CN204679195U - Upper cover packaged type sputtered thin film pressure transducer - Google Patents

Upper cover packaged type sputtered thin film pressure transducer Download PDF

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Publication number
CN204679195U
CN204679195U CN201520448558.6U CN201520448558U CN204679195U CN 204679195 U CN204679195 U CN 204679195U CN 201520448558 U CN201520448558 U CN 201520448558U CN 204679195 U CN204679195 U CN 204679195U
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CN
China
Prior art keywords
sensitive
transfer board
shaped
signals transfer
cover
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Expired - Fee Related
Application number
CN201520448558.6U
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Chinese (zh)
Inventor
唐俐
黎启胜
李思忠
刘伟
王小龙
邓书权
汪胜
王农
季锡林
姜蜀宁
朱昌亚
何建军
赵川梅
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General Engineering Research Institute China Academy of Engineering Physics
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General Engineering Research Institute China Academy of Engineering Physics
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Priority to CN201520448558.6U priority Critical patent/CN204679195U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a kind of upper cover packaged type sputtered thin film pressure transducer, wherein, sensitive element comprises one and has flexible cup-shaped body, the closed end outer face of cup-shaped body is provided with the alloy firm of sputtering, alloy firm is provided with the diaphragm formula foil gauge of photoetching, diaphragm formula foil gauge is connected with signal conditioning circuit plate, the openend of cup-shaped body is connected with the inner of impulse cavity, package casing is installed between impulse cavity and upper cover, socket is installed on and covers, Signals Transfer Board is connected by teflon wire with the inner of socket, Signals Transfer Board is installed on impulse cavity by card extender backup washer, sensitive element, card extender backup washer and Signals Transfer Board are all placed in package casing.The utility model forms consolidated structures by adopting the diaphragm formula foil gauge of photoetching as strain gauge element and with the cup-shaped body of sensitive element, improves stability and the reliability of pressure transducer.

Description

Upper cover packaged type sputtered thin film pressure transducer
Technical field
The utility model relates to a kind of pressure transducer, particularly relates to a kind of upper cover packaged type sputtered thin film pressure transducer.
Background technology
When measurement gas or fluid pressure, what traditional pressure transducer adopted is Integral-structure type strain pressure transducer, it is by impulse cavity, elasticity blind hole unit's diaphragm and the monolithic construction that is connected as a single entity of package casing, and pastes strainometer, welding lead socket and forming at elasticity blind hole unit membrane surface bonded adhesives.Its principle of work is: pressure adds on inner elastomeric blind hole unit diaphragm by impulse cavity by pressure medium, unit's diaphragm applied force flexural deformation, the strainometer that diaphragm another side is pasted produces radial and circumferential strain, by the Wheatstone bridge of composition, electric signal strain being converted to direct proportion change exports, thus realizes the measurement to pressure medium.
The sensitive diaphragm of this Integral-structure type pressure transducer be connected as a single entity is built-in blind-hole type, sensitive diaphragm and impulse part are one-piece construction and are embedded in enclosure, one piece of integral material cut is needed to form, waste of material is more, processing cost is high, difficulty of processing is large, diaphragm machining precision is difficult to control, be not easy in grinding machine processing and milled processed, be not easy to making and the improvement of technique of sensitive element, MEMS technology manufacture craft advanced at present cannot be adopted, be not easy to the batch production realizing sensor, and the thickness of built-in elastic unit diaphragm, the consistance of thickness and form and position tolerance are difficult to control, this has had a strong impact on the most important linear index of sensor, the sensitive element of sensor must rely on bonded adhesives stickup strainometer and make, cause final performance to machining and have the technological process of manual manufacture larger according to patience, the use of bonded adhesives makes the impact of sensor sensing element on surrounding environment more responsive, stability and reliability lower, particularly when environment temperature is too high or too low, the performance of sensor will be subject to having a strong impact on even losing efficacy.
Utility model content
The purpose of this utility model is just to provide a kind of upper cover packaged type sputtered thin film pressure transducer to solve the problem.
The utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of upper cover packaged type sputtered thin film pressure transducer, comprise impulse cavity, sensitive element, Signals Transfer Board, package casing, upper cover and socket, described impulse cavity is connected with the pressure sensitive end of described sensitive element, the signal output part of described sensitive element is connected with the pressure detection end of described Signals Transfer Board, and the signal output part of described Signals Transfer Board is connected with the inner of described socket, described sensitive element comprises one and has flexible cup-shaped body, the closed end outer face of described cup-shaped body is provided with the alloy firm of sputtering, described alloy firm is provided with the diaphragm formula foil gauge of photoetching, the described signal output part of diaphragm formula foil gauge is connected with the pressure detection end of described Signals Transfer Board, the openend of described cup-shaped body is connected with the inner of described impulse cavity and communicates with the tracting pressuring hole of described impulse cavity, described upper cover packaged type sputtered thin film pressure transducer also comprises card extender backup washer and teflon wire, described package casing is installed between described impulse cavity and described upper cover, described socket be installed on described on cover, the signal output part of described Signals Transfer Board is connected by described teflon wire with the inner of described socket, described Signals Transfer Board is installed on described impulse cavity by described card extender backup washer, described sensitive element, described card extender backup washer and described Signals Transfer Board are all placed in described package casing.
Particularly, the inner of described impulse cavity is provided with location hollow cylinder, the first ring-shaped platform that the circumferential profile of described location hollow cylinder becomes external diameter to increase successively, second ring-shaped platform, 3rd ring-shaped platform and the 4th ring-shaped platform, the openend of the cup-shaped body of described sensitive element is set on the hollow cylinder of described location and its openend end face weld is connected on described first ring-shaped platform, one end end face of described card extender backup washer is placed on described 3rd ring-shaped platform, one end end face weld of described package casing is connected on described 4th ring-shaped platform, described Signals Transfer Board is adhered to the other end end face of described card extender backup washer.
The signal output part of diaphragm formula foil gauge of described sensitive element is connected by spun gold with the pressure detection end of described Signals Transfer Board.
As preferably, described socket is aviation four-core socket.
The beneficial effects of the utility model are:
The utility model forms consolidated structures by adopting the diaphragm formula foil gauge of photoetching as strain gauge element and with the cup-shaped body of sensitive element, eliminate tradition paste foil gauge aborning environment temperature having a strong impact on of bonded adhesives is caused to the problem of unstable properties, improve stability and the reliability of pressure transducer, adopt top cap combination hub and package casing, can adopt and be threaded, its connection is more convenient; Concrete manifestation is as follows:
1, sensitive element is by direct vacuum sputtering of metal alloy firm and adopts photoetching process to be prepared into diaphragm formula foil gauge, be convenient to batch and prepare diaphragm formula foil gauge, also make not re-use strainometer bonded adhesives in production technology, completely eliminate impact that bonded adhesives brings and cause the instability of sensor performance, improve stability and the reliability of pressure transducer, and reduce processing cost.
2, sensitive element adopts separate design with impulse cavity and welds, and is convenient to batch machining impulse cavity and sensitive element, reduces the processing loss of material, eliminates the processing of Blind hole in impulse cavity, reduces difficulty of processing, cuts down finished cost.
3, Signals Transfer Board is installed on package casing inside, pressure transducer is made to become to be integrated, overall volume is little, avoid outside and carry transmitter, and make pressure transducer have very strong waterproof and dampproof function, effectively prevent the impact of variation of ambient temperature on pressure sensor inside performance, improve long-time stability and the reliability of pressure transducer.
4, between package casing with upper cover, all can adopt between upper cover with socket and be threaded, the process of encapsulation socket can be made not only fast but also effectively, enhance productivity.
Accompanying drawing explanation
Fig. 1 is the sectional plan view of upper cover packaged type sputtered thin film pressure transducer described in the utility model;
Fig. 2 is the sectional plan view of impulse cavity described in the utility model, and its ratio is greater than Fig. 1;
Fig. 3 be upper cover described in the utility model partly cut open front view;
Fig. 4 is the plan structure schematic diagram of upper cover described in the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail:
As shown in Figure 1, upper cover packaged type sputtered thin film pressure transducer described in the utility model comprises impulse cavity 9, sensitive element 7, Signals Transfer Board 6, package casing 3, upper cover 2, aviation four-core socket 1, card extender backup washer 8 and teflon wire 4, impulse cavity 9 is connected with the pressure sensitive end of sensitive element 7, the signal output part of sensitive element 7 is connected with the pressure detection end of Signals Transfer Board 6, and the signal output part of Signals Transfer Board 6 is connected with the inner of aviation four-core socket 1, sensitive element 7 comprises one and has flexible cup-shaped body (unmarked in figure), closed end (upper end namely in Fig. 1) outer face of cup-shaped body is provided with the alloy firm (not shown) of sputtering, the diaphragm formula foil gauge that described alloy firm is provided with photoetching is (not shown in the figures, for mature technology), the signal output part of diaphragm formula foil gauge is connected by spun gold 5 with the pressure detection end of Signals Transfer Board 6, the openend (lower end namely in Fig. 1) of cup-shaped body be connected with the inner (upper end namely in Fig. 1) of impulse cavity 9 and with the tracting pressuring hole of impulse cavity 9 (the i.e. vertical central through hole of impulse cavity 9 in Fig. 1, unmarked in figure) communicate, package casing 3 is installed between impulse cavity 9 and upper cover 2, aviation four-core socket 1 is installed on upper cover 2, the signal output part of Signals Transfer Board 6 is connected by teflon wire 4 with the inner (lower end namely in Fig. 1) of aviation four-core socket 1, Signals Transfer Board 6 is installed on impulse cavity 9 by card extender backup washer 8, sensitive element 7, card extender backup washer 8 and Signals Transfer Board 6 are all placed in package casing 3.The openend of the cup-shaped body of above-mentioned sensitive element 7 is the pressure sensitive end of sensitive element 7, and the signal output part of diaphragm formula foil gauge is the signal output part of sensitive element 7.
As depicted in figs. 1 and 2, as preferred concrete structure, the inner of impulse cavity 9 is provided with location hollow cylinder 91, the first ring-shaped platform 92 that the circumferential profile of locating hollow cylinder 91 becomes external diameter to increase successively, second ring-shaped platform 93, 3rd ring-shaped platform 94 and the 4th ring-shaped platform 95, first ring-shaped platform 92, second ring-shaped platform 93, 3rd ring-shaped platform 94 and the 4th ring-shaped platform 95 are arranged in order in (lower end namely in Fig. 1) direction outward by the inner (upper end namely in Fig. 1) of impulse cavity 9, the openend of the cup-shaped body of sensitive element 7 is set on the hollow cylinder 91 of location and its openend end face weld is connected on the first ring-shaped platform 92, one end (lower end namely in Fig. 1) end face of card extender backup washer 8 is placed on the 3rd ring-shaped platform 94, one end (lower end namely in Fig. 1) end face weld of package casing 3 is connected on the 4th ring-shaped platform 95, Signals Transfer Board 6 is adhered to the other end (upper end namely in Fig. 1) end face of card extender backup washer 8.
As shown in Figure 3 and Figure 4, upper cover 2 comprises two contiguous blocks being respectively used to be connected with aviation four-core socket 1 and package casing 3, wherein goes up contiguous block and is provided with screw 21 for being connected with aviation four-core socket 1.
As depicted in figs. 1 and 2, the principle of work of upper cover packaged type sputtered thin film pressure transducer described in the utility model is: pressure is added to the openend of the cup-shaped body of sensitive element 7 by pressure medium by impulse cavity 9, then the stressed flexural deformation of the closed end of cup-shaped body, diaphragm formula foil gauge on the closed end outer face of cup-shaped body produces radial and circumferential strain, by the Wheatstone bridge of diaphragm formula foil gauge composition, electric signal strain being converted to direct proportion change exports Signals Transfer Board 6 to, the inner of aviation four-core socket 1 is transferred to again by teflon wire 4, and be connected to miscellaneous equipment as central processing unit by the outer end of aviation four-core socket 1, display etc., thus the measurement realized pressure medium.
Above-described embodiment is preferred embodiment of the present utility model; it is not the restriction to technical solutions of the utility model; as long as without the technical scheme that creative work can realize on the basis of above-described embodiment, all should be considered as falling within the scope of the rights protection of the utility model patent.

Claims (4)

1. a upper cover packaged type sputtered thin film pressure transducer, comprise impulse cavity, sensitive element, Signals Transfer Board, package casing, upper cover and socket, described impulse cavity is connected with the pressure sensitive end of described sensitive element, the signal output part of described sensitive element is connected with the pressure detection end of described Signals Transfer Board, and the signal output part of described Signals Transfer Board is connected with the inner of described socket, it is characterized in that: described sensitive element comprises one and has flexible cup-shaped body, the closed end outer face of described cup-shaped body is provided with the alloy firm of sputtering, described alloy firm is provided with the diaphragm formula foil gauge of photoetching, the described signal output part of diaphragm formula foil gauge is connected with the pressure detection end of described Signals Transfer Board, the openend of described cup-shaped body is connected with the inner of described impulse cavity and communicates with the tracting pressuring hole of described impulse cavity, described upper cover packaged type sputtered thin film pressure transducer also comprises card extender backup washer and teflon wire, described package casing is installed between described impulse cavity and described upper cover, described socket be installed on described on cover, the signal output part of described Signals Transfer Board is connected by described teflon wire with the inner of described socket, described Signals Transfer Board is installed on described impulse cavity by described card extender backup washer, described sensitive element, described card extender backup washer and described Signals Transfer Board are all placed in described package casing.
2. upper cover packaged type sputtered thin film pressure transducer according to claim 1, it is characterized in that: the inner of described impulse cavity is provided with location hollow cylinder, the first ring-shaped platform that the circumferential profile of described location hollow cylinder becomes external diameter to increase successively, second ring-shaped platform, 3rd ring-shaped platform and the 4th ring-shaped platform, the openend of the cup-shaped body of described sensitive element is set on the hollow cylinder of described location and its openend end face weld is connected on described first ring-shaped platform, one end end face of described card extender backup washer is placed on described 3rd ring-shaped platform, one end end face weld of described package casing is connected on described 4th ring-shaped platform, described Signals Transfer Board is adhered to the other end end face of described card extender backup washer.
3. upper cover packaged type sputtered thin film pressure transducer according to claim 1 and 2, is characterized in that: the signal output part of diaphragm formula foil gauge of described sensitive element is connected by spun gold with the pressure detection end of described Signals Transfer Board.
4. upper cover packaged type sputtered thin film pressure transducer according to claim 1 and 2, is characterized in that: described socket is aviation four-core socket.
CN201520448558.6U 2015-06-26 2015-06-26 Upper cover packaged type sputtered thin film pressure transducer Expired - Fee Related CN204679195U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520448558.6U CN204679195U (en) 2015-06-26 2015-06-26 Upper cover packaged type sputtered thin film pressure transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520448558.6U CN204679195U (en) 2015-06-26 2015-06-26 Upper cover packaged type sputtered thin film pressure transducer

Publications (1)

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CN204679195U true CN204679195U (en) 2015-09-30

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105784260A (en) * 2016-05-06 2016-07-20 武汉航空仪表有限责任公司 Novel pressure sensor
CN109100080A (en) * 2018-10-15 2018-12-28 伟业智芯(北京)科技有限公司 Quick response diaphragm pressure sensor and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105784260A (en) * 2016-05-06 2016-07-20 武汉航空仪表有限责任公司 Novel pressure sensor
CN105784260B (en) * 2016-05-06 2018-10-19 武汉航空仪表有限责任公司 A kind of novel pressure sensor
CN109100080A (en) * 2018-10-15 2018-12-28 伟业智芯(北京)科技有限公司 Quick response diaphragm pressure sensor and its manufacturing method

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150930

Termination date: 20180626