JP2005159267A - 半導体装置及びワイヤボンディング方法 - Google Patents

半導体装置及びワイヤボンディング方法 Download PDF

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Publication number
JP2005159267A
JP2005159267A JP2004084048A JP2004084048A JP2005159267A JP 2005159267 A JP2005159267 A JP 2005159267A JP 2004084048 A JP2004084048 A JP 2004084048A JP 2004084048 A JP2004084048 A JP 2004084048A JP 2005159267 A JP2005159267 A JP 2005159267A
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JP
Japan
Prior art keywords
wire
bonding
bond point
pad
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004084048A
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English (en)
Japanese (ja)
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JP2005159267A5 (enExample
Inventor
Tatsunari Mitsui
竜成 三井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
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Shinkawa Ltd
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Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004084048A priority Critical patent/JP2005159267A/ja
Priority to US10/978,553 priority patent/US20050092815A1/en
Publication of JP2005159267A publication Critical patent/JP2005159267A/ja
Publication of JP2005159267A5 publication Critical patent/JP2005159267A5/ja
Priority to US11/582,665 priority patent/US20070029367A1/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/07553—
    • H10W72/531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/951—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2004084048A 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法 Pending JP2005159267A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004084048A JP2005159267A (ja) 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法
US10/978,553 US20050092815A1 (en) 2003-10-30 2004-11-01 Semiconductor device and wire bonding method
US11/582,665 US20070029367A1 (en) 2003-10-30 2006-10-16 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003370323 2003-10-30
JP2004084048A JP2005159267A (ja) 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JP2005159267A true JP2005159267A (ja) 2005-06-16
JP2005159267A5 JP2005159267A5 (enExample) 2006-07-27

Family

ID=34554743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004084048A Pending JP2005159267A (ja) 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法

Country Status (2)

Country Link
US (2) US20050092815A1 (enExample)
JP (1) JP2005159267A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100808510B1 (ko) * 2005-06-28 2008-02-29 가부시키가이샤 신가와 와이어 본딩 방법
JP2008098549A (ja) * 2006-10-16 2008-04-24 Kaijo Corp 半導体装置
JP2011176280A (ja) * 2010-01-27 2011-09-08 Shinkawa Ltd 半導体装置の製造方法並びにワイヤボンディング装置
US9263418B2 (en) 2014-03-12 2016-02-16 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
CN105977174A (zh) * 2016-07-07 2016-09-28 力成科技（苏州）有限公司 指纹产品封装结构的金线打线方法
KR20170073003A (ko) * 2015-12-17 2017-06-28 삼성전자주식회사 반도체 장치의 강화된 강성을 갖는 전기적 연결부 및 그 형성방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1722409B1 (en) 2005-05-09 2012-08-08 Kaijo Corporation Wire bonding method
US8016182B2 (en) 2005-05-10 2011-09-13 Kaijo Corporation Wire loop, semiconductor device having same and wire bonding method
CH697970B1 (de) * 2006-03-30 2009-04-15 Oerlikon Assembly Equipment Ag Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke.
TWI506710B (zh) * 2009-09-09 2015-11-01 瑞薩電子股份有限公司 半導體裝置之製造方法
WO2013049965A1 (en) * 2011-10-08 2013-04-11 Sandisk Semiconductor (Shanghai) Co., Ltd. Dragonfly wire bonding
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) * 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5172851A (en) * 1990-09-20 1992-12-22 Matsushita Electronics Corporation Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
DE69737621T2 (de) * 1996-10-01 2007-12-20 Matsushita Electric Industrial Co., Ltd., Kadoma Halbleiterelement mit einer Höckerelektrode
JP3344235B2 (ja) * 1996-10-07 2002-11-11 株式会社デンソー ワイヤボンディング方法
JP2000082717A (ja) * 1998-09-07 2000-03-21 Shinkawa Ltd ワイヤボンディング方法
JP3584930B2 (ja) * 2002-02-19 2004-11-04 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP3573133B2 (ja) * 2002-02-19 2004-10-06 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
KR20030075860A (ko) * 2002-03-21 2003-09-26 삼성전자주식회사 반도체 칩 적층 구조 및 적층 방법
US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
JP2004172477A (ja) * 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
KR100536898B1 (ko) * 2003-09-04 2005-12-16 삼성전자주식회사 반도체 소자의 와이어 본딩 방법
US7494042B2 (en) * 2003-10-02 2009-02-24 Asm Technology Singapore Pte. Ltd. Method of forming low wire loops and wire loops formed using the method
US7064433B2 (en) * 2004-03-01 2006-06-20 Asm Technology Singapore Pte Ltd Multiple-ball wire bonds
US7214606B2 (en) * 2004-03-11 2007-05-08 Asm Technology Singapore Pte Ltd. Method of fabricating a wire bond with multiple stitch bonds
JP4298665B2 (ja) * 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100808510B1 (ko) * 2005-06-28 2008-02-29 가부시키가이샤 신가와 와이어 본딩 방법
JP2008098549A (ja) * 2006-10-16 2008-04-24 Kaijo Corp 半導体装置
WO2008047665A1 (fr) * 2006-10-16 2008-04-24 Kaijo Corporation Dispositif semi-conducteur
JP2011176280A (ja) * 2010-01-27 2011-09-08 Shinkawa Ltd 半導体装置の製造方法並びにワイヤボンディング装置
US8123108B2 (en) 2010-01-27 2012-02-28 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus
US8196803B2 (en) 2010-01-27 2012-06-12 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus
US9263418B2 (en) 2014-03-12 2016-02-16 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
KR20170073003A (ko) * 2015-12-17 2017-06-28 삼성전자주식회사 반도체 장치의 강화된 강성을 갖는 전기적 연결부 및 그 형성방법
KR102443487B1 (ko) 2015-12-17 2022-09-16 삼성전자주식회사 반도체 장치의 강화된 강성을 갖는 전기적 연결부 및 그 형성방법
CN105977174A (zh) * 2016-07-07 2016-09-28 力成科技（苏州）有限公司 指纹产品封装结构的金线打线方法

Also Published As

Publication number Publication date
US20070029367A1 (en) 2007-02-08
US20050092815A1 (en) 2005-05-05

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