CN2539162Y - Silicon piezoresistive type pressure sensor of non-ceramic piece structure - Google Patents
Silicon piezoresistive type pressure sensor of non-ceramic piece structure Download PDFInfo
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- CN2539162Y CN2539162Y CN 02220469 CN02220469U CN2539162Y CN 2539162 Y CN2539162 Y CN 2539162Y CN 02220469 CN02220469 CN 02220469 CN 02220469 U CN02220469 U CN 02220469U CN 2539162 Y CN2539162 Y CN 2539162Y
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Abstract
The utility model relates to a no-ceramic-chip-structure silicon piezoresistive pressure sensor, comprising a silicon pressure chip, a base, a welding ring, a compensation board, silicon oil and a film, which adopts a silicon sensitive chip to sense pressures. The silicon sensitive chip is packaged in the 316L stainless steel housing. The external pressures are transferred from a film of the stainless steel to the silicon sensitive chip by silicon oil, belonging to the instrument technical field. A leading wire is sintered and fixed through a glass, and is isolated from the base; the silicon pressure chip is cemented on the base; the leading wire is connected with the silicon pressure chip via golden wire ball weld; the film, the welding ring and the base is welding together via electron-beam weld; the sealed cavity is full of silicon oil; the surface of the base is coated with a Teflon thin coating layer. The utility model has the advantages that: because the surface of the base is coated with a Teflon thin coating layer, which is of good adhesiveness and good insulation after the Teflon coating layer is dry, the utility model not only remains the functions of prior structure, but also improves the reliability of the performance; the drawback that the prior sensors are easy to be damaged are overcome; the service life is prolonged.
Description
Technical field
The utility model relates to a kind of silicon piezoresistance type pressure sensor that adopts the silicon-sensitive chip to experience the non-ceramics structure of pressure, the silicon-sensitive chip is encapsulated in the 316L stainless steel casing, impressed pressure is delivered to the silicon-sensitive chip from stainless steel diaphragm by silicone oil, belongs to instrument, field of instrumentation technology.
Background technology
Domestic and international many companies all produce silicon piezoresistance type pressure sensor, as offshore company Foxboro, Keller, Nova etc. are arranged, and domestic have Baoji Maike Sensor Co., Ltd..The silicon piezoresistance type pressure sensor structure that they are produced is basic identical, mainly is made up of Silicon pressure chip, base, weld-ring, porcelain ring, pad, compensating plate, silicone oil, diaphragm etc., and lead-in wire is fixed by glass sintering, and insulate with base.The Silicon pressure die bonding links together Silicon pressure chip and lead-in wire by gold ball bonding on base, by electron beam welding diaphragm, weld-ring and base is welded together, and sealed cavity is full of silicone oil, and wherein the porcelain ring is stained with and is connected on the base.Main effect has two first to play the insulation buffer action, avoids spun gold to contact with base, and it two is filling effects, the content of silicone oil in the minimizing cavity.Ceramics is to stick on the base by glue, because ceramics has certain weight, extraneous vibrations can cause the loosening of ceramics, and then causes the damage of sensor.
Summary of the invention
The purpose of this utility model is to exist the porcelain ring to be stained with the inherent shortcoming that connects at said structure, proposes a kind of silicon piezoresistance type pressure sensor that does not adopt the ceramics structure, has fundamentally eliminated the hidden danger that defective produced that prior art has.Technical solution of the present utility model: form by Silicon pressure chip, base, weld-ring, compensating plate, silicone oil, diaphragm etc., lead-in wire is fixed by glass sintering, and insulate with base, the Silicon pressure die bonding is on base, by gold ball bonding Silicon pressure chip and lead-in wire are linked together, by electron beam welding diaphragm, weld-ring and base are welded together, sealed cavity is full of silicone oil, it is characterized in that being coated with the very thin teflon coatings of last layer in susceptor surface.Advantage of the present utility model: owing to coated the very thin teflon coatings of one deck in susceptor surface, after teflon coatings is done, it has very strong viscidity-applying property and good insulation performance, so it had both guaranteed the effect of original structure, improved the reliability of performance again, avoid the flimsy defective of existing sensor, prolonged serviceable life.
Accompanying drawing is a structural representation of the present utility model
Among the figure 1 is weld-ring, the 2nd, silicone oil, the 3rd, pressure chip, the 4th, Teflon, the 5th, diaphragm, the 6th, glass insulator, the 7th, base, the 8th, compensating plate, the 9th, lead-in wire, the 10th, pin.
Specific implementation method
Existing sensors is adopted non-ceramics structure, and structure is constant substantially.Just be coated with the very thin teflon coatings 4 of last layer on base 7 surfaces.Add man-hour at base 7, original ceramics space is shared, still the silicone oil amount that keeps original ceramics to fill, and be coated with the very thin teflon coatings 4 of last layer on its surface, after coating was done, it had very strong viscidity-applying property and good insulation performance, by such new design, both guarantee the effect of original structure, improved the reliability of performance again.Avoid the flimsy defective of existing sensor, prolonged serviceable life.
Silicon piezoresistance type pressure sensor is a pressure survey product, and it can easily be assembled into the transmitter of standard signal output, is widely used in oil, chemical industry, metallurgy, electric power, Aeronautics and Astronautics, Medical Devices, automobile and other industries.
Claims (1)
1, the silicon piezoresistance type pressure sensor of non-ceramics structure, comprise by Silicon pressure chip (3), base (7), weld-ring (1), compensating plate (8), silicone oil (2), diaphragm pins (10) such as (5) is fixed by glass sintering, and insulate with base (7), compensating plate (8) links together by soldering with pin (10), lead-in wire (9) is welded on the compensating plate (8), Silicon pressure chip (3) is bonded on the base (7), by gold ball bonding Silicon pressure chip (3) and pin (10) are linked together, by electron beam welding with diaphragm (5), weld-ring (1) and base (7) weld together, sealed cavity is full of silicone oil (2), it is characterized in that being coated with the very thin teflon coatings of last layer (4) on base (7) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02220469 CN2539162Y (en) | 2002-05-10 | 2002-05-10 | Silicon piezoresistive type pressure sensor of non-ceramic piece structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02220469 CN2539162Y (en) | 2002-05-10 | 2002-05-10 | Silicon piezoresistive type pressure sensor of non-ceramic piece structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2539162Y true CN2539162Y (en) | 2003-03-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02220469 Expired - Fee Related CN2539162Y (en) | 2002-05-10 | 2002-05-10 | Silicon piezoresistive type pressure sensor of non-ceramic piece structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN2539162Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100344883C (en) * | 2003-04-03 | 2007-10-24 | 帕克-汉尼芬有限公司 | Arrangement for the detection and transmission of test data from a pressure chamber filled with a high-pressure fluid |
| CN101799343A (en) * | 2010-03-09 | 2010-08-11 | 昆山诺金传感技术有限公司 | Automobile manifold absolute pressure sensor |
| CN103323565A (en) * | 2012-03-21 | 2013-09-25 | 张伟 | Multi-phase sensor |
| CN103376182A (en) * | 2012-04-28 | 2013-10-30 | 浙江三花股份有限公司 | Heat exchange device and pressure sensor thereof |
| CN105021322A (en) * | 2015-07-10 | 2015-11-04 | 四川奇胜科技有限公司 | Integrated pressure sensor |
| CN109764999A (en) * | 2019-02-14 | 2019-05-17 | 河海大学 | A kind of gas pressure measurement sensor |
| CN109959481A (en) * | 2017-12-14 | 2019-07-02 | 浙江三花制冷集团有限公司 | A kind of pressure sensor |
-
2002
- 2002-05-10 CN CN 02220469 patent/CN2539162Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100344883C (en) * | 2003-04-03 | 2007-10-24 | 帕克-汉尼芬有限公司 | Arrangement for the detection and transmission of test data from a pressure chamber filled with a high-pressure fluid |
| CN101799343A (en) * | 2010-03-09 | 2010-08-11 | 昆山诺金传感技术有限公司 | Automobile manifold absolute pressure sensor |
| CN103323565A (en) * | 2012-03-21 | 2013-09-25 | 张伟 | Multi-phase sensor |
| CN103376182A (en) * | 2012-04-28 | 2013-10-30 | 浙江三花股份有限公司 | Heat exchange device and pressure sensor thereof |
| CN105021322A (en) * | 2015-07-10 | 2015-11-04 | 四川奇胜科技有限公司 | Integrated pressure sensor |
| CN109959481A (en) * | 2017-12-14 | 2019-07-02 | 浙江三花制冷集团有限公司 | A kind of pressure sensor |
| CN109959481B (en) * | 2017-12-14 | 2021-03-26 | 浙江三花制冷集团有限公司 | Pressure sensor |
| CN109764999A (en) * | 2019-02-14 | 2019-05-17 | 河海大学 | A kind of gas pressure measurement sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |