JP2005183872A - 半導体集積回路及びその半導体集積回路を使用した光ディスク記録装置 - Google Patents
半導体集積回路及びその半導体集積回路を使用した光ディスク記録装置 Download PDFInfo
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- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/004—Recording, reproducing or erasing methods; Read, write or erase circuits therefor
- G11B7/0045—Recording
- G11B7/00456—Recording strategies, e.g. pulse sequences
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
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Abstract
【解決手段】 この発明は、高電圧で駆動されるLDドライバ回路部90、このLDドライバ回路90よりは低電圧で駆動されるストラテジ生成回路を構成するデジタル信号演算回路部80とを別の半導体チップで構成し、これら半導体チップを1つのパッケージに搭載するともに、LDドライバ回路90内に電源回路部91が設けられ、この電源回路部91からデジタル信号演算回路部80内のPLL回路部85に電源が供給されること特徴とする。
【選択図】 図3
Description
2 制御用LSI
3 電源用LSI
4 フレキシブルケーブル
5 ピックアップ基板
8 MCM
80 ストラテジ生成回路を構成するデジタル演算用LSI
85 PLL回路
90 LDドライバ用LSI
91 電源回路
Claims (9)
- 高電圧で駆動される高電圧駆動回路部と、この高電圧駆動回路部よりは低電圧で駆動されるデジタル信号演算回路部とを備え、前記高電圧駆動回路部に電源回路部が設けられ、この電源回路部からデジタル信号演算回路部内のPLL回路部に電源が供給されることを特徴とする半導体集積回路。
- 前記高電圧駆動回路部と、デジタル信号演算回路部とを別の半導体チップで構成し、これら半導体チップを1つのパッケージに搭載したことを特徴とする半導体集積回路。
- 前記高電圧駆動回路部は、半導体レーザ駆動制御部回路であり、前記デジタル信号演算回路部は、ストラテジ生成回路であることを特徴とする請求項2に記載の半導体集積回路。
- 前記半導体チップ間の信号伝送を行うインターフェース回路に差動電圧を用いたLVDS回路を用いることを特徴とする請求項2または3に記載の半導体集積回路。
- 前記LVDS回路における差動信号の伝送を行う各信号線に、半導体チップ間を接続するボンディングワイヤが用いられ、各半導体チップは、前記ボンディングワイヤが等長となる位置に接続用パッドが配置されていることを特徴とする請求項4に記載の半導体集積回路。
- ホスト装置から入力された光ディスクへの書き込みようデータを所定の方法でエンコードし、エンコードした信号に基づきストラジ生成を行うデジタル信号演算回路部と、このデジタル信号演算回路部からの信号に基づいて光ディスクにレーザ光を照射する半導体レーザの駆動制御を行う半導体レーザ駆動制御部とを備え、ホスト装置から入力されたデータを光ディスク記録装置に記録する光ディスク記録装置において、
デジタル信号演算回路部と、半導体レーザ駆動制御部とを一体化し、前記半導体レーザ駆動制御部に電源回路部が設けられ、この電源回路部からデジタル信号演算回路部内のPLL回路部に電源が供給されることを特徴とする光ディスク記録装置。 - デジタル信号演算回路部と半導体レーザ駆動制御部とを別の半導体チップで構成し、これら半導体チップを1つのパッケージに搭載したことを特徴とする請求項6に記載の光ディスク記録装置。
- 前記半導体チップ間の信号伝送を行うインターフェース回路に差動電圧を用いたLVDS回路を用いることを特徴とする請求項7に記載の光ディスク記録装置。
- 前記LVDS回路における差動信号の伝送を行う各信号線に、半導体チップ間を接続するボンディングワイヤが用いられ、各半導体チップは、前記ボンディングワイヤが等長となる位置に接続用パッドが配置されていることを特徴とする請求項8に記載の光ディスク記録装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003426256A JP4426277B2 (ja) | 2003-12-24 | 2003-12-24 | 半導体集積回路及びその半導体集積回路を使用した光ディスク記録装置 |
US11/019,923 US7773491B2 (en) | 2003-12-24 | 2004-12-22 | Method and apparatus for high-speed optical disc recording using multi chip module |
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JP2003426256A JP4426277B2 (ja) | 2003-12-24 | 2003-12-24 | 半導体集積回路及びその半導体集積回路を使用した光ディスク記録装置 |
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JP2005183872A true JP2005183872A (ja) | 2005-07-07 |
JP4426277B2 JP4426277B2 (ja) | 2010-03-03 |
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JP2003426256A Expired - Fee Related JP4426277B2 (ja) | 2003-12-24 | 2003-12-24 | 半導体集積回路及びその半導体集積回路を使用した光ディスク記録装置 |
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US (1) | US7773491B2 (ja) |
JP (1) | JP4426277B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007164855A (ja) * | 2005-12-12 | 2007-06-28 | Hitachi Ltd | 光ディスク装置 |
JP2011003250A (ja) * | 2009-06-19 | 2011-01-06 | Renesas Electronics Corp | 半導体記憶装置 |
JP2013135160A (ja) * | 2011-12-27 | 2013-07-08 | Murata Mfg Co Ltd | 複合モジュールおよび電子機器 |
JP2020145229A (ja) * | 2019-03-04 | 2020-09-10 | アイシン・エィ・ダブリュ株式会社 | 半導体装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI329863B (en) * | 2003-08-08 | 2010-09-01 | Lite On It Corp | Method of arranging conducting line of flexible cable in optical drive |
JP2010287876A (ja) * | 2009-05-15 | 2010-12-24 | Sanyo Electric Co Ltd | 配線構造および光ディスク装置 |
TWI419560B (zh) * | 2009-07-09 | 2013-12-11 | Mstar Semiconductor Inc | 可自動校準輸出之解調器、方法及其電視接收器 |
JP6387743B2 (ja) | 2013-12-16 | 2018-09-12 | 株式会社リコー | 半導体装置および半導体装置の製造方法 |
JP6519972B2 (ja) | 2014-02-07 | 2019-05-29 | 株式会社リコー | ハイパスフィルタ回路及びバンドパスフィルタ回路 |
JP6354221B2 (ja) | 2014-03-12 | 2018-07-11 | 株式会社リコー | 撮像装置及び電子機器 |
JP2016025261A (ja) | 2014-07-23 | 2016-02-08 | 株式会社リコー | 撮像装置、撮像装置の制御方法、画素構造 |
JP2016092178A (ja) | 2014-11-04 | 2016-05-23 | 株式会社リコー | 固体撮像素子 |
JP2016092348A (ja) | 2014-11-11 | 2016-05-23 | 株式会社リコー | 半導体デバイス及びその製造方法、撮像装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1185345A (ja) | 1997-09-02 | 1999-03-30 | Toshiba Corp | 入出力インターフェース回路及び半導体システム |
JP3938617B2 (ja) | 1997-09-09 | 2007-06-27 | 富士通株式会社 | 半導体装置及び半導体システム |
JP3718759B2 (ja) | 1999-01-25 | 2005-11-24 | 株式会社日立製作所 | レーザ駆動装置および光ディスク記録再生装置 |
JP3875533B2 (ja) | 2001-10-22 | 2007-01-31 | 株式会社リコー | 光源駆動装置 |
JP3786608B2 (ja) * | 2002-01-28 | 2006-06-14 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
-
2003
- 2003-12-24 JP JP2003426256A patent/JP4426277B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-22 US US11/019,923 patent/US7773491B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007164855A (ja) * | 2005-12-12 | 2007-06-28 | Hitachi Ltd | 光ディスク装置 |
JP2011003250A (ja) * | 2009-06-19 | 2011-01-06 | Renesas Electronics Corp | 半導体記憶装置 |
JP2013135160A (ja) * | 2011-12-27 | 2013-07-08 | Murata Mfg Co Ltd | 複合モジュールおよび電子機器 |
JP2020145229A (ja) * | 2019-03-04 | 2020-09-10 | アイシン・エィ・ダブリュ株式会社 | 半導体装置 |
JP7238477B2 (ja) | 2019-03-04 | 2023-03-14 | 株式会社アイシン | 半導体装置 |
Also Published As
Publication number | Publication date |
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JP4426277B2 (ja) | 2010-03-03 |
US20050141395A1 (en) | 2005-06-30 |
US7773491B2 (en) | 2010-08-10 |
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