JP2005175464A5 - - Google Patents

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Publication number
JP2005175464A5
JP2005175464A5 JP2004339942A JP2004339942A JP2005175464A5 JP 2005175464 A5 JP2005175464 A5 JP 2005175464A5 JP 2004339942 A JP2004339942 A JP 2004339942A JP 2004339942 A JP2004339942 A JP 2004339942A JP 2005175464 A5 JP2005175464 A5 JP 2005175464A5
Authority
JP
Japan
Prior art keywords
diisocyanate
polishing pad
window
aliphatic
hydroxyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004339942A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005175464A (ja
Filing date
Publication date
Priority claimed from US10/722,739 external-priority patent/US6984163B2/en
Application filed filed Critical
Publication of JP2005175464A publication Critical patent/JP2005175464A/ja
Publication of JP2005175464A5 publication Critical patent/JP2005175464A5/ja
Pending legal-status Critical Current

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JP2004339942A 2003-11-25 2004-11-25 光透過性が高い窓を有する研磨パッド Pending JP2005175464A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/722,739 US6984163B2 (en) 2003-11-25 2003-11-25 Polishing pad with high optical transmission window

Publications (2)

Publication Number Publication Date
JP2005175464A JP2005175464A (ja) 2005-06-30
JP2005175464A5 true JP2005175464A5 (enExample) 2007-11-22

Family

ID=34465692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004339942A Pending JP2005175464A (ja) 2003-11-25 2004-11-25 光透過性が高い窓を有する研磨パッド

Country Status (7)

Country Link
US (1) US6984163B2 (enExample)
EP (1) EP1535699B1 (enExample)
JP (1) JP2005175464A (enExample)
KR (1) KR101120647B1 (enExample)
CN (1) CN100347826C (enExample)
DE (1) DE602004000805T2 (enExample)
TW (1) TWI324545B (enExample)

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US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
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US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9333620B2 (en) * 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
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US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9586304B2 (en) * 2014-12-19 2017-03-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-expansion CMP PAD casting method
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KR101889081B1 (ko) * 2017-03-16 2018-08-16 에스케이씨 주식회사 연마패드 및 이의 제조방법
US10207388B2 (en) * 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10293456B2 (en) * 2017-04-19 2019-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
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US10391606B2 (en) * 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
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US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
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JP7540929B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540930B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7575328B2 (ja) * 2021-03-29 2024-10-29 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540931B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
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