JP2005175464A - 光透過性が高い窓を有する研磨パッド - Google Patents

光透過性が高い窓を有する研磨パッド Download PDF

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Publication number
JP2005175464A
JP2005175464A JP2004339942A JP2004339942A JP2005175464A JP 2005175464 A JP2005175464 A JP 2005175464A JP 2004339942 A JP2004339942 A JP 2004339942A JP 2004339942 A JP2004339942 A JP 2004339942A JP 2005175464 A JP2005175464 A JP 2005175464A
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JP
Japan
Prior art keywords
diisocyanate
window
polishing pad
curing agent
hydroxyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004339942A
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English (en)
Japanese (ja)
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JP2005175464A5 (enExample
Inventor
John V H Roberts
ジョン・ブイ・エイチ・ロバーツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2005175464A publication Critical patent/JP2005175464A/ja
Publication of JP2005175464A5 publication Critical patent/JP2005175464A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2004339942A 2003-11-25 2004-11-25 光透過性が高い窓を有する研磨パッド Pending JP2005175464A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/722,739 US6984163B2 (en) 2003-11-25 2003-11-25 Polishing pad with high optical transmission window

Publications (2)

Publication Number Publication Date
JP2005175464A true JP2005175464A (ja) 2005-06-30
JP2005175464A5 JP2005175464A5 (enExample) 2007-11-22

Family

ID=34465692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004339942A Pending JP2005175464A (ja) 2003-11-25 2004-11-25 光透過性が高い窓を有する研磨パッド

Country Status (7)

Country Link
US (1) US6984163B2 (enExample)
EP (1) EP1535699B1 (enExample)
JP (1) JP2005175464A (enExample)
KR (1) KR101120647B1 (enExample)
CN (1) CN100347826C (enExample)
DE (1) DE602004000805T2 (enExample)
TW (1) TWI324545B (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005354077A (ja) * 2004-06-10 2005-12-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 応力が軽減した窓を有する研磨パッド
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2007307638A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2009531192A (ja) * 2006-03-27 2009-09-03 フリースケール セミコンダクター インコーポレイテッド 研磨パッド、研磨装置、及び研磨パッドの使用方法
US8348724B2 (en) 2007-05-16 2013-01-08 Toyo Tire & Rubber Co., Ltd. Polishing pad manufacturing method
JP2015208856A (ja) * 2014-04-29 2015-11-24 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 明確な終点検出ウィンドウ付きケミカルメカニカルポリッシングパッド
JP2019089193A (ja) * 2017-11-16 2019-06-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド Ｃｍｐ研磨パッドのための高いｕｖ透過率を有する脂肪族ｕｖ硬化ポリウレタン光学的終点検出窓
JP2020506071A (ja) * 2017-01-23 2020-02-27 エスケイシー・カンパニー・リミテッドＳｋｃ Ｃｏ．， Ｌｔｄ． 研磨パッドおよびその製造方法
JP2022056816A (ja) * 2020-09-30 2022-04-11 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2022056817A (ja) * 2020-09-30 2022-04-11 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2022056818A (ja) * 2020-09-30 2022-04-11 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2022152340A (ja) * 2021-03-29 2022-10-12 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2024523121A (ja) * 2022-01-20 2024-06-28 ケーピーエックス ケミカル カンパニー リミテッド 研磨パッド用ウィンドウの製造方法及びこの方法で製造された研磨パッド用ウィンドウ
KR102902282B1 (ko) 2020-09-30 2025-12-22 후지보홀딩스가부시끼가이샤 연마 패드 및 연마 패드의 제조 방법

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US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
EP1894900A3 (en) * 2006-08-28 2010-02-24 Osaka University Catalyst-aided chemical processing method and apparatus
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
EP2227350A4 (en) * 2007-11-30 2011-01-12 Innopad Inc CUSHION WITH FINISHED MOUNTING WINDOW FOR CHEMICAL-MECHANICAL POLISHING
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
TWI396602B (zh) * 2009-12-31 2013-05-21 Iv Technologies Co Ltd 具有偵測窗之研磨墊的製造方法及具有偵測窗之研磨墊
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8697217B2 (en) * 2010-01-15 2014-04-15 Rohm and Haas Electronics Materials CMP Holdings, Inc. Creep-resistant polishing pad window
CN102133734B (zh) * 2010-01-21 2015-02-04 智胜科技股份有限公司 具有侦测窗的研磨垫及其制造方法
TWI510526B (zh) * 2010-06-25 2015-12-01 羅門哈斯電子材料Ｃｍｐ控股公司 具有低缺陷一體成型窗之化學機械研磨墊
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN102310366B (zh) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 具有低缺陷整体窗的化学机械抛光垫
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8257545B2 (en) * 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
JP5732354B2 (ja) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US20140256231A1 (en) 2013-03-07 2014-09-11 Dow Global Technologies Llc Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
US9446497B2 (en) 2013-03-07 2016-09-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) * 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
TWI635929B (zh) 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9586304B2 (en) * 2014-12-19 2017-03-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-expansion CMP PAD casting method
US9475168B2 (en) 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR101889081B1 (ko) * 2017-03-16 2018-08-16 에스케이씨 주식회사 연마패드 및 이의 제조방법
US10207388B2 (en) * 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10293456B2 (en) * 2017-04-19 2019-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10391606B2 (en) * 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
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KR102421208B1 (ko) 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102623920B1 (ko) * 2021-07-27 2024-01-10 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005354077A (ja) * 2004-06-10 2005-12-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 応力が軽減した窓を有する研磨パッド
JP2009531192A (ja) * 2006-03-27 2009-09-03 フリースケール セミコンダクター インコーポレイテッド 研磨パッド、研磨装置、及び研磨パッドの使用方法
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2007307638A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US8348724B2 (en) 2007-05-16 2013-01-08 Toyo Tire & Rubber Co., Ltd. Polishing pad manufacturing method
JP2015208856A (ja) * 2014-04-29 2015-11-24 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 明確な終点検出ウィンドウ付きケミカルメカニカルポリッシングパッド
JP2020506071A (ja) * 2017-01-23 2020-02-27 エスケイシー・カンパニー・リミテッドＳｋｃ Ｃｏ．， Ｌｔｄ． 研磨パッドおよびその製造方法
JP7117310B2 (ja) 2017-01-23 2022-08-12 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびその製造方法
JP2019089193A (ja) * 2017-11-16 2019-06-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド Ｃｍｐ研磨パッドのための高いｕｖ透過率を有する脂肪族ｕｖ硬化ポリウレタン光学的終点検出窓
JP7207963B2 (ja) 2017-11-16 2023-01-18 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド Ｃｍｐ研磨パッドのための高いｕｖ透過率を有する脂肪族ｕｖ硬化ポリウレタン光学的終点検出窓
JP2022056818A (ja) * 2020-09-30 2022-04-11 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2022056817A (ja) * 2020-09-30 2022-04-11 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2022056816A (ja) * 2020-09-30 2022-04-11 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540930B2 (ja) 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540931B2 (ja) 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540929B2 (ja) 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
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JP2022152340A (ja) * 2021-03-29 2022-10-12 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7575328B2 (ja) 2021-03-29 2024-10-29 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2024523121A (ja) * 2022-01-20 2024-06-28 ケーピーエックス ケミカル カンパニー リミテッド 研磨パッド用ウィンドウの製造方法及びこの方法で製造された研磨パッド用ウィンドウ
JP7737476B2 (ja) 2022-01-20 2025-09-10 ケーピーエックス ケミカル カンパニー リミテッド 研磨パッド用ウィンドウの製造方法及びこの方法で製造された研磨パッド用ウィンドウ

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KR20050050582A (ko) 2005-05-31
CN100347826C (zh) 2007-11-07
EP1535699B1 (en) 2006-05-03
TW200531785A (en) 2005-10-01
CN1622289A (zh) 2005-06-01
DE602004000805T2 (de) 2006-11-30
KR101120647B1 (ko) 2012-03-16
US20050113008A1 (en) 2005-05-26
EP1535699A1 (en) 2005-06-01

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