CN100347826C - 具有高透光窗口的抛光垫 - Google Patents

具有高透光窗口的抛光垫 Download PDF

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Publication number
CN100347826C
CN100347826C CNB2004100950388A CN200410095038A CN100347826C CN 100347826 C CN100347826 C CN 100347826C CN B2004100950388 A CNB2004100950388 A CN B2004100950388A CN 200410095038 A CN200410095038 A CN 200410095038A CN 100347826 C CN100347826 C CN 100347826C
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China
Prior art keywords
diisocyanate
polishing pad
window
chemical mechanical
mechanical polishing
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Ceased
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CNB2004100950388A
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Chinese (zh)
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CN1622289A (zh
Inventor
J·V·H·罗伯茨
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ROHM AND HAAS ELECTRONIC MATER
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ROHM AND HAAS ELECTRONIC MATER
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNB2004100950388A 2003-11-25 2004-11-24 具有高透光窗口的抛光垫 Ceased CN100347826C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/722,739 US6984163B2 (en) 2003-11-25 2003-11-25 Polishing pad with high optical transmission window
US10/722,739 2003-11-25

Publications (2)

Publication Number Publication Date
CN1622289A CN1622289A (zh) 2005-06-01
CN100347826C true CN100347826C (zh) 2007-11-07

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ID=34465692

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Application Number Title Priority Date Filing Date
CNB2004100950388A Ceased CN100347826C (zh) 2003-11-25 2004-11-24 具有高透光窗口的抛光垫

Country Status (7)

Country Link
US (1) US6984163B2 (enExample)
EP (1) EP1535699B1 (enExample)
JP (1) JP2005175464A (enExample)
KR (1) KR101120647B1 (enExample)
CN (1) CN100347826C (enExample)
DE (1) DE602004000805T2 (enExample)
TW (1) TWI324545B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104029115A (zh) * 2013-03-07 2014-09-10 罗门哈斯电子材料Cmp控股股份有限公司 具有广谱终点检测窗口的多层化学机械抛光垫
TWI663026B (zh) * 2017-01-23 2019-06-21 南韓商Ｓｋｃ股份有限公司 拋光墊及其製備方法
TWI682025B (zh) * 2014-12-19 2020-01-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 受控膨脹ｃｍｐ墊澆注方法
CN117396308A (zh) * 2022-01-20 2024-01-12 韩商Kpx化学股份有限公司 制造抛光垫窗口的方法和由此制造的抛光垫窗口

Families Citing this family (72)

* Cited by examiner, † Cited by third party
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US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
US7179151B1 (en) * 2006-03-27 2007-02-20 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
EP1894900A3 (en) * 2006-08-28 2010-02-24 Osaka University Catalyst-aided chemical processing method and apparatus
JP4971028B2 (ja) * 2007-05-16 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
EP2227350A4 (en) * 2007-11-30 2011-01-12 Innopad Inc CUSHION WITH FINISHED MOUNTING WINDOW FOR CHEMICAL-MECHANICAL POLISHING
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
TWI396602B (zh) * 2009-12-31 2013-05-21 Iv Technologies Co Ltd 具有偵測窗之研磨墊的製造方法及具有偵測窗之研磨墊
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8697217B2 (en) * 2010-01-15 2014-04-15 Rohm and Haas Electronics Materials CMP Holdings, Inc. Creep-resistant polishing pad window
CN102133734B (zh) * 2010-01-21 2015-02-04 智胜科技股份有限公司 具有侦测窗的研磨垫及其制造方法
TWI510526B (zh) * 2010-06-25 2015-12-01 羅門哈斯電子材料Ｃｍｐ控股公司 具有低缺陷一體成型窗之化學機械研磨墊
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN102310366B (zh) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 具有低缺陷整体窗的化学机械抛光垫
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8257545B2 (en) * 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
JP5732354B2 (ja) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9446497B2 (en) 2013-03-07 2016-09-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) * 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
TWI635929B (zh) 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9333620B2 (en) * 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9475168B2 (en) 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR101889081B1 (ko) * 2017-03-16 2018-08-16 에스케이씨 주식회사 연마패드 및 이의 제조방법
US10207388B2 (en) * 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10293456B2 (en) * 2017-04-19 2019-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10391606B2 (en) * 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102421208B1 (ko) 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
JP7540929B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540930B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7575328B2 (ja) * 2021-03-29 2024-10-29 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540931B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102623920B1 (ko) * 2021-07-27 2024-01-10 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104029115A (zh) * 2013-03-07 2014-09-10 罗门哈斯电子材料Cmp控股股份有限公司 具有广谱终点检测窗口的多层化学机械抛光垫
TWI682025B (zh) * 2014-12-19 2020-01-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 受控膨脹ｃｍｐ墊澆注方法
TWI663026B (zh) * 2017-01-23 2019-06-21 南韓商Ｓｋｃ股份有限公司 拋光墊及其製備方法
CN117396308A (zh) * 2022-01-20 2024-01-12 韩商Kpx化学股份有限公司 制造抛光垫窗口的方法和由此制造的抛光垫窗口
TWI888771B (zh) * 2022-01-20 2025-07-01 南韓商Ｋｐｘ化工有限公司 用於研磨墊之窗口的製造方法、用於研磨墊之窗口以及研磨墊

Also Published As

Publication number Publication date
US6984163B2 (en) 2006-01-10
TWI324545B (en) 2010-05-11
DE602004000805D1 (de) 2006-06-08
KR20050050582A (ko) 2005-05-31
EP1535699B1 (en) 2006-05-03
JP2005175464A (ja) 2005-06-30
TW200531785A (en) 2005-10-01
CN1622289A (zh) 2005-06-01
DE602004000805T2 (de) 2006-11-30
KR101120647B1 (ko) 2012-03-16
US20050113008A1 (en) 2005-05-26
EP1535699A1 (en) 2005-06-01

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