun gold.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1, a kind of dual chip differential pressure core, including chip (1) are sintered pedestal (2), pressure ring (3), diaphragm (4), pottery Porcelain pad (5), O-ring (6), glass insulator (7), the sintering pedestal (2) are equipped with oil-filled hole (8), and filling oily (9) can pass through Oil-filled hole (8) pours into the cavity of core, and the oil-filled hole (8) is sealed by steel ball (11), and the chip (1) passes through core Piece glue (10) is bonded in sintering pedestal (2), the pressure ring (3), and diaphragm (4) is connected to sintering pedestal (2) by argon arc welding On, the chip (1), pressure ring (3), diaphragm (4), ceramic blanket (5), O-ring (6), glass insulator (7), oil-filled hole (8) is It is 2 groups, symmetrical above and below to be distributed in sintering pedestal (2).
The oil-filled hole (8) is located at the side of sintering pedestal (2), respectively leads to core both ends, is drawn by six roots of sensation pin (12) Out.By spun gold (13) binding, it can be achieved that the electrical connection of chip (1) and pin (12).
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.

Claims (6)

1. a kind of dual chip differential pressure core, including chip (1) are sintered pedestal (2), pressure ring (3), diaphragm (4), ceramic blanket (5), O Type circle (6), glass insulator (7), the sintering pedestal (2) are equipped with oil-filled hole (8), and oil-filled hole (8) can be passed through by filling oily (9) It pours into the cavity of core, the chip (1) is fixed in sintering pedestal (2), the pressure ring (3), and diaphragm (4) is connected by welding It connects in sintering pedestal (2), it is characterised in that: the chip (1), pressure ring (3), diaphragm (4), ceramic blanket (5), O-ring (6), Glass insulator (7), oil-filled hole (8), is 2 groups, symmetrical above and below to be distributed in sintering pedestal (2).
2. dual chip differential pressure core according to claim 1, which is characterized in that the chip (1) passes through chip glue (10) It is bonded in sintering pedestal (2).
3. dual chip differential pressure core according to claim 1, which is characterized in that described to be welded as Laser Welding, argon arc welding.
4. dual chip differential pressure core according to claim 1, which is characterized in that the oil-filled hole (8) passes through steel ball (11) It is sealed.
5. dual chip differential pressure core according to claim 4, which is characterized in that the oil-filled hole (8) is located at sintering pedestal (2) side respectively leads to core both ends, is drawn by six roots of sensation pin (12).
6. dual chip differential pressure core according to claim 5, which is characterized in that bound by spun gold (13), it can be achieved that core The electrical connection of piece (1) and pin (12).
CN201711290707.0A 2017-12-04 2017-12-04 A kind of dual chip differential pressure core Pending CN109870266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711290707.0A CN109870266A (en) 2017-12-04 2017-12-04 A kind of dual chip differential pressure core

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711290707.0A CN109870266A (en) 2017-12-04 2017-12-04 A kind of dual chip differential pressure core

Publications (1)

Publication Number Publication Date
CN109870266A true CN109870266A (en) 2019-06-11

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Country Status (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114323419A (en) * 2021-12-29 2022-04-12 中国电子科技集团公司第四十八研究所 Take redundant pressure core of double chip
CN114894371A (en) * 2022-05-09 2022-08-12 厦门乃尔电子有限公司 Differential pressure core

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2754076Y (en) * 2004-09-29 2006-01-25 沈阳仪表科学研究院 High-symmetry small-sized high differential pressure sensor
CN202693165U (en) * 2012-07-23 2013-01-23 南京盛业达电子有限公司 Differential pressure testing device
CN202974548U (en) * 2012-10-31 2013-06-05 南京盛业达电子有限公司 Capacitor breaking-in type core body
CN104006914A (en) * 2013-02-27 2014-08-27 霍尼韦尔国际公司 Systems and methods for a pressure sensor having a two layer die structure
CN209296208U (en) * 2019-07-22 2019-08-23 南京沃天科技有限公司 A kind of monocrystalline silicon differential pressure pick-up with symmetrical structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2754076Y (en) * 2004-09-29 2006-01-25 沈阳仪表科学研究院 High-symmetry small-sized high differential pressure sensor
CN202693165U (en) * 2012-07-23 2013-01-23 南京盛业达电子有限公司 Differential pressure testing device
CN202974548U (en) * 2012-10-31 2013-06-05 南京盛业达电子有限公司 Capacitor breaking-in type core body
CN104006914A (en) * 2013-02-27 2014-08-27 霍尼韦尔国际公司 Systems and methods for a pressure sensor having a two layer die structure
CN209296208U (en) * 2019-07-22 2019-08-23 南京沃天科技有限公司 A kind of monocrystalline silicon differential pressure pick-up with symmetrical structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114323419A (en) * 2021-12-29 2022-04-12 中国电子科技集团公司第四十八研究所 Take redundant pressure core of double chip
CN114894371A (en) * 2022-05-09 2022-08-12 厦门乃尔电子有限公司 Differential pressure core

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Application publication date: 20190611

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