JP2005174961A - 基板処理方法及び装置 - Google Patents
基板処理方法及び装置 Download PDFInfo
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- JP2005174961A JP2005174961A JP2003408214A JP2003408214A JP2005174961A JP 2005174961 A JP2005174961 A JP 2005174961A JP 2003408214 A JP2003408214 A JP 2003408214A JP 2003408214 A JP2003408214 A JP 2003408214A JP 2005174961 A JP2005174961 A JP 2005174961A
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- wiring
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Images
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003408214A JP2005174961A (ja) | 2003-12-05 | 2003-12-05 | 基板処理方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003408214A JP2005174961A (ja) | 2003-12-05 | 2003-12-05 | 基板処理方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005174961A true JP2005174961A (ja) | 2005-06-30 |
| JP2005174961A5 JP2005174961A5 (https=) | 2007-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003408214A Pending JP2005174961A (ja) | 2003-12-05 | 2003-12-05 | 基板処理方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005174961A (https=) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258274A (ja) * | 2006-03-20 | 2007-10-04 | Ebara Corp | 基板処理方法、及び基板処理装置 |
| JP2009111163A (ja) * | 2007-10-30 | 2009-05-21 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
| WO2009079874A1 (en) * | 2007-12-10 | 2009-07-02 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
| JP2009255248A (ja) * | 2008-04-18 | 2009-11-05 | Disco Abrasive Syst Ltd | 研磨装置 |
| WO2011049092A1 (ja) * | 2009-10-23 | 2011-04-28 | 三菱瓦斯化学株式会社 | 金属微細構造体のパターン倒壊抑制用処理液及びこれを用いた金属微細構造体の製造方法 |
| JP2011151416A (ja) * | 2011-04-18 | 2011-08-04 | Tokyo Ohka Kogyo Co Ltd | 処理装置および処理方法、ならびに表面処理治具 |
| CN102575360A (zh) * | 2009-10-02 | 2012-07-11 | 三菱瓦斯化学株式会社 | 用于抑制金属微细结构体的图案倒塌的处理液和使用其的金属微细结构体的制造方法 |
| JP2013004623A (ja) * | 2011-06-14 | 2013-01-07 | Tokyo Electron Ltd | 液処理装置および液処理方法 |
| JP2013021183A (ja) * | 2011-07-12 | 2013-01-31 | Tokyo Electron Ltd | 液処理装置および天板洗浄方法 |
| JP2013051396A (ja) * | 2011-08-03 | 2013-03-14 | Tokyo Electron Ltd | 液処理装置および液処理方法 |
| JP2013110322A (ja) * | 2011-11-22 | 2013-06-06 | Shin Etsu Handotai Co Ltd | シリコン酸化膜の形成方法及び形成装置、並びにシリコンウェーハの研磨方法 |
| US9129999B2 (en) | 2006-11-30 | 2015-09-08 | Tokyo Ohka Kogyo Co., Ltd. | Treatment device, treatment method, and surface treatment jig |
| WO2017164185A1 (ja) * | 2016-03-25 | 2017-09-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| WO2017164186A1 (ja) * | 2016-03-25 | 2017-09-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP2017183711A (ja) * | 2016-03-25 | 2017-10-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP2018056223A (ja) * | 2016-09-27 | 2018-04-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| KR20180037903A (ko) * | 2016-10-05 | 2018-04-13 | 램 리서치 아게 | 에지 링을 포함한 스핀 척 |
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